• 한국전기전자재료학회논문지
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• 제32권4호
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• pp.272-275
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• 2019

We investigated the electrical characteristics of amorphous silicon-zinc-tin-oxide (a-SZTO) thin films deposited by RF-magnetron sputtering at room temperature depending on the deposition time. We fabricated a thin film transistor (TFT) with a bottom gate structure and various channel thicknesses. With increasing channel thickness, the threshold voltage shifted negatively from -0.44 V to -2.18 V, the on current ($I_{on}$) and field effect mobility (${\mu}_{FE}$) increased because of increasing carrier concentration. The a-SZTO film was fabricated and analyzed in terms of the contact resistance and channel resistance. In this study, the transmission line method (TLM) was adopted and investigated. With increasing channel thickness, the contact resistance and sheet resistance both decreased.

• Current Photovoltaic Research
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• 제7권4호
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• pp.125-129
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• 2019

Recently, carrier-selective contact solar cells have attracted much interests because of its high efficiency with low recombination current density. In this study, we investigated the effect of phosphorus doped amorphous silicon layer's characteristics on the passivation properties of tunnel oxide passivated carrier-selective contact solar cells. We fabricated symmetric structure sample with poly-Si/SiOx/c-Si by deposition of phosphorus doped amorphous silicon layer on the silicon oxide with subsequent annealing and hydrogenation process. We varied deposition temperature, deposition thickness, and annealing conditions, and blistering, lifetime and passivation quality was evaluated. The result showed that blistering can be controlled by deposition temperature, and passivation quality can be improved by controlling annealing conditions. Finally, we achieved blistering-free electron carrier-selective contact with 730mV of i-Voc, and cell-like structure consisted of front boron emitter and rear passivated contact showed 682mV i-Voc.

• Transactions on Electrical and Electronic Materials
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• 제15권6호
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• pp.328-332
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• 2014

Thin film transistors (TFTs) with an amorphous silicon zinc tin oxide (a-2SZTO) channel layer have been fabricated using an RF magnetron sputtering system. The effect of the change of excitation electron on the variation of the total interfacial trap states of a-2SZTO systems was investigated depending on sputtering power, since the interfacial state could be changed by changing sputtering power. It is well known that Si can effectively reduce the generation of the oxygen vacancies. However, The a-2SZTO systems of ZTO doped with 2 wt% Si could be degraded because the Si peripheral electron belonging to a p-orbital affects the amorphous zinc tin oxide (a-ZTO) TFTs of the s-orbital overlap structure. We fabricated amorphous 2 wt% Si-doped ZnSnO (a-2SZTO) TFTs using an RF magnetron sputtering system. The a-2SZTO TFTs show an improvement of the electrical property with increasing power. The a-2SZTO TFTs fabricated at a power of 30 W showed many of the total interfacial trap states. The a-2SZTO TFTs at a power of 30 W showed poor electrical property. However, at 50 W power, the total interfacial trap states showed improvement. In addition, the improved total interfacial states affected the thermal stress of a-2SZTO TFTs. Therefore, a-2SZTO TFTs fabricated at 50 W power showed a relatively small shift of threshold voltage. Similarly, the activation energy of a-2SZTO TFTs fabricated at 50 W power exhibits a relatively large falling rate (0.0475 eV/V) with a relatively high activation energy, which means that the a-2SZTO TFTs fabricated at 50 W power has a relatively lower trap density than other power cases. As a result, the electrical characteristics of a-2SZTO TFTs fabricated at a sputtering power of 50 W are enhanced. The TFTs fabricated by rf sputter should be carefully optimized to provide better stability for a-2SZTO in terms of the sputtering power, which is closely related to the interfacial trap states.

• 한국분말재료학회지
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• 제13권4호
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• pp.285-289
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• 2006

Co-Fe-Ni-B-Si-Cr based amorphous strips containing nitrogen were manufactured via melt spinning, and then devitrified by crystallization treatment at the various annealing temperatures of $300^{\circ}C{\sim}540^{\circ}C$ for up to 30 minutes in an inert gas $(N_2)$ atmosphere. The microstructures were examined by using XRD and TEM and the magnetic properties were measured by using VSM and B-H meter. Among the alloys, the amorphous ribbons of $Co_{72.6}Fe_{9.8}Ni_{5.5}B_{2.4}Si_{7.1}Cr_{2.6}$ containing 121 ppm of nitrogen showed relatively high saturation magnetization. The alloy ribbons crystallized at $540^{\circ}C$ showed that the grain size of $Co_{72.6}Fe_{9.8}Ni_{5.5}B_{2.4}Si_{7.1}Cr_{2.6}$ alloy containing 121 ppm of nitrogen was about f nm, which exhibited paramagnetic behavior. The formation of nano-grain structure was attributed to the finely dispersed Fe4N particles and the solid-solutionized nitrogen atoms in the matrix. Accordingly, it can be concluded that the nano-grain structure of 5nm in size could reduce the core loss within the normally applied magnetic field of 300A/m at 10kHz.

• 한국진공학회지
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• 제11권1호
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• pp.8-15
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• 2002

진공 여과 음극 아크(Filtered Vacuum cathodic Arc, FVA) 증착법을 이용하여 초경질 다이아몬드상 카본 박막(tetrahedral amorphous carbon, ta-C)을 합성하였다. FVA 증착법은 이온화율이 높고, 치밀한 다이아몬드상 카본 박막 증착에 적당한 이온 에너지를 갖는 등의 장점을 갖고 있다. 하지만, 이때의 카본 이온 에너지는 아크 소스의 조작만으로는 쉽게 조절되지 못한다는 단점을 갖고 있다. 다양한 물성 조절을 위해, 본 연구에서는 기판에 바이어스 전압을 인가하여 ta-C박막의 기계적 물성을 제어하였다. 기판의 바이어스 전압이 증가함에 따라, 기계적 물성 및 밀도는 바이어스 전압이 -100 V인 경우에 최대값을 보였다. 최대 경도값 및 밀도는 각각 55$\pm$3 GPa, 3.6$\pm$0.4 g/㎤로 이는 RF PACVD나 이온빔으로 증착되는 DLC의 3~5배에 이르는 값이다. 조성 및 구조 분석은 Raman spectroscopy와 NEXAFS spectroscopy를 이용하여 조사하였다. 각 바이어스 전압에 따른 박막의 물성 변화는 박막내의 $sp^2$와 $sp^3$ 혼성결합 분율의 변화의 관점으로 이해할 수 있었다.

• 한국자기학회지
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• 제12권4호
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• pp.154-159
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• 2002

벌크 비정질 형성능과 큰 포화자속밀도를 가지는 FeBSiNb계 아몰퍼스 합금 리본을 22~102$\mu\textrm{m}$의 두께 범위에서 단롤형 액체 급냉법으로 제조하였다. 이 합금은 두께 증가에 따라 보자력이 감소하고 최대투자율 및 교류투자율이 증가하였으며, 자기이력곡선의 각형비가 감소하였다. 한편 전기 비저항은 두께와 상관없이 거의 일정한 값을 나타내었다. 또 지구 관찰 결과, 두께가 증가하면 내부 자기 이방성의 변화에 따라 자구가 미세화 되고 보다 복잡한 자구 구조를 갖는 것으로 나타났다. 두께 81$\mu\textrm{m}$인 합금의 경우, 24 mOe의 작은 보자력과 1KHz에서 12,000이상의 높은 실효투자율을 나타내어 일반적인 고 연자성 비정질 합금(두께 약 20$\mu\textrm{m}$)의 특성을 능가하였다. 이와 같은 두꺼운 FeBSiNb 비정질 합금의 우수한 연자성은 자벽이동에 대한 표면 고착 효과의 감소 및 수직자기이방성 성분의 출현과 미세화 된 자구 구조에 그 원인이 있는 것으로 평가되었다.

• 한국재료학회지
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• 제8권10호
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• pp.898-904
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• 1998

10-50wt% 범위의 W을 함유하는 Ni-W 합금을 전기도금에 의해 제조하였다. 합금 중의 W 량은 전류밀도가 증가함에 따라 증가하였다. 전류밀도가 50mA/${cm}^2$이하인 경우 Ni-W합금은 미세한 결정립을 갖는 Ni의 고용체이었으며, 전류밀도가 50mA/${cm}^2$이상인 경우 비정질상으로 변화하였다. 이들의 결정질$\longrightarrow$비정질 천이는 W량이 40-46wt%인 구간에서 일어났으며 반각폭이 3배이상으로 증가하였다. 결정질 합금의 격자상수는 평형상태도 상의 W의 고용한계(약 30wt%)를 초과하는 40wt%까지 연속적으로 증가하는 것으로 나타나 Ni이 W을 과고용하고 있는 상태인 것으로 밝혀졌다. 비정질 Ni-W 합금은 $400^{\circ}C$이상의 온도에서 열처리하면 강한 [111]방향성을 가지며 재결정하였으며, $800^{\circ}C$이상의 온도에서는 과고용된 W이 석출하였다. 합금조성 및 결정구조의 전류밀도 의존성을 이용하여 Ni-30%W과 Ni-50%W 합금층이 반복되는 결정질/비정질의 다층도금을 제조하였다.

• 센서학회지
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• 제24권6호
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• pp.379-384
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• 2015

An infrared image sensor is a core device in a thermal imaging system. The fabrication method of a focal plane array (FPA) is a key technology for a high resolution infrared image sensor. Each pixels in the FPA have $Si_3N_4/SiO_2$ membranes including legs to deposit bolometric materials and electrodes on Si readout circuits (ROIC). Instead of polyimide used to form a sacrificial layer, the feasibility of an amorphous silicon (${\alpha}-Si$) was verified experimentally in a $8{\times}8$ micro-bolometer array with a $50{\mu}m$ pitch. The elimination of the polyimide sacrificial layer hardened by a following plasma assisted deposition process is sometimes far from perfect, and thus requires longer plasma ashing times leading to the deformation of the membrane and leg. Since the amorphous Si could be removed in $XeF_2$ gas at room temperature, however, the fabricated micro-bolomertic structure was not damaged seriously. A radio frequency (RF) sputtered nickel oxide film was grown on a $Si_3N_4/SiO_2$ membrane fabricated using a low stress silicon nitride (LSSiN) technology with a LPCVD system. The deformation of the membrane was effectively reduced by a combining the ${\alpha}-Si$ and LSSiN process for a nickel oxide micro-bolometer.

• Current Photovoltaic Research
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• 제8권3호
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• pp.94-101
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• 2020

This study was trying to focus on achieving high efficiency of multi junction solar cell with thin film silicon solar cells. The proposed thin film Si-Ge/c-Si tandem junction solar cell concept with a combination of low-cost thin-film silicon solar cell technology and high-efficiency c-Si cells in a monolithically stacked configuration. The tandem junction solar cells using amorphous silicon germanium (a-SiGe:H) as an absorption layer of upper sub-cell were simulated through ASA (Advanced Semiconductor Analysis) simulator for acquiring the optimum structure. Graded Ge composition - effect of E_g profiling and inserted buffer layer between absorption layer and doped layer showed the improved current density (J_sc) and conversion efficiency (η). 13.11% conversion efficiency of the tandem junction solar cell was observed, which is a result of showing the possibility of thin film Si-Ge/c-Si tandem junction solar cell.

• Transactions on Electrical and Electronic Materials
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• 제18권2호
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• pp.70-73
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• 2017

We investigated n-i-p type single junction hydrogenated amorphous silicon oxide solar cells. These cells were without front surface texture or back reflector. Maximum power point efficiency of these cells showed that an optimized device structure is needed to get the best device output. This depends on the thickness and defect density ($N_d$) of the active layer. A typical 10% photovoltaic device conversion efficiency was obtained with a $N_d=8.86{\times}10^{15}cm^{-3}$ defect density and 630 nm active layer thickness. Our investigation suggests a correlation between defect density and active layer thickness to device efficiency. We found that amorphous silicon solar cell efficiency can be improved to well above 10%.