• Proceedings of the KWS Conference
• /
• 2006.05a
• /
• pp.230-232
• /
• 2006

Eutectic Au-20Sn solder has been widely used for optoelectronic packages because of fluxless soldering process and thus are particularly valuable for many applications such as biomedical, photonic, and MEMS devices that can not use any flux. Also when good joint strength, superior resistance to corrosion, whisker-free, and good thermal conductivity are demanded, eutectic Au-20Sn solder can be satisfied with above-mentions best. In this study, we tried to know the interfacial reactions between Au-20Sn solder and Cu substrate with or without ENIG plating layer In the results, Au-Cu-Sn ternary phases were formed at the Au-20Sn/Cu substrate, and Au-Ni-Sn, Au-Ni-Cu-Sn phases were formed at the Au-20Sn/ENIG substrate.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.3 s.32
• /
• pp.47-53
• /
• 2004

Eutectic Au-20Sn(compositions are all in weight percent unless specified otherwise) solder alloys were soldered on the Ni substrate with various time and temperature. The composition, phase identification and morphology of intermetallic compounds(IMC) at the interface were examined using Scanning Electron Microscopy(SEM). There were two types of IMCs, $(Au,Ni)_3Sn_2$ and $(Au,Ni)_3Sn$ at the interface. The transition in morphology of $(Au,Ni)_3Sn_2$ has been observed at $300{\~}400^{\circ}C$. The morphology transition of $(Au,Ni)_3Sn_2$ is due to the decrease of enthalpy of formation of $(Au,Ni)_3Sn_2$ phase and has been explained well by Jackson's parameter with temperature. Because the number of diffusion channel is different at each soldering temperature, IMC thickness is nearly same at all temperature.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.11a
• /
• pp.54-54
• /
• 2004

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.10a
• /
• pp.464-466
• /
• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.

• Journal of Welding and Joining
• /
• v.29 no.6
• /
• pp.65-70
• /
• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.2
• /
• pp.59-64
• /
• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Korean Journal of Materials Research
• /
• v.26 no.12
• /
• pp.741-750
• /
• 2016

Nanofibers(NFs), because of their high surface area and nanosized grains, have appropriate morphologies for use in chemiresistive-type sensors for gas detection applications. In this study, a highly sensitive and selective CO gas sensing material based on Au-decorated $SnO_2$ NFs was fabricated by electrospinning. $SnO_2$ NFs were synthesized by electrospinning and subsequently decorated with various amounts of Au nanoparticles(NPs) by sputtering; this was followed by thermal annealing. Different characterizations showed the successful formation of Au-decorated $SnO_2$ NFs. Gas sensing tests were performed on the fabricated sensors, which showed bell-shaped sensing behavior with respect to the amount of Au decoration. The best CO sensing performance, with a response of ~20 for 10 ppm CO, was obtained at an optimized amount of Au (2.6 at.%). The interplay between Au and $SnO_2$ in terms of the electronic and chemical sensitization by Au NPs is responsible for the great improvement in the CO sensing capability of pure $SnO_2$ NFs, suggesting that Au-decorated $SnO_2$ NFs can be a promising material for fabricating highly sensitive and selective chemiresistive-type CO gas sensors.

• Journal of the Korean Electrochemical Society
• /
• v.11 no.2
• /
• pp.109-114
• /
• 2008

Though ethanol can theoretically generate 12 electrons during oxidation to carbon dioxide, the complete oxidation of ethanol is hard to achieve due to the strong bond between the two carbons in its molecular structure. Therefore, development of high activity catalyst for ethanol oxidation is necessary for the commercialization of direct ethanol fuel cell. In this study, some binary and ternary electrocatalysts of PtSn/C and PtSnAu/C have been synthesized and characterized. The catalysts were fabricated with modified polyol method with the amounts of 20 wt%, where the Pt : Sn ratios in the PtSn/C were 1 : 0, 4 : 1, 3 : 1, 2 : 1, 1.5 : 1, 1 : 1, 1 : 1.5 and Pt:Sn:Au ratios in the PtSnAu/C were 5 : 5 : 0, 5 : 4 : 1, 5 : 3 : 2, 5 : 2 : 3. From the XRD and TEM analysis results, the catalysts were found to have face centered cubic structure with particle size of around $1.9{\sim}2.4\;nm$. The activity in the ethanol oxidation was examined with cyclic voltammetry and the results indicated that PtSn(1.5 : 1)/C and PtSnAu(5 : 2 : 3)/C had the highest activity in each catalyst system. Further tests with single cell were performed with those catalysts. It was found that PtSn/C(1.5 : 1) exhibited the best performance while the long term stability of PtSnAu/C(5 : 2 : 3) is better than PtSn/C(1.5 : 1).

• Proceedings of the KIEE Conference
• /
• 2003.10a
• /
• pp.273-275
• /
• 2003

본 실험은 고출력 반도체 레이저의 p-side-down 마운팅용 솔더로서 AuSn 합금 솔더(80wt%:20wt%)의 적합성에 대해 연구하였다. $1{\mu}m$이하의 균일도로 폴리싱 된 Cu heat sink의 표면에 두께 $1{\mu}m$의 Ni로 코팅을 한다음, AuSn 다층박막은 e-beam 증착기로 AuSn 합금 솔더는 열증착기로 각각 증착하였다. 열처리는 산화 방지를 위해 $N_2$ 분위기에서 행하였으며, 동일한 압력으로 마운팅을 하였다. 표면의 거칠기와 형상은 AFM(Atomic Force Microscope)과 SEM(Scanning Electron Microscopy)으로 그리고 Au와 Sn의 성분비는 AES(Auger Electron Spectroscopy) 로 비교하였다. 또한 CW(연속발진)을 통한 L-I(Light-Current)측정을 통해 본딩상태를 비교하였다.

• Journal of Welding and Joining
• /
• v.20 no.6
• /
• pp.59-59
• /
• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.