Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.10a
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- Pages.195-201
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- 2000
Wafer-Level CSP(Omega CSP)
- Park, I.S. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Kang, I.S. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Kim, J.H. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Kim, J.Y. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Cho, S.J. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Park, M.G. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Chun, H.S. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Kih, J.S. (HYUNDAI Electronics Inc. Co. Ltd) ;
- Hun, H. (Korea Advanced Institute of Science & Technology) ;
- Yu, J (Korea Advanced Institute of Science & Technology)
- Published : 2000.10.01
Abstract
Current Status: Good Electrical performance for high speed device, Solder joint reliability-Passed 1600 cycles for 4M SRAM(3.27mm DNP),-Passed 400 cycles for large die(5.71 mm DNP), Future Plan: Improving Board Level Reliability for large die size, Lead free solder evaluation.
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