• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.5
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• pp.146-152
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• 1998

Recently, for the development of vehicle structures and components there is a tendency to increase using numerical simulation methods compared with practical tests for the estimation of the fatigue strength. In this study, an integrated powerful methodology is suggested for fatigue strength evaluation through development of the interface program to integrate dynamic analysis quasi-static stress analysis and fatigue analysis, which were so far used independently. To verify the presented evaluation method, a single and zigzag bump run test, 4-post road load simulation and driving durability test have been performed. The prediction results show a good agreement between analysis and test. This research indicates that the integrated life prediction methodology can be used as a reliable design tool in the pre-prototype and prototype development stage, to reduce the expense and time of design iteration.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.870-874
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• 2004

This paper presents a three dimensional modeling and simulations of operation and running of a wheel loader using the ADAMS program. A wheel loader consists of a bucket, a boom, a crank, a front frame, a rear frame, a bucket cylinder, two boom cylinders, two steering cylinders, nine spherical joints, six universal joints, five translation joints, three inline joints, a revolute and a fixed joint. Judging from the actual degrees of freedom of the wheel loader, proper kinematic joints are selected to exclude redundant constraints in the modeling. Through the running simulation over a bump with the three dimensional modeling, the joint reaction forces are calculated.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.3
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• pp.661-669
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• 1999

A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.

• Journal of Drive and Control
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• v.13 no.2
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• pp.10-18
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• 2016

A front-end loader (FEL) mounted on an agricultural tractor is one of the most commonly used implements to mechanize routine agricultural tasks. When the FEL is used with a loaded bucket, careful operation is required to maintain safety and avoid spillage when the tractor passes a bump because a change in the gravity center of the tractor due to varied loadings can affect the stability of the tractor. Use of a boom suspension system consisting of accumulators and orifice dampers can be instrumental in reducing pitching vibrations while increasing the handling performance of the FEL-mounted tractor. The objective of this research was to reduce bump shocks by adding an orifice and a flow control valve to the original hydraulic circuit composed solely of accumulators. A simulation study was performed using the SimulationX program to investigate the effects of an accumulator and an orifice-throttle damper on bump shocks. Results showed that the peak pressure on a boom cylinder and the vertical acceleration of a bucket were significantly affected by use of both an accumulator and an orifice damper. In a field test conducted with a 75-kW tractor, the peak pressure of the boom cylinder, and the root mean square (RMS) vertical acceleration of the bucket and seat were reduced by on average, 23.0, 42.2, and 44.9% respectively, as compared to those measured with the original accumulator system, showing that an improved design for the accumulator hydraulic circuit can reduce bump shocks. Further studies are needed to design a tractor suspension system that includes the effects of cabin suspension and tires as well as dynamic analysis.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.4
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• pp.759-764
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• 2012

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N at thermo-compression process. Through the simulation work, it was proved that the CPTB decreased in its size of conduction area as time passes, however it was largely affected by the copper oxidation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.726-729
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• 2010

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.05a
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• pp.133-137
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• 2009

Numerical simulations of flows in an axisymmetric supersonic inlet with bleed regions were performed. For the simulations, the existing code which solves the RANS(Reynolds Averaged Navier-Stokes) equations and 2-equation turbulence model equations was transformed to axisymmetric form and bleed boundary condition was applied to the code. In this paper, the modified code was validated by comparing the results against an experimental data and other computational results for flow on a bump and over an oblique shock with bleed region. Using the code, numerical simulations were performed for the flow in the inlet with multiple bleed regions.

• Tribology and Lubricants
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• v.16 no.4
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• pp.295-301
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• 2000

The dynamic simulation of slider in hard disk drive is performed using Factored Implicit Finite Difference method. The modified Reynolds equation with Fukui and Kaneko model is employed as a governing equation. Equations of motion for the slider of three degrees of freedom are solved simultaneously with the modified Reynolds equation. The transient responses of the slider for disk step bumps and slider impulse forces are shown for various cases and are compared for the iteration algorithm and new algorithm.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.55-61
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• 2010

The device with tantalum silicide heater were bonded by Ag paste and Au SBB(Stud Bump Bonding) onto the Au coated substrate. The shear test after Au ABB and the thermal performance under current stressing were measured. The optimum condition of Au SBB was determined by fractured surface after die shear test and $350^{\circ}C$ for substrate, $250^{\circ}C$ for die during flip chip bonding with bonding load of about 300 g/bump. With applying 5W through heater on the device, the maximum temperature with Ag paste bonding was about $50^{\circ}C$. That with Au SBB on Au coated Si substrate showed $64^{\circ}C$. The difference of maximum temperatures is only $14^{\circ}C$, even though the difference of contact area between Ag paste bonding and Au SBB is by about 300 times and the simulation showed that the contact resistance might be one of the reasons.

• Journal of Electrical Engineering and Technology
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• v.12 no.4
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• pp.1449-1455
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• 2017

The vector control technique using low-resolution Hall-effect sensors has been widely used especially in consumer electronics. Due to electrical and/or mechanical unevenness related to binary-type Hall sensors, the calculated or estimated position information has discontinuities so called bumps, which causes the deterioration of vector control performance. In order to obtain a linearly changing position signal from low-precision Hall-effect sensors, this paper proposes a simple bumps in position signal removal algorithm that consists of a first-order observer with low-pass filtering scheme. The proposed algorithm has the feature of no needs for system parameters and additional estimation processes. The validity of the proposed method is verified through simulation and experimental results.