• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.1
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• pp.25-29
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• 2002

There is an increasing interest in high-speed signal processing in modern telecommunication and SC circuit, HDTV, ISDN. There are many methods of high-speed signal processing. This paper describes a design approach for the realization of high-frequency Op-amp in CMOS technology. A limiting factor in Op-amp based analog integrated circuits is the limited useful frequency range. this thesis will develop a CMOS op-amp architecture with improved gainband width product with this technique an op-amp will achieve up to 170MHz (CL=2pF) unity-gain frequency with a 1.2-micron design rule. This CMOS op-amp is particularly suitable for achieving wide and stable closed-loop band widths, such as required in high-frequency SC filters, high-speed analog circuits.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.05a
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• pp.765-767
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• 2014

본 논문에서는 단거리 레이더용 차량 추돌 방지 24-GHz CMOS 고주파 전력 증폭기 (RF Power Amplifier)를 제안한다. 이러한 회로는 class-A 모드 증폭기로서 단간 (inter-stages) 공액 정합 (conjugate matching) 회로를 가진 공통-소스 단으로 구성되어 있다. 칩 면적을 줄이기 위해 실제 인덕터 대신 전송선(Transmission Line)을 이용하였다. 제안한 회로는 TSMC $0.13{\mu}m$ 혼성 신호/고주파 CMOS 공정 ($f_T/f_{MAX}=120/140GHz$)으로 설계하였다. 설계한 CMOS 고주파 전력 증폭기는 최근 발표된 연구결과에 비해 약 22dB의 높은 전력이득 및 7.1%의 높은 PAE 특성을 보였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.22.1-22.1
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• 2009

차세대 CMOS 공정에서 유전상수가 높은 게이트 절연막과 함께 게이트 전극이 관심을 끌고 있다. 게이트 전극은 전도도가 높아야 하고 p-MOS, n-MOS에 맞는 일함수를 가져야 하며 열적 특성이 안정해야 한다. 탄탈룸 계열 탄화물이나 질화물은 게이트 전극으로 관심을 끌고 있는 물질이며 이를 원자층 화학증착법으로 박막화 하는 공정이 관심을 끌고 있다. 원자층 화학공정에서는 전구체의 역할이 중요하며 이의 기상반응 메카니즘, 표면 반응 메카니즘을 제대로 이해해야 한다. 본 연구에서는 TBTDET (tert-butylimido tris-diethylamido tantalum) 전구체의 반응 메커니즘을 FTIR(Fourier Transform Infrared)을 이용해 진단하였다. 또한 수소, 암모니아, 메탄을 이용한 열화학 원자층 증착, 플라즈마 원자층 증착 공정을 수행하여 박막을 얻고 이들의 특성을 평가하였다. 각 공정에 따라 반응 메커니즘이 달라지고 박막의 조성이 달라지며 또한 박막의 물성도 달라진다. 특히 박막에 형성되는 TaC, TaN, Ta3N5, Ta2O5 (증착 후 산소의 유입에 의해 형성됨) 등의 조성이 공정에 따라 달라지며 박막의 물성도 달라진다. 반응메카니즘의 연구를 통해 각 공정에서 어떠한 조성의 박막이 얻어지는 지를 규명하였고 박막의 밀도에 따라 산소유입량이 어떻게 달라지는 지를 규명하였다.

• Journal of IKEEE
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• v.11 no.1 s.20
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• pp.69-76
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• 2007

This paper presents the design of LVDS (Low-Voltage-Differential-Signaling) transmitter for Gb/s-per-pin operation. The proposed LVDS transmitter is designed using BiCMOS technology, which can be compatible with CMOS technology. To reduce chip area and enhance the robustness of LVDS transmitter, the MOS switches of transmitter are replaced with lateral bipolar transistor. The common emitter current gain($\beta$) of designed bipolar transistor is 20 and the cell size of LVDS transmitter is $0.01mm^2$. Also the proposed LVDS driver is operated at 1.8V and the maximum data rate is 2.8Gb/s approximately In addition, a novel ESD protection circuit is designed to protect the ESD phenomenon. This structure has low latch-up phenomenon by using turn on/off character of P-channel MOSFET and low triggering voltage by N-channel MOSFET in the SCR structure. The triggering voltage and holding voltage are simulated to 2.2V, 1.1V respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.12
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• pp.8-14
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• 2008

A fully CMOS-integrated carbon nanotube (CNT) sensor array is proposed. After the sensor chip is fabricated in commercial CMOS process, the CNTs network is formed on the top of the fabricated sensor chip through the room-temperature post-CMOS processes. When the resistance of the CNT is changed by the chemical reaction, the read-out circuit in the chip measures the charging time of the $R_{CNT}$-Capacitor. finally the information of measured frequency is converted to a digital code. The CMOS sensor chip was fabricated by standard 0.18um technology and the size of the $8{\times}8$ sensor array is $2mm{\times}2mn$. We have carried out an experiment detecting the biochemical material, glutamate, using this sensor chip. From the experiment the CMOS sensor chip shows the feasibility of sensor for the simultaneous detection of the various target materials.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.4
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• pp.65-72
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• 2013

This paper presents design methodology for Memristor-CMOS circuits and its application to primitive IPs design. We proposed a Memristor model and designed basic elements, Memristor AND/OR gates. The primitive IPs based on a Memristor-CMOS technology is proposed for a Memristive system design. The netlists of IPs are extracted from the layouts of Memristor-CMOS and is verified with SPICE-like Memristor model under $0.18{\mu}m$ CMOS technology. As a result, an example design Memristor-CMOS full adder has only 47.6 % of silicon area compare to the CMOS full-adder.

• Journal of IKEEE
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• v.3 no.2 s.5
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• pp.226-235
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• 1999

To investigate SPICE noise model and the behavior of its parameters, 1/f noise of NMOS devices fabricated by BiCMOS process is measured and compared to the various noise models and measured results. For the long channel devices, bias dependence of the drain current noise power spectral density $S_{Id}$ of NMOS is similar to the previous results. Equivalent gate noise power spectral density $S_{Vg}$ shows weak dependence on the gate and drain voltages in long channel NMOS as the previous results. However, it is shown that most of published noise models are difficult to apply to short channel devices. Therefore, in this study, with comparison of our experimental results, we have tried to find the model of 1/f noise, appropriate for our NMOS device fabricated by BiCMOS process.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.5
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• pp.46-54
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• 1984

A silicon-gate n-well CMOS process with 3 $\mu$m gate length was developed and its possibility for the applications was discussed,. Threshold voltage was easily controlled by ion implantation and 3-$\mu$m gate length with 650 $\AA$ oxide shows ignorable short channel effect. Large value of Al-n+ contact resistance is one of the problems in fabrications of VLSI circuits. Transfer characteristics of CMOS inverter is fairly good and the propagation delay time per stage in ring oscillator with layout of (W/L) PMOS /(W/L) NMOS =(10/5)/(5/5) is about 3.4 nsec. catch-up occurs on substrate current of 3-5 mA in this process and critically dependent on the well doping density and nt-source to n-well space. Therefore, research, more on latch-up characteristics as a function of n-well profile and design rule, especially n+-source to n-well space, is required.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.6
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• pp.25-34
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• 2000

This paper describes design of a 250-Mbps 10-channel optical receiver array for parallel optical interconnection with the general-purpose CMOS technology The optical receiver is one of the most important building blocks to determine performance of the parallel optical interconnection system. The chip in CMOS technology makes it possible to implement the cost-effective system also. Each data channel consists of analog front-end including the integrated photo-detector and amplifier chain, digital block with D-FF and off-chip driver. In addition, the chip includes PLL (Phase-Lock Loop) for synchronous data recovery. The chip was fabricated in a 0.65-${\mu}{\textrm}{m}$ 2-poly, 2-metal CMOS technology. Power dissipation of each channel is 330㎽ for $\pm$2.5V supply.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.7
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• pp.784-790
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• 2012

In this paper, an all-digital CMOS ultra-wideband(UWB) pulse generator for high band(6~10 GHz) frequency range is presented. The pulse generator is designed and implemented with extremely low power and low complexity. It is designed to meet the FCC spectral mask requirement by using Gaussian pulse shaping circuit and control the center frequency by using CMOS delay line with shunt capacitor. Measurement results show that the center frequency can be controlled from 4.5 GHz to 7.5 GHz and pulse width is 1.5 ns and pulse amplitude is 310 mV peak to peak at 10 MHz pulse repetition frequency(PRF). The circuit is implemented in 0.13 um CMOS process with a core area of only $182{\times}65um^2$ and dissipates the average power of 11.4 mW at an output buffer with 1.5-V supply voltage. However, the core consumes only 0.26 mW except for output buffer.