• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.257-262
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• 2005

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.33-38
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• 2004

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• Journal of the Korea Concrete Institute
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• v.11 no.3
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• pp.13-21
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• 1999

Recently, many strengthening methods are developed to repair damaged structures, especially, steel plate or carbon fiber sheet bonding methods are widely used. For the bonding methods, the strengthening materials are bonded when the original structure is under loading, with causes the difference of initial stresses between original member and bonded material. However, current design method or theory, which mostly depends on ultimately strength design, cannot account the difference of initial stresses between members, and it disregards the reduction of nominal strength. In this study, a new strengthening design theory and program which can account the difference of initial stresses are developed, and applied to the case when a structure in service is repaired. In order to verify the validity of the theory and the program, a test result is referred and compare with the results and it is showed that the calculated values are almost same as the referred data and finally proved that the program is reliable. The results showed that the amount of strengthening material depends on the status of damages of structure, and the nominal strength is reduced depending on the degree of damages.

• Journal of the Korea Concrete Institute
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• v.11 no.3
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• pp.35-45
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• 1999

Recently, many strengthening methods are developed to repair damaged structures, especially, steel plate or carbon fiber sheet bonding methods are widely used. For the bonding methods, the strengthening materials are bonded when the original structure is under loading, which causes difference of initial stresses between original member and bonded material. However, current design method or theory, which mostly depends on ultimately strength design, cannot account the difference of initial stresses between members, and it disregards the reduction of nominal strength. In this study, a new strengthening design theory and program which can account the difference of initial stresses are developed, and applied to the case when a structure in service is repaired. In order to verify the validity of the theory and the program, a test result is referred and compared with the results and it is showed that the calculated values are almost same as the referred data and finally proved that the program is reliable. The results showed that the amount of strengthening material depends on the status of damages of structure, and the nominal strength is reduced depending on the degree of damages.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.759-762
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• 2000

Present transistors which have vertical structure show increased parasitic capacitance characteristics in accordance with the increase of non-active base area and collector area, consequently have disadvantage for high speed switching performance. In this paper, a horizontal structure transistor which has minimized parasitic capacitance in virtue of SDB(Silicon Direct Bonding) wafer and oxide sidewall isolation utilizing silicon trench technology is presented. Its structural characteristics were designed by ATHENA(SUPREM4), the process simulator from SILVACO International, and its performance was proven by ATLAS, the device simulator from SILVACO International. The performance of the proposed horizontal structure transistor was certified through the VCE-lC characteristics curve, $h_{FE}$ -IC characteristics, and GP-plot.

• Membrane Journal
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• v.19 no.4
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• pp.310-316
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• 2009

The degradation characteristics of cross-linked lactide/hyaluronic acid (LA/HA) membranes were investigated for purpose of applying to tissue engineering. The lactide/hyaluronic acid cross-linked with 1,3-butadiene diepoxide (BD) and 1-ethyl-3-(3-dimethyl aminopropyl) carbodiimide (EDC) was degradated in deionized water in water bath at $37^{\circ}C$. As the LA/HA mole ratio or crosslinking agent concentration decreased, the degradation rate of the crosslinked membranes increased. In order to investigate the structure change of the membrane in the degradation process, the control sample and 3, 6, 9 days-degradated samples were analysed by the nuclear magnetic resonance spectroscopy. In case of the membranes crosslinked with EDC, the HA-EDC bonding structure was degradated slowly whereas the HA-LA bonding structure was degradated quickly and dissappeared completely after 6 days. In case of the membranes crosslinked with BD, all the crosslinked bonding structure degradated slowly. The HA-BD bonding structure maintained its original state about 89, 83% in case of 3, 6 days-degardated samples respectively whereas the HA-LA bonding structure maintained its original state about 83, 65%. The scanning electron microscopy of the degradated membranes showed that the pore density in the surface, and the structure in the surface and cross section, of the before and after-degradation membranes did not change greatly, so the membranes was shown to be applied to materials for tissue engineering.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.3
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• pp.328-335
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• 2000

Statement of the problem. Recently an innovative method of fabricating indirect restorations by gold electroforming has been developed. But the bond quality and strength of the gold coping to the porcelain is uncertain. Purpose of study. The purpose of this study is to analyze and evaluate the electroformed gold surface for mechanical bonding between the gold and the ceramic veneering. Methods/material. Electroformed disks were made using electroforming technique. And the surface of the electroformed coping was analyzed after sandblasting, heat-treatment, bonding agent application, opaque porcelain firing with scanning electron microscopy and energy dispersive x-ray analysis. Results. In the analysis with SEM, Sandblasting made the sharp edges and undercuts on the electroformed surface, and after bonding agent application, net-like structure were created on the electroformed surface. In the energy dispersive x-ray analysis it is confirmed that electroformed surface contains some impurities. Conclusion. With the use of sandblasting and bonding agent, electroformed surface seems to be enough to bond with veneering porcelain.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.4
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• pp.250-254
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• 2016

In this paper, solar-cell modules were fabricated by low-temperature bonding method of construction using CF. CF adhesive strength of cells at 180 degree using 3bus bar structure was measured average 2.4N. As the bonding temperature got higher, Voc and Iscwas increased. And at $185^{\circ}C$, Rseries was measured 0.013[${\Omega}$] which is the highest point. At $185^{\circ}C$, 2N and 6sec in bonding time, $P_{max}$ was measured 3.954[W], fillfactor was measured 67.36[%] and efficiency was measured13.178[%] the highest point.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.5-9
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• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• Bulletin of the Korean Chemical Society
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• v.32 no.6
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• pp.1879-1883
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• 2011

The electronic structure and bonding in $Ti_2Pd$ and $Pd_2Ti$ alloys with and without hydrogen as an interstitial atom were studied by performing extended Huckel tight-binding band calculations. The hydrogen absorption near an octahedral site is found to be a favorable process in $Ti_2Pd$ rather than in $Pd_2Ti$. In metal hydrides, the metal-hydrogen bonding contribution is crucial to the stability of the system. The stronger interaction of hydrogen with Ti atoms in $Ti_2PdH_2$ than with Pd atoms in $Pd_2TiH_2$ is analyzed by perturbation theory.