• Title/Summary/Keyword: Bond order

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Computer Simulation Studies of the Conformations of Polymeric Systems Near Surfaces as a Basic Research of the Elastomer (고무의 기초 연구로써 표면에 위치한 고분자 시스템 거동에 관한 수치모사 연구)

  • Kim, Myung-Yul;Park, Yung-Hoon
    • Elastomers and Composites
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    • v.35 no.1
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    • pp.29-37
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    • 2000
  • In this study as a basic research of the elastomer, we show the results of the behavior of the two different chain length polymers in the melt confined between two impenetrable planes. The cubic lattice simulations are conducted in the canonical ensemble with a method that is a combination of reptation and crackshaft bond flip motions. A total of 680 chains which are 544 short chains comprising 10 beads and 136 long chains comprising 160 beads were placed in 20 lattice layers. It was assumed that there is no energetic interactions between covalently connected beads. while all other neighbors will interact with a truncated 6-12 Lennard-Jones potential. From the analysis of the simulation results, it was shown that purely entropic effects caused the shorter chains to partition preferentially to the surface. We also showed that the center of mass density of the shorter chains shows maximum near the surface. This is the opposite phenomena when compared to that of the longer chains. However, the segments of the shorter and the longer chains did not display any significant changes in bond order.

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3D Measurement System of Wire for Automatic Pull Test of Wire Bonding (Wire bonding 자동 전단력 검사를 위한 wire의 3차원 위치 측정 시스템 개발)

  • Ko, Kuk Won;Kim, Dong Hyun;Lee, Jiyeon;Lee, Sangjoon
    • Journal of Institute of Control, Robotics and Systems
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    • v.21 no.12
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    • pp.1130-1135
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    • 2015
  • The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.

A COMPARATIVE STUDY OF THE PHYSICOCHEMICAL PROPER TIES AND BOND STRENGTH TO METAL BETWEEN THE REGULAR OPAQUE POWDER AND CORE POWDER (도재소부전장금관용 Opaque 분말과 도재전장관용 core 분말의 물리화학적 성질 및 금속과의 결합력에 대한 비교연구)

  • Lim, Jang-Seop;Chung, Chang-Mo;Jeon, Young-Chan
    • The Journal of Korean Academy of Prosthodontics
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    • v.35 no.1
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    • pp.144-164
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    • 1997
  • The purpose of this study were to investigate the chemical composition, mean particle size, linear thermal expansion coefficient and metal-bonding strength of the regular opaque powder and core powder. In this study, 4 types of ceramic powders, namely Duceram Jacket Opaque powder, Duceram Opaque powder, Vita Hi-Ceram powder, Vita VMK Paint On-88 powder were used. Chemical composition was evaluated by EDS(Energy Dispersive X-ray Spectrophotometer, Oxford QX-2000, England), particle size was measured by MALVERN Instruments(MALVERN Instruments SB. OC., U.S.A.. ad linear thermal expansion coefficient was measured by dilatometer(Motoyama, Japan). Bond strength was measured by the Universal tsting machine(Istron Co., Ltd., U.S.A.). The Results were as follows : 1. Through recognition of the relative difference in chemical composition between the core powder and the regular opaque powder, the difference in the proportion of $Al_2O_3$ in each type of material is demonstrated ; Duceram Jaket Opaque powder : 30.16%, Duceram Opaque powder : 16.60%, Vita Hi-Ceram : 63.64%, Vita VMK Paint-On 88 : 16.16%. 2. There was no significant difference in the proportion of metal-bonding materials between the core powder and the regular opaque powder. 3. In the regular opaque powder, alkaline materials were incoporated in order to increase the coefficient of thermal expansion. 4. In the particle size analysis, there was no significant difference in mean particle size or in the particle size distribution between the core powder and the regular opaque powder. 5. In the thermal expansion test for temperature range of $25-600^{\circ}C$, the regular opaque powder had higher coefficient of thermal expansion than that of core powder. 6. In the 4 point flexural bending test, there was no statistically significant difference in the mean bond strength between the core powder and the opaque powder among the Duceram products.

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Characterization of Tailoring Genes Involved in the Modification of Geldanamycin Polyketide in Streptomyces hygroscopicus JCM4427

  • Shin, Jin-Chul;Na, Zhu;Lee, Dong-Ho;Kim, Won-Cheol;Lee, Kyeong;Shen, Yue-Mao;Paik, Sang-Gi;Hong, Young-Soo;Lee, Jung-Joon
    • Journal of Microbiology and Biotechnology
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    • v.18 no.6
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    • pp.1101-1108
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    • 2008
  • Geldanamycin and its analogs are important anticancer agents that inhibit the newly targeted heat-shock protein (Hsp) 90, which is a chaperone protein in eukaryotic cells. To resolve which geldanamycin biosynthetic genes are responsible for particular post-polyketide synthase (PKS) processing steps and in which order the reactions occur, we individually inactivated candidate genes in Streptomyces hygroscopicus subsp. duamyceticus JCM4427 and isolated and elucidated the structures of intermediates from each mutant. The results indicated that gel7 governs at least one of the benzoquinone ring oxidation steps. The gel16 was found to be involved in double-bond formation between C-4 and C-5 of 4,5-dihydrogeldanamycin, which confirmed our previous findings that this double bond is reduced during the post-PKS modification of the polyketide assembly. In addition, pro-geldanamycin, which does not possess a double bond at C-4/5, was purified from the gel7 and gel8 double-gene-inactivated mutant.

Prediction of Retention Behavior of Alkyl Benzenes by Hydrophobicity Parameters in Reversed-Phase Column (소수성 파라메터를 적용한 알킬벤젠류의 역상컬럼내의 용출거동 예측)

  • Lee, Chang-Young;Park, Myung-Yong;Lee, Yong-Moon
    • YAKHAK HOEJI
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    • v.53 no.5
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    • pp.281-285
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    • 2009
  • The retention of solutes in reversed-phase high-performance liquid chromatography depends on their hydrophobicity. Although the retention behaviors of alkyl benzenes have been reported so far, quite a few authors have mentioned the retention behavior of alkyl benzenes with plural hydrophobicity parameters. In this sense, we were interested in the retention behaviors of alkyl benzenes having benzene moiety and increasing alkyl chain. In this study, we therefore investigated the retention behavior of alkyl benzenes in reversed-phase high-performance liquid chromatography in order to obtain information concerning the effects of the aromatic moiety and the carbon chain on the retention mechanism by comparing their capacity factor (k') in relation to the carbon chain length. The eluent acetonitrile ($CH_3CN$) showed high selectivity on alkyl benzenes, showing the high difference of capacity factor (${\Delta}log\;k'$) between toluene and octyl benzene. Indeed, the ${\Delta}log\;k'$ of 80% $CH_3CN$ represented 1.42- and 4.25-times longer than 90% MeOH and 60% THF, respectively. The hydrophobicity parameters, van der Waals volume, bond constant, partition constant, $\pi$-energy effect and enthalpy were evaluated with the capacity factor (k') of alkyl benzenes eluted on 80% CH3CN, 90% MeOH and 60% THF, respectively. The best eluent for predicting retention behavior of alkyl benzenes was 90% MeOH ($R^2$ 0.999). The three parameters, van der Waals volume, bond constant and partition constant were well coincident to log k' by increasing alkyl benzenes. However, $\pi$-energy effect and enthalpy were severely disagreeable. Taken together, van der Waals volume, bond constant and partition constant were a reliable parameters to predict the retention behaviors of alkyl benzenes on reversed-phase column.

Characterization and Formation of Chemical Bonds of Silica-Coupling Agent-Rubber (실리카-커플링제-고무의 화학 결합 형성과 특성 분석)

  • Ko, Eunah;Choi, Sung-Seen
    • Elastomers and Composites
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    • v.49 no.3
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    • pp.239-244
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    • 2014
  • Reaction between silica and silane coupling agent without solvent was investigated using transmission mode Fourier transform infrared spectroscopy (FTIR) and thermogravimetric analysis (TGA). Bis[3-(triethoxysilylpropyl) tetrasulfide] (TESPT) was used as a silane coupling agent. After removing the unreacted TESPT, formation of chemical bonds was analyzed using FTIR and content of reacted TESPT was determined using TGA. Content of the coupling agent bonded to silica increased with increase in the coupling agent content, but the oligomers were formed by condensation reaction between coupling agents when the coupling agent was used to excess. In order to identify bonds formed among silica, coupling agent, and rubber, a silica-coupling agent-BR model composite was prepared by reaction of the modified silica with liquid BR of low molecular weight and chemical bond formation of silica-coupling agent-BR was investigated. Unreacted rubber was removed with solvent and analysis was performed using FTIR and TGA. BR was reacted with the coupling agent of the modified silica to form chemical bonds. Polarity of silica surface was strikingly reduced and particle size of silica was increased by chemical bond formation of silica-coupling agent-BR.

An Experimental Study on the Bond Strength of Polymer-Modified Mortars (폴리머 시멘트 모르타르의 부착강도에 대한 실험적 연구)

  • Park, Hun-Il;Song, Ki-Min;Park, Sang-Sun;Sin, Hong-Chul;Sin, Ju-Jae;Kim, Young-Kun
    • Proceedings of the Korea Concrete Institute Conference
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    • 2008.04a
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    • pp.629-632
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    • 2008
  • In the concrete repairing industry, it's very significant to apply adequate repair materials and construction method in order to extend service life of deteriorated concrete structure efficiently. also, adequate diagnosis of deteriorated structure's status should be involved. This paper describes an investigation of bond strength of polymer modified mortar applied both old deteriorated concrete surface substrate and well cured new concretes. The purpose of this investigation is comparing how much the tensile bond strength on construction site is different from laboratory test results. in the results of investigation, most of sample tested in laboratory is in compliance with KS F 4042's specification. and most of results of construction site are not in compliance with the specification cause of low tensile strength of concrete's surface.

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Evaluation of Flexural Bond Performance of Hybrid Concrete Repair Materials (하이브리드 콘크리트 보수재료의 휨부착 성능평가)

  • Kim, Gyeong Tae;Kim, Sang Jun;Park, Hong Gi;Choi, Young Cheol
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.22 no.6
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    • pp.176-181
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    • 2018
  • Concrete structures are degraded physically and chemically due to various reasons after construction. Because the deterioration of concrete structure reduces the service life, reasonable repair and maintenance techniques are needed. Recently, in order to efficiently repair concrete structures, many researches on hybrid repair materials having improved adhesion performance have been carried out actively. In this study, we developed a hybrid repair material containing rapid hardening cement, PVA powder, nylon fiber, and latex to improve adhesion and water-tightness of existing concrete. The compressive strength, drying shrinkage and the adhesion strength test were carried out to evaluate the performance of the repair material. In addition, the flexure bond performance was evaluated before and after repair. From the results, the bending strength was 110% ~ 150% in all specimens except for the specimen containing only the rapid hardening cement, and all the specimens behaved with the existing concrete in the crack pattern generated by the bending strength.

The Mechanical Properties and Biocompatibility of Functionally Graded Coatings(FGC) of Hydroxyapatite(HA) and Metallic Powders - Functionally Gradient Coatings of Thermal Spray in Air- (Hydroxyapatite (HA)와 금속 분말 경사 코팅의 기계적 특성 및 생체 적합성 - 대기 열용사 경사코팅 -)

  • Kim, Eun-Hye;Kim, Yu-Chan;Han, Seung-hee;Yang, Seok-Jo;Park, Jin-Woo;Seok, Hyun-Kwang
    • Korean Journal of Metals and Materials
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    • v.47 no.1
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    • pp.13-20
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    • 2009
  • This work presents functionally graded coatings (FGC) of hydroxyapatite (HA) and metallic powders on Ti-6Al-4V implants using plasma spray coating method. HA has been the most frequently used coating material due to its excellent compatibility with human bones. However, because of the abrupt changes in thermomechanical properties between HA and the metallic implant across an interface, and residual stress induced on cooling from coating temperture to room temperature, debonding at the interface occurs in use sometimes. In this work, FGC of HA and Ti or Ti-alloy powders is made to mitigate the abrupt property changes at the interface and the effect of FGC on residual stress release is investigated by evaluating the mechanical bond strength between the implant and the HA coating layers. Thermal annealing is done after coating in order to crystallize the HA coating layer which tends to have amorphous structure during thermal spray coating. The effects of types and compositional ratio of metallic powders in FGC and annealing conditions on the bond strength are also evaluated by strength tests and the microstructure analysis of coating layers and interfaces. Finally, biocompatibility of the coating layers are tested under ISO 10993-5.

The defect detection circuit of an electronic circuit through impedance change detection that induces a change in S-parameter (S-parameter의 변화를 유도하는 임피던스 변화 감지를 통한 전자회로의 결함검출회로)

  • Seo, Donghwan;Kang, Tae-yeob;Yoo, Jinho;Min, Joonki;Park, Changkun
    • Journal of IKEEE
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    • v.25 no.4
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    • pp.689-696
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    • 2021
  • In this paper, in order to apply Prognostics and Health Management(PHM) to an electronic system or circuit, a circuit capable of detecting and predicting defect characteristics inside the system or circuit is implemented, and the results are described. In the previous study, we demonstrated that the frequency of the amplitude of S-parameter changed as the circuit defect progressed. These characteristics were measured by network analyser. but in this study, even if the same defect detection method is used, a circuit is proposed to check the progress of the defect, the remaining time, and the occurrence of the defect without large measurement devices. The circuit is designed to detect the change in impedance that generates changes of S-parameter, and it is verified through simulation using the measurement results of Bond-wires.