• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.595-596
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• 2006

The flexible organic thin film transistor (OTFT) array to use as a switching device for an organic light emitting diode (OLED) was designed and fabricated in the microcontact printing and low-temperature processes. The gate, source, and drain electrode patterns of OTFT were fabricated by microcontact printing which is high-resolution lithography technology using polydimethylsiloxane(PDMS) stamp. The OTFT array with dielectric layer and organic active semiconductor layers formed at room temperature or at a temperature tower than $40^{\circ}C$. The microcontact printing process using SAM(self-assembled monolayer) and PDMS stamp made it possible to fabricate OTFT arrays with channel lengths down to even nano size, and reduced the procedure by 10 steps compared with photolithography. Since the process was done in low temperature, there was no pattern transformation and bending problem appeared. It was possible to increase close packing of molecules by SAM, to improve electric field mobility, to decrease contact resistance, and to reduce threshold voltage by using a big dielecric.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.3
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• pp.46-53
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• 2009

To find the working condition is one of the important factors in precision machining. In this study, we analyzed maximum working temperature by infra-red camera and surface roughness in side wall end milling using design of experiment (DOE): RSM(response surface methodology), ANOM(analysis of means) and ANOVA(analysis of variance) by table of orthogonal array. ANOM and ANOVA are well adapted to select sensitivity of design variables for maximum working temperature and surface roughness. The effective design variables and their levels should be determined using ANOM, ANOVA. RSM is presented 2nd order approximation polynomial of maximum working temperature and surface roughness is composed with design variables. Therefore, it is expected that the proposed procedure using design of experiment : table of orthogonal array, ANOM, ANOVA and RSM can be easily utilized to solve the problem of working condition.

• Proceedings of the KIEE Conference
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• 2005.07b
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• pp.1678-1680
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• 2005

This paper presents Building Integrated Photovoltaic system of the balcony type which is influenced by conditions such as irradiation, module temperature, shade and array arrangement. When architecture component, trees and cloud shade connecting array in series, total PV array current is reduced. So, before PV system design, a planner have to simulate many situations. And then array should be composed suitable for parallel and series modules. By the results, it is very important to develop optimal design of array considering shade effect for the balcony PV system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.100-103
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• 2007

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.

• Journal of Industrial Technology
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• v.25 no.B
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• pp.183-188
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• 2005

Instead of the incandescent lamps the LED lamps have been used on the traffic signal lamp with the advantages of small loss, no lens and long life. In this paper, we have compared three kinds of the LED controller structures and showed the LED array decision methods. We studied the temperature characteristics on LED and the temperature compensation network. The experimental results showed that the electrical characteristics of three kinds of the LED controller structures were different each other. We concluded that the temperature compensation is the important technique, the best compensation network has the ${\pm}10%$ variation for the luminous intensity.

• Journal of Mechanical Science and Technology
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• v.20 no.5
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• pp.692-709
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• 2006

Nucleate pool boiling experiments with constant wall temperature were performed using pure R1l3 for subcooled, saturated, and superheated pool conditions. A microscale heater array and Wheatstone bridge circuits were used to maintain the constant wall temperature and to measure the instantaneous heat flow rate accurately with high temporal and spatial resolutions. Images of bubble growth were taken at 5,000 frames per second using a high-speed CCD camera synchronized with the heat flow rate measurements. The bubble geometry was obtained from the captured bubble images. The effect of the pool conditions on the bubble growth behavior was analyzed using dimensionless parameters for the initial and thermal growth regions. The effect of the pool conditions on the heat flow rate behavior was also examined. This study will provide good experimental data with precise constant wall temperature boundary condition for such works.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.630-633
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.189-189
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• 2003

최근, Low-temperature Poly-Si(LTPS) TFT시장이 새롭게 형성됨에 따라 저온결정화 기술 연구가 활발히 진행되고 있다. 그러나, 기존의 저온결정화방법에 비해 수율이 높고 생산단가를 낮출 수 있으며 대 면적 프로세스 적용이 가능한 결정화공정개발이 시급히 필요한 실정이다. 본 연구에서는 TFT-LCD array를 구성하고 있는 데이터 라인과 ITO 공통 전극이 개별 트랜지스터의 소스와 드레인에 연결되어있다는 점에 착안하여, 전계를 이용한 방향성유도결정화법(Field Aided Lateral Crystallization)을 이에 적용하였으며 채널영 역의 균일한 결정화를 위하여 컨택홀의 모양에 변화를 주어 결정화 실험을 진행하였다. 이 방법은 간단한 공정(TFT-LCD way를 통한 전계 인가 및 열처리)으로 패널내의 모든 채널영 역을 균일하게 결정화할 수 있을 것으로 기대되는 방식이다.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1568-1570
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• 2008

In this paper, fabrication of a $60{\times}48$ polymer TFT array with a top-gate structure on plastic substrates using a low temperature printing process will be presented and the device structure and manufacturing processes will be discussed. The polymer TFT array showed excellent air stability and uniform electrical characteristics over a large area. Finally, a 1.5 inch EPD display with 50 dpi resolution using the polymer TFT array will be demonstrated for e-film device applications.

• Transactions on Electrical and Electronic Materials
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• v.6 no.2
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• pp.39-45
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• 2005

Numerical and visualization procedures are used in a finite difference grid to analyze and better understand the heat transfer in the MEMS based air micro-jet array (MIA) impingement cooling device. The Navier-Stokes (NS) equations with incompressible flow are solved using an implicit procedure. The temperature contour and velocity vector visualization diagrams are used for illustration. The computed temperature distribution at the bottom of the MIA is in good agreement with the experimental measurement data. The parameters are investigated to improve the efficiency of heat transfer in the MIA. The optimum configuration of the MIA is suggested. The present modeling explains the flow phenomenon and yields valuable information to understand the flow and heat transfer in MIA.