• Journal of the Korea institute for structural maintenance and inspection
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• v.12 no.1
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• pp.91-100
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• 2008

Multi-stepwise Thermal Prestressing Method(TPSM) is a newly proposed prestressing method, which is combined the external prestressing method and the external bonding method. Multi-stepwise thermal prestressing force is induced by cooling process of cover-plate in the multi-stepwise temperature distribution after the cover-plate being bolted to the girder. In this study, the heating capacity test of the developed heating system for applying the multi-stepwise TPSM effectively and multi-stepwise TPSM inducing test of H-beam is performed. Also, a field test of the rhamen type temporary bridge is carried out to evaluate the effect and application of the multi-stepwise TPSM. Truck load was loaded and compared with the structure analysis results.

• Applied Chemistry for Engineering
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• v.9 no.1
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• pp.76-81
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• 1998

Physical adsorption on a silica gel(pore size of 80 nm, particle size of $10{\mu}m$)has been studied for binary mixture of acetone diluted in $CO_2$ by use of a FTIR transmission technique and we have compared the result of FTIR transmission technique with that of a chromatographic technique. Measurements were made at 313.2 K and under pressures up to 15MPa. As the pressure increases from 0.1MPa, the IA(Integral Absorbance) of the hydrogen-bonded OH groups interacting with acetone and adsorbed amount by use of a chromatographic technique increases at first, and reaches a maximum at a pressure below the critical pressure of $CO_2$, and then the intensities decrease gradually with increasing pressure. It is found that the pressure dependency of the chromatographic isotherm is a little larger than that of spectroscopic isotherm in the supercritical fluid region. This difference might be attributable to the weaker van der Waals force and relatively stronger hydrogen-bonding force influencing the adsorption of acetone on the sllica gel. The unique spectroscopic characteristics of amine group which vibrational frequencies of hydroxyl groups on the silica gel surface shift downward to about $1300cm^{-1}$ were measured from experimental result of triethylamine diluted in $CO_2$ or $N_2$.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.2
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• pp.98-103
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• 2013

In this work, we investigated the enhanced performance of IZO-based TFTs with $HfSiO_x$ gate insulators. Four types of $HfSiO_x$ gate insulators using different diposition powers were deposited by co-sputtering $HfO_2$ and Si target. To simplify the processing sequences, all of the layers composing of TFTs were deposited by rf-magnetron sputtering method using patterned shadow-masks without any intentional heating of substrate and subsequent thermal annealing. The four different $HfSiO_x$ structural properties were investigated x-ray diffraction(XRD), atomic force microscopy(AFM) and also analyzed the electrical characteristics. There were some noticeable differences depending on the composition of the $HfO_2$ and Si combination. The TFT based on $HfSiO_x$ gate insulator with $HfO_2$(100W)-Si(100W) showed the best results with a field effect mobility of 2.0[$cm^2/V{\cdot}s$], a threshold voltage of -0.5[V], an on/off ratio of 5.89E+05 and RMS of 0.26[nm]. This show that the composition of the $HfO_2$ and Si is an important factor in an $HfSiO_x$ insulator. In addition, the effective bonding of $HfO_2$ and Si reduced the defects in the insulator bulk and also improved the interface quality between the channel and the gate insulator.

• Applied Chemistry for Engineering
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• v.27 no.5
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• pp.472-477
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• 2016

We studied the effects of anodic oxidation treatments of carbon fibers on interfacial adhesion of the carbon fibers-reinforced epoxy matrix composites with various current densities. The surface of treated carbon fibers was characterized by atomic force microscope (AFM), field emission-scanning electron microscope (FE-SEM), Fourier transform infrared spectroscopy (FT-IR), and X-ray photoelectron spectroscopy (XPS). The interlaminar shear strength (ILSS) of the composites was determined by a short beam shear test. This result showed that both the roughness and oxygen group of the carbon fibers surface increased in proportion to the current density. After anodic-oxidation-treated, the ILSS also increased as a function of the current density. In addition, the proportional relationship between ILSS and phenolic hydroxyl group was confirmed. The ILSS of the CF-2.0 sample increased by 4% compared to that of the CF-AS sample, because the anodic oxidation treatment increased the oxygen group and roughness on the carbon fibers surface, which leading to the improvement of the interfacial adhesion of the carbon fibers-reinforced epoxy matrix composites. Among these, the phenolic hydroxyl group which has the proportional relationship with ILSS is found to be the most important factor for improving the interfacial adhesion of the carbon fibers-reinforced epoxy matrix composites.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.59-59
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• 2010

Graphene is a 2-D sheet of $sp^2$-bonded carbon arranged in a honeycomb lattice. This material has attracted major interest, and there are many ongoing efforts in developing graphene devices because of its high charge mobility and crystal quality. Therefore clear understanding of the substrate effect and mechanism of synthesis of graphene is important for potential applications and device fabrication of graphene. In a published paper in J. Phys. Chem. C (2008), the effect of substrate on the atomic/electronic structures of graphene is negligible for graphene made by mechanical cleavage. However, nobody shows the interaction between Ni substrate and graphene. Therefore, we have studied this interaction. In order to studying these effect between graphene and Ni substrate, We have observed graphene synthesized on Ni substrate and graphene transferred on $SiO_2$/Si substrate through Raman spectroscopy. Because Raman spectroscopy has historically been used to probe structural and electronic characteristics of graphite materials, providing useful information on the defects (D-band), in-plane vibration of sp2 carbon atoms (G-band), as well as the stacking orders (2D-band), we selected this as analysis tool. In our study, we could not observe the doping effect between graphene and Ni substrate or between graphene and $SiO_2$/Si substrate because the shift of G band in Raman spectrum was not occurred by charge transfer. We could noticed that the bonding force between graphene and Ni substrate is more strong than Van de Waals force which is the interaction between graphene and $SiO_2$/Si. Furthermore, the synthesized graphene on Ni substrate was in compressive strain. This phenomenon was observed by 2D band blue-shift in Raman spectrum. And, we consider that the graphene is incommensurate growth with Ni polycrystalline substrate.

• Journal of the Korea Concrete Institute
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• v.14 no.1
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• pp.126-135
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• 2002

Plate bonding technique has been widely used in strengthening of existing concrete structures, although it has often a serious problem of premature falure such as interface separation and rip-off. However, this premature failure problem has not been well explored yet especially in view of local failure mechanism around the interface of plate ends. The purpose of the present study is, therefore, to identify the local failure of strengthened plates and to derive a separation criterion at the interface of plates. To this end, a comprehensive experimental program has been set up. The double lap pull-out tests considering pure shear force and half beam tests considering combined flexure-shear force were performed. The main experimental parameters include plate thickness, adhesive thickness, and plate end arrangement. The strains along the longitudinal direction of steel plates have been measured and the shear stress were calculated from those measures strains. The effects of plate thickness, bonded length, and plate end treatment have been also clarified from the present test results. Nonlinear finite element analysis has been performed and compared with test results. The Interface properties are also modeled to present the separation failure behavior of strengthened members. The cracking patterns as well as maximum failure loads agree well with test data. The relation between maximum shear and normal stresses at the interface has been derived to propose a separation failure criterion of strengthened members. The present study allows more realistic analysis and design of externally strengthened flexural member with steel plates.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.2
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• pp.148-156
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• 2008

Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.

• Journal of Dental Rehabilitation and Applied Science
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• v.25 no.3
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• pp.225-235
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• 2009

A common procedure of restoration of endodonticlly treated tooth with fiber-reinforced post is followed by core build-up after post cementation. However, this technique is complex and time-consuming. The aim of this study was to compare fracture strength of premolar, restored with various methods of core fabrications on fiber-reinforced posts and casting metal restoration. Forty five freshly extracted human mandibular premolars were obtained and devided into 5 groups acconding to the type of post and methods of core build-up. In Group A, D.T. $Light-post^{(R)}$ were cemented with $DUO-LINK^{TM}$ and then $LIGHT-CORE^{TM}$ was used for core restoration. In Group B, D.T. $Light-post^{(R)}$ and $DUO-LINK^{TM}$ were used for cementing in the postspace, and $DUO-LINK^{TM}$ was used again for core restoration. In Group C, $Light-post^{(R)}$ bonding and the core build-up were performed simultaneously by using $DUO-LINK^{TM}$. In Group D, $LuxaPost^{(R)}$ was bonded by using $LuxaCore^{(R)}-Dual$. Again, $LuxaCore^{(R)}-Dual$ was used for core restoration. In Group E, $LuxaPost^{(R)}$ bonding and the core build-up were performed simultaneously by using $LuxaCore^{(R)}-Dual$. Axial reduction was formed parallelly as possible and 45 degree bevel was made at buccal occlusal surface. Crowns were fabricated and cemented. Each tooth was embedded in self-curing acrylic resin to the level of 2mm below the CEJ. Specimens were fixed on universal testing machin such that the axis of the tooth was at 45 degree inclination to the horizontal plane, and compressive force was applied at a crosshead speed of 1mm/min until failure occurred. The mean fracture strength was the highest in group A followed by descending order in group B, D, E and C. However, there were no statistically significant differences between groups with regard to the fracture strength. The type of the post or build-up methods of the core does not seem to influence the fracture strength.

• The Journal of Korean Academy of Prosthodontics
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• v.53 no.2
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• pp.120-127
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• 2015

Purpose: The aim was to investigate the effect of implant thread designs on the stress dissipation of the implant. Materials and methods: The threads evaluated in this study included the V-shaped, buttress, reverse buttress, and square-shaped threads, which were of the same size (depth). Building four different implant/bone complexes each consisting of an implant with one of the 4 different threads on its cylindrical body ($4.1mm{\times}10mm$), a force of 100 N was applied onto the top of implant abutment at $30^{\circ}$ with the implant axis. In order to simulate different osseointegration stages at the implant/bone interfaces, a nonlinear contact condition was used to simulate immature osseointegration and a bonding condition for mature osseointegration states. Results: Stress distribution pattern around the implant differed depending on the osseointegration states. Stress levels as well as the differences in the stress between the analysis models (with different threads) were higher in the case of the immature osseointegration state. Both the stress levels and the differences between analysis models became lower at the completely osseointegrated state. Stress dissipation characteristics of the V-shape thread was in the middle of the four threads in both the immature and mature states of osseointegration. These results indicated that implant thread design may have biomechanical impact on the implant bed bone until the osseointegration process has been finished. Conclusion: The stress dissipation characteristics of V-shape thread was in the middle of the four threads in both the immature and mature states of osseointegration.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.