• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.246-249
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• 2006

We have developed a new driving method named TROPHY(Talented Role-playing Technology with Dual Polarity sustainer in Hybrid Mono board). In this method, the sustain voltage is halved compared to the conventional method and the number of power sources is reduced by voltage level unification during the reset, address and sustain period. The hybrid mono board was especially developed to implement those technologies. Therefore, we can lower the cost with the TROPHY compared to the conventional one. It is suitable technology to improve the reliability of circuit and image sticking problem. We can also reduce the number of driving boards and the EMI problem comparing to those of the conventional method.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.53-59
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• 2014

The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous issue since the material was applied to the industry. Various shock test methods were developed and standardized tests are used in the industry worldwide. Although it is applied for several years, the detailed mechanism of the shock induced failure mechanism is still under investigation. In this study, the effect of external temperature was observed on large Flip-chip BGA components. The weight and size of the large package produced a high strain region near the corner of the component and thus show full fracture at around 200G level shock input. The shock performance at elevated temperature, at $100^{\circ}C$ showed degradation based on board pad designs. The failure mode and potential failure mechanisms are discussed.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.393-404
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.195-201
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• 2000

Current Status: Good Electrical performance for high speed device, Solder joint reliability-Passed 1600 cycles for 4M SRAM(3.27mm DNP),-Passed 400 cycles for large die(5.71 mm DNP), Future Plan: Improving Board Level Reliability for large die size, Lead free solder evaluation.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.33-38
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• 2009

The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

• Health Policy and Management
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• v.27 no.4
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• pp.347-358
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• 2017

Background: The recent revision of South Korea's Mental Health Law emphasizes the role of the Mental Health Review Board. For this study, we examined the current status of continuing hospitalization judgement in Mental Health Review Board at the national level and aimed to determine the directions of improvement. Methods: Using a qualitative case study as the research method, we interviewed 30 Mental Health Review Board members and analyzed the results. Results: Each municipality had very different continuing hospitalization judgement methods. In our systematic review, which consisted of document inspection, we identified reliability problems due to limitations in Mental Health Review Board's operating systems, discharge orders, etc. Additionally, continuing hospitalization judgement needs to improve the objectivity, fairness, and effectiveness of their screening examinations. Conclusion: Based on the results of this study, we suggest policy proposals to improve these systems, such as standardizing examination processes, strengthening on-site inspections, increasing the independence and neutrality of judgment in Mental Health Review Board, building community mental health infrastructures, and establishing integrated management systems.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.40 no.2
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• pp.37-42
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• 2008

Defects of corrugated board were limiting factors to the corrugated industry's growth. On-line detecting systems of defects are beneficial to increase profits of the corrugated board companies by reducing base paper consumption, increasing process reliability, and increasing productivity. By replacing naked eye inspection of defects to a defects detecting system, continuous inspection without fatigue may guarantee final products quality. The system was developed, which was consisted of line scan CCD camera, lens, illuminating parts, high speed image processor, software, various input parts, and output parts. First installation location of the system was at before fluting process after base paper unwinding, and surface of liner board was inspected by the system. Second installation location was after fluting process and combining process for liner board. Production loss includes ragged appearance of edge, irregular flute shape, wrong combination of flute, score cracking, defects in base paper, and flute cracking. The production loss was analyzed before and after the system installation at a commercial domestic mill. The production loss ratio was defined as a production loss weight per total production weight. The production loss ratio before the installation was decreased a lot from 1.28%(during 3 months before installation) to 0.76%(during 12 months after the first installation) and to 0.25%(during 6 months after the second installation).

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.48 no.1
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• pp.42-47
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• 1999

This paper presents the information transmission between on-board and ground-site in MAGLEV. considering safety and high speed operation and density operation, information transmission between them is necessary. Therefore it is necessary for transmission system to ensure high speed transmission, low error rate, massive information, and reliability of information. To provide above conditions, 1.1km signal line assembly was constructed and Frequency Shift Keying(FSK) modulation and Open System Interconnection(OSI) based high-level data link control(HDLC) protocol are applied. To modulate digital signal for transmission from ground-site to on-board, carrier frequency of 70kHz is used and 90khz is used for transmission from on-board to ground-site. Transmission speed is 2400bps for consideration of train speed, quantity of information, and data error rate. And this paper introduces information monitoring considering user interface and presents the method for an effective data transmission in MAGLEV which is now being tested and intends to provide for an intelligent train operation system in future.