• The Journal of Advanced Prosthodontics
• /
• 제6권4호
• /
• pp.295-301
• /
• 2014

PURPOSE. Numerous methods were used to etch the fiber posts to improve its bonding to root canal dentin. Our aim was to evaluate the efficacy of 37% phosphoric acid in etching fiber posts in comparison with 24% hydrogen peroxide. MATERIALS AND METHODS. Ninety human maxillary central incisors were taken and post space preparation was done. Ninety fiber posts were taken and divided into three groups (n=30) based on the surface treatment they received ($H_3PO_4$, $H_2O_2$, distilled water) and each group was further divided (n=10) based on the time period of application (15 seconds, 30 seconds, 60 seconds). All the posts were luted into canals using Rely X UniCem-2. Each tooth was then sectioned into six slices and subjected to push out test. Data obtained was subjected to statistical analysis at P<.05. The surface topography was evaluated using scanning electron microscopy. RESULTS. Highest bond strength values were noted in 15 seconds etched phosphoric acid group and 60 seconds etched hydrogen peroxide group with no significant difference between two groups. Surface topography revealed complete epoxy layer removal with no damage to its structural integrity in those groups. CONCLUSION. $H_3PO_4$ etching for a period of 15 seconds is an effective alternative in improving the adhesion of fiber post to root dentin.

• 한국광물학회지
• /
• 제14권2호
• /
• pp.119-127
• /
• 2001

주구성 양이온이 Si와 Al인 딕카이트와 엽납석에 대하여 적외선분광분석(FTIR)을 실시하였다. 원적외선(Far-IR)영역과 중간적외선(Mid-IR)영역을 이용하였으며, 특히 $200 cm^{-1}$ / 이하의 Far-IR영역에서 처음으로 딕카이트의 흡수선들을 제시하였다. 딕카이트의 경우 일부 시료에서 소량의 카올리나이트나 나크라이트 층이 소량으로 협재되어 있다. 카올리나이트의 결정도를 나타내는 Hinckley지수는 딕카이트의 결정도와는 관련성이 적게 나타났다. 엽납석의 경우, 수산기와 관련된 신축진동흡수띠($3673~3676 cm^{-1}$ )는 약간 이상적인 구조에서 벗어나 있는데, 아마도 미량의 철에 의한 영향이나, 삼사형과 단사형이 섞여 있기 때문인 것으로 보인다.

• 한국문화재보존과학회:학술대회논문집
• /
• 한국문화재보존과학회 2002년도 제15회 발표논문집
• /
• pp.21-31
• /
• 2002

고건축물에서 구조재, 결합재, 방수재, 마감재 등의 용도로 매우 중요하게 사용된 강회다짐 재료에 관한 사용기록을 정리하고 문화재 보수 및 복원시 현장에서 느끼는 강회다짐재의 사용상 문제점을 검토하여 다음과 같은 개선방안을 제언한다. 1) 생석회를 현장에서 피우는 과정에서 발생하는 품질의 균일성에 관한 문제점을 보완하기 위해서는 강회다짐용 재료로 순도 높은 소석회를 사용하는 것이 바람직하다. 2) 강회시공시 발생하는 품질의 불균일성을 고려하여 균일한 혼합을 위한 믹서, 계량시의 오차를 줄이기 위한 Premix형태의 강회다짐재 및 다짐작업의 균일성을 확보하기 위한 다짐기계의 사용을 적극적으로 검토하여야 한다. 3) 지붕 강회다짐충의 해체 및 시공시 추가적인 구조물의 손상을 방지하기 위해서 적절한 가설구조물의 사용을 의무화 하여야 한다. 4) 문화재 수리 표준 품셈과 문화재 수리 표준 시방서에 규정된 재료 및 시공절차에 관한 내용을 구체적이고 명확히 규정할 필요성이 있다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
• /
• pp.106-106
• /
• 2000

반도체 소자가 미세화 됨에 따라 게이트 유전막으로 사용되는 SiO2의 박막화가 요구되나, boron penetration에 의한 Vt shift, 게이트 누설전류, 다결정 실리콘 게이트의 depletion effect 그리고 quantum mechanical effect 때문에 ~20 급에서 한계를 나타내고 있다. 이에 0.1$\mu\textrm{m}$이상의 design rule을 갖는 logic이나 memory 소자에서 요구되어지는 ~10 급 게이트 산화막은 SiO2(K=3.9)를 대신하여 고유전율을 갖는 재료의 채택이 필수 불가결하게 되었다. 고유전 박막 재료를 사용하면, 두께를 두껍게 해도 동일한 inversion 특성이 유지되고 carrier tunneling 이 덜하여 등가 산화막의 두께를 줄일 수 있다. 이러한 고유전박막 재료중 가장 활발히 연구되고 있는 재료는 Ta2O5, Al2O3, STO 그리고 BST 등이 있으나 Ta2O5, STO, BST 등은 실리콘 기판과 직접 반응을 한다는 문제를 가지고 있으며, Al2O3는 유전율이 낮의 재료가 최근 주목받고 있다. 본 실험에서는 ZrO2, HfO2 또는 그 silicates 등의 재료가 최근 주목 받고 있다. 본 실험에서는 ZrO2 박막의 증착조건에 따른 물리적, 전기적 특성 변화에 대하여 연구하였다. RCA 방식으로 세정한 P-type (100) 실리콘 기판위에 reactive DC sputtering 방법으로 압력 5mtorr, power 100~400W, 기판온도는 100-50$0^{\circ}C$로 변화시켜 ZrO2 박막을 증착한 후 산소와 아르곤 분위기에서 400-80$0^{\circ}C$, 10-120min으로 열처리하였다. 증착직후의 시편들과 열처리한 ZrO2 박막의 미세구조와 전기적 특성 변화를 관찰하였다. 우선 굴절율(RI)를 이용해 ZrO2 박막의 밀도를 예측하여 power와 기판온도에 따라 이론값 2.0-2.2 에 근접한 구조를 얻은 후 XRD, XPS, AFM, 그리고 TEM을 사용하여 ZrO2 박막의 chemical bonding, surface roughness 그리고 interfacial layer의 특성을 관찰하였다. 그리고 C-V, I-V measurement를 이용해 capacitance, 유전율, 누설전류 등의 전기적 특성을 관찰해 최적 조건을 설정하였다.

• 한국물환경학회지
• /
• 제36권1호
• /
• pp.48-54
• /
• 2020

This paper presents a screening protocol for the selection of solvents available for the solvent extraction desalination process. The desalination solvents hypothetically and theoretically require the capability of (1) Forming hydrogen bonds with water, (2) Absorbing some water molecules into its non-polar solvent layer, (3) Changing solubility for water-solvent separation, and (4) Rejecting salt ions during absorption. Similar to carboxylic acids, amine solvents are solvent chemicals applicable for desalination. The key parameter for selecting the potential solvent was the octanol-water partitioning coefficient (Kow) of which preferable value for desalination was in the range of 1-3. Six of the 30 amine solvents can absorb water and have a variable, i.e., temperature swing solubility with water molecule for water-solvent separation. Also, the hydrogen bonding interaction between solvent and water must be stronger than the ion-dipole interaction between water and salt, which means that the salt ions must be broken from the water and only water molecules absorbed for the desalination. In the final step, three solvents were selected as desalination solvents to remove salt ions and recover water. The water recovery of these three solvents were 15.4 %, 2.8 %, 10.5 %, and salt rejection were 76 %, 98 %, 95 %, respectively. This study suggests a new screening protocol comprising the theoretical and experimental approaches for the selection of solvents for the desalination method which is a new and challenges the desalination process in the future.

• 펄프종이기술
• /
• 제33권4호
• /
• pp.15-20
• /
• 2001

The function of the moisture-proof paper is to prevent moisture from adsorbing into the packed goods. Water-vapor transmission rate of the moisture-proof paper should be less than 100g/$m^2$.24hr and the optimum rate would be less than 50g/$m^2$.24hr. In general the moisture-proof paper has been made by laminating polyethylene or polypropylene on top of the base paper. However this kind of moisture-proof paper has a problem in recycling so that it brings about environmental pollution. In general the moisture-proof paper has been made by laminating polyethylene or polypropylene on top of the base paper. However this kind of moisture-proof paper has a problem in recycling so that it brings about environmental pollution. The purpose of this paper was to make moisture-proof paper using the mixture of SB latex and wax emulsion which was recyclable and environmentally friendly. Water vapor transmission rate showed less than 50g/$m^2$.24hr in mixture ratio of 85:15, 87:13, 90:10. Especially the mixture ratio of 87:13 showed the most favorable water-vapor transmission rate. However, the moisture-proof layer was destroyed slightly by folding in packing. It has been observed that there was no close relationship between water-vapor transmission rate of the moisture-proof paper and grammage of the base paper, but the density of base paper had influenced on water vapor transmission rate. It was also observed that the moisture-proof paper could be recycled. The moisture-proof paper was similar to base paper in degree of the pulping, and there was no significant difference in dispersion between moisture-proof paper and base paper. Most of wax particles which caused the spots during drying process could be removed by flotation process. Tensile strength and tear strength of both moisture-proof paper and base paper after pulping were measured to examine the fiber bonding, and no significant difference in physical properties was observed.

• 펄프종이기술
• /
• 제47권6호
• /
• pp.164-169
• /
• 2015

Nowadays blending ratio of OMG (old magazine) in recovered paper used for manufacturing newspaper have been increased. When large amount of OMG is consumed in newsprint mill, brightness can be improved by inorganic pigments of coating layer. On the other hand decrease in yield of deinking process will be encountered because the pigments can be removed as reject of froth flotation process. Therefore selection of the optimal deinking agent is an important. Non-ionic surfactant have been used widely in newsprint mill. Non-ionic surfactant has amphoteric characteristics. Hydrophilic group is ethylene and propylene oxide that can induce hydrogen bonding with water molecules. In this regard, cloud point is an important parameter in order to control efficiency of deinking process because hydration of the hydrophobic group can be varied according to temperature of a system. In this study, deinking properties of ONP at high blending ratio of OMG was analyzed according to cloud points of non-ionic surfactants. $L^*$, $a^*$, $b^*$, brightness and effective residual ink concentration did not affected by the change of cloud points. Especially, flotation reject decreased significantly according to increase in cloud point of the non-ionic surfactant. Consequently, when a nonionic surfactant having a cloud point higher than the temperature of the system is used, properties of the deinked pulp can be maintained and yield of deinking process can be improved.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.135-136
• /
• 2012

Carbon atoms near the surface of W(110) induce reconstructions such as $R(15{\times}12)$ -C/W(110) which consists of two characteristic parts, one square shaped and bright protrusion and two smaller ones. In the atomic resolution STM image, the bigger protrusion shows the periodicities of clean W(110), indicating that it is almost carbon poor region. The smaller protrusion contains hexagonal carbide surface layer of ${\alpha}$-W2C on W(110). Employing this carburized W(110) as templates, we grow Co and Fe clusters of less than ten atoms. Due to the selectivity of bonding sites, growth of larger cluster is highly unfavorable for Co and the size of clusters is very uniform. Since Co atoms prefer to sit on the bigger protrusion rather than smaller one, Co cluster can be arranged one-dimensionally in $R(15{\times}12)$-C/W(110) with quite uniform size distribution. However, Fe clusters sit on both sites without favored site, but still with uniform size distribution. On the other hand, Fe clusters can be grown with quasi one-dimensional order in $R(15{\times}3)$-C/W(110), which consists of only smaller protrusions. We investigate the magnetic properties of the ordered nano-sized clusters. Experiments using XMCD reveals little magnetic moment of Co cluster on $R(15{\times}12)$-C/W(110). This observation is consistent with the predictions of our first principles calculations that small Co clusters can be nonmagnetic or antiferromagnetic with low mean magnetic moment per atom.

• 센서학회지
• /
• 제11권1호
• /
• pp.54-59
• /
• 2002

본 논문은 Si기판 직접접합기술과 전기화학적 식각정지를 이용하여 마이크로 시스템용 매몰 공동을 갖는 SOI 구조물의 일괄제조에 대한 새로운 공정기술에 관한 것이다. 저비용의 전기화학적 식각정지법으로 SOI의 정확한 두께를 제어하였다. 핸들링 기판 위에서 Si 이방성 습식식각으로 공동을 제조하였다. 산화막을 갖는 두 장의 Si기판을 직접접합한 후, 고온 열처리($1000^{\circ}C$, 60분)를 시행하고 전기화학적 식각정지로 매몰 공동을 갖는 SDB SOI 구조를 박막화하였다. 제조된 SDB SOI 구조물 표면의 거칠기는 래핑과 폴리싱에 의한 기계적인 방법보다도 우수했다. 매몰 공동을 갖는 SDB SOI 구조는 새로운 마이크로 센서와 마이크로 엑츄에이터에 대단히 효과적이며 다양한 응용이 가능한 기판으로 사용될 것이다.

• 한국표면공학회지
• /
• 제36권5호
• /
• pp.373-378
• /
• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.