• Proceedings of the Korean Society of Fisheries Technology Conference
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• 2003.05a
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• pp.309-310
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• 2003

현재 어류 질병 바이러스를 검출해내기 위해 이용되는 PCR법이나 ELIZA법 만으로는 신속성을 필요로 하는 바이러스 검출에서는 불리하다(Bruchhof et. al., 1995). 따라서 기존의 유전자 진단법을 대체할 수 있고, 동시에 수백 개 이상의 유전자를 빠른 시간 내에 검색할 수 있는 DNA chip 기술을 이용하여 넙치, 돔등의 해산어와 일부 연어과 어류에 질병을 일으키는 rhabdovirus를 신속하고 정확하게 진단할 수 있는 저밀도 oligonucleotide chip을 개발하고자 한다(Chizhikov et at., 2001). (중략)

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• Journal of the Korean Society of Safety
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• v.16 no.2
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• pp.22-26
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• 2001

The machining process on be considered as a planned interaction of the workpiece, the tool and the machine tool. In an unmanned situation, the results of this interaction are to be continuously monitored so that any changes in the machining environment on be sensed to corrective actions. In order to design the process monitoring system for unmanned manufacturing, the identification of chip formation is proposed. The system proposes the method of using acoustic emission(AE) signal analysis to identify the chip formation during cutting.

• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• v.2B no.4
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• pp.207-213
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• 2002

The paper introduces a switched reluctance motor drive system based on an 80C31 and an Intel 80C 196KB single-chip microprocessor control. Advance schemes are used in turn-on and turn-off angles with the power converter's main switches during traction and regenerative braking. The principles of traction speed control and braking torque control are given. The hardware and software patterns in the 80c31 and the Intel 80C196KB single-chip microprocessor control system are also presented.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.53 no.3
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• pp.129-133
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• 2004

As In DS/CDMA(direct sequence code division multiple access) system, the system capacity is limited by multiple access interference(MAI), and self-interference(SI) resulting from the multi-path propagation of the desired user signal. This paper, which the approximated analytic chip waveforms are nearly the same as the computer generated chip waveforms are shown. And then, the BER(Bit Error Rate) performances in CDMA system using the approximated analytic chip waveforms are shown.

• Journal of Animal Science and Technology
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• v.48 no.3
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• pp.401-414
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• 2006

Twenty eight Holstein steers 12 months old and weighing about 300kg were andomly allotted into one of four groups being fed ammoniated rice straw(ARS) and substituted 30%, 40% and 50% crushed bamboo chip for ARS to determine the effects of different levels of bamboo chip on performance, digestibility and carcass characteristics. Daily weight gain was reduced as the substitution levels of bamboo chip for ARS as a roughage source increased but there were no differences in daily weight gain between steers fed ARS alone and 30% bamboo chip for ARS. Concentrates intakes were not different between treatments by the substitution levels of bamboo chip for the whole fattening period. Roughage intake tended to increase as the substitution levels of bamboo chip increased. Total feed intake was not affected by the substitution levels of bamboo chip. However, feed efficiency got worse with increasing levels of bamboo chip. Animals fed the roughage substituting 30% bamboo chip for ARS were higher in profit by 13% than animals fed ARS alone as a roughage source. Digestibilities of Dry matter(DDM) and crude fiber(DCF) were highest in animals fed ARS alone as a roughage source. DDM's were lower in higher substitution levels of crushed bamboo chip but there were no differences in DCF among animals fed different levels of bamboo chip as a roughage source. Crude protein digestibility was not affected by ammoniated rice straw or by the different levels of bamboo chip. Dressing percentage and backfat thickness were not affected by ammoniated rice straw or by the levels of bamboo chip but ribeye area was narrowed as the levels of bamboo chip increased. Beef color, fat color, texture, maturity and marbling score were not affected by feeding of ammoniated rice straw or by the levels of bamboo chip. According to these results, it may be concluded that profit can increase when Holstein bulls are castrated and roughage containing ammoniated rice straw plus 30% bamboo chip is offered.

• Korean Journal of Food Science and Technology
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• v.29 no.4
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• pp.635-640
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• 1997

The oxidative stability of the potato chip prepared with canola oil fortified with antioxidnats was studied to explore the possibility of substituting it for imported frying fats and oils. BHT, BHA, TBHQ and silicone were added to the oil at a level of 0.02% and 10 ppm, respectively. Potato chip samples were prepared in a commercial scale and stored at $25.0{\pm}0.5^{\circ}C$ for 5 months. The oxidative stability of the extracted oils from potato chips during storage was estimated on the basis of some their physico-chemical changes, such as acid values, peroxide values, iodine values, ansidine values, fatty acid composition of the oils. An organoleptic test for the flavor of the samples was also performed. The oxidative stability of the samlpes was estimated on the basis of the changes of the parameter values. The effectiveness of the antioxidants was in the order of canola oil+TBHQ (0.02%)+silicone (10 ppm) > canola oil+TBHQ (0.02%) > canola oil+BHA (0.02%)+silicone (10 ppm) > canola oil+BHT (0.02%)+silicone (10 ppm) > canola oil+BHA (0.02%) > canola oil+BHT (0.02%) > canola oil. The antioxidant effect of canola oil+TBHQ (0.02%)+silicone (10 ppm) was more salient than any other antioxidant used in the potato chip.

• Korean Journal of Food Science and Technology
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• v.14 no.4
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• pp.364-369
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• 1982

Two varieties of potatoes, Irish cobbler and Shimabara stored for seven and nine months respectively by irradiation combined with natural low temperature (year-round temperature change:$2{\sim}17^{\circ}C)$ on a batch scale were investigated on the suitability for processing of potato chip. Nine months after storage, irradiated potatoes (Irish cobbler) tended to maintain somewhat-better texture and sensory quality than untreated in potato chip processing. Peel rate, closely related to potato chip yield, of untreated potatoes were $20{\sim}25%$ higher than those of irradiated and Agtron color determination of potato chip from both irradiated were commercially acceptable. Preservation of potatoes by irradiation combined with natural low temperature was evaluated as an alternative method of the supply for raw materials of potato chip processing in the off season in Korea.

• Journal of Welding and Joining
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• v.26 no.3
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.