• Journal of Korea Foundry Society
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• v.31 no.4
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• pp.205-211
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• 2011

Al-Si alloys have been steadily used as a potential material for the achievement of an efficient weight reduction in the automobile and aerospace industries due to its excellent castability and high strength-to-weight ratio. In this study, riser effect and mechanical properties were investigated according to the size of the sleeve. In addition, the effects of riser size on mechanical properties of castings were investigated. On the other hand flow and solidification process were simulated with a hybrid FDM/FEM package named ZCast. As a result, results of simulation and experiments were comparable regarding to the yield strength, tensile strength, elongation and hardness of casting. It proves the reliability of the simulation. It is expected that the proper size of riser can improve the recycling rate of metallic materials and reduce the cost of casting.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.7
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• pp.71-76
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• 2022

This study describes an evaluation of the vibration-level reduction effect of natural rubber inserted between two aluminum blocks, in which the modal parameters are predicted using two different damping systems. A numerical model with two degrees of freedom was established for both the cases. One was an eigenvalue problem analysis using a state space method and general viscous damping, whereas the other was a method using hysteretic damping. The modal parameters obtained from these two approaches were compared with those obtained from the finite element method using a commercial package. As a result, the natural frequencies observed in the complex frequency response curve were consistently less than the average of four percents. The damping ratios also showed good agreement within a reasonable range. However, the hysteretic damping system showed a relatively larger difference for all modal parameters. This suggests that the analysis procedure makes it easier to predict the vibration transmission characteristics of the shape and configuration of any cushioning layer.

• Structural Engineering and Mechanics
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• v.85 no.6
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• pp.755-764
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• 2023

The article examines the impact response of the sandwich beam furnished by a novel bilayer core as inspired by the woodpecker's head architecture under different repeatedly exerted low-velocity impact loadings by employing the finite element package, ABAQUS. The sandwich beam forms four essential parts comprising bottom and top carbon fiber reinforced polymer laminates encasing bilayer core made of laterally arched solid hot melt adhesive material and aluminum honeycomb. Impact loadings are implemented repeatedly with a steel hemisphere impactor for various impact energies, 7.28 J, 9.74 J, and 12.63 J. Essentially, the commonly concentrated stresses at the impact region are regulated away by the arched core in all considered cases thus reducing the threat of failure. The sandwich beam can resist up to 5 continual impacts at 7.28 J and 9.74 J but only up to 3 times repeated loads at 12.63 J before visible failure is noticed. In the examination of several key impact performance indicators under numerous loading cases, the proposed beam demonstrates favorably up to 1.3-11.2 higher impact resistance efficacies compared to existing designs, therefore displaying an improvement in repeated impact resistance of the new design.

• Steel and Composite Structures
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• v.50 no.2
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• pp.159-181
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• 2024

In the present study, the effect of geometrical parameters of two different types of aluminum thin-walled structures on energy absorption under three-bending impact loading has been investigated experimentally and numerically. To evaluate the effect of parameters on the specific energy absorption (SEA), initial peak crushing force (IPCF), and the maximum crushing distance (δ), a design of experiment technique (DOE) with response surface method (RSM) was applied. Four different thin-walled structures have been tested under the low-velocity impact, and then they have simulated by ABAQUS software. An acceptable consistency between the numerical and experimental results was obtained. In this study, statistical analysis has been performed on various parameters of three different types of tubes. In the first and the second statistical analysis, the dimensional parameters of the cross-section, the number of holes, and the dimensional parameter of holes were considered as the design variables. The diameter reduction rate and the number of sections with different diameters are related to the third statistical analysis. All design points of the statistical method have been simulated by the finite element package, ABAQUS/Explicit. The final result shows that the height and thickness of tubes were more effective than other geometrical parameters, and despite the fact that the deformations of the cylindrical tubes were around forty percent greater than the rectangular tubes, the top desirability was relevant to the cylindrical tubes with reduced cross-sections.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.3442-3447
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• 2014

A simple method to evaluate the hygroscopic characteristics of polymer of microelectronic plastic package is suggested. To evaluate the characteristics, specimens were prepared, and the internally absorbed moisture masses were measured as a function of the absorbing time and calculated numerically. The hygroscopic pressure ratio was calculated by heat transfer analysis supported by commercial FEM code because the hygroscopic diffusion equation has the same form as the heat transfer equation. The moisture masses were then summed by the self developed code. The nonconductive polymers had quite different characteristics for the different lots, even though they were the same products. The absorbed moisture mass variations were calculated for several different characteristics, and the optimal curve of the mass variation close to experimental data was selected, whose solubility and diffusivity were affected by the hygroscopic characteristics of the material. The method can be useful in the industrial fields to quickly characterize the polymer material of the semiconductor package because the fast correspondence is normally required in industry. The weight changes in the aluminum-nonconductive-polymer joint due to moisture absorption were measured. The deformed system was also measured using the Moire Interferometry system and compared with the results of finite element analysis.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.31-36
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• 2018

This research scrutinizes the reason of failure after pressure cooker test (PCT) for DRAM device. We use the physical inspecting tools, such as microscope, SEM and TEM, and finally find the discolor phenomenon, corrosion of Al and delamination of inter-metal dielectric (IMD) in the failed devices after PCT. Furthermore, we discover the abnormal $Al_XO_Y$ layer on Al through the careful additional measurements. To find the reason, we evaluate the effect of package ball size and pinhole in passivation layer. Unfortunately, those aren't related to the problems. We also estimate halide effect of Al. The halogens such like Cl are contained within EMC material. Those result in the slight improving of PCT characteristics but do not perfectly solve the problems. We make a hypothesis of Galvanic corrosion. We can find the residue of Ti at the edge of pad open area. We can see the improving the PCT characteristics by the time split of repair etch. The possible mechanism of the PCT failure can be deduced as such following sequence of reactions. The remained Ti reacts on the pad Al by Galvanic corrosion. The ionized Al is easily react with the $H_2O$ supplied under PCT environment, and finally transfers to the abnormal $Al_XO_Y$ layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Journal of the East Asian Society of Dietary Life
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• v.23 no.4
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• pp.461-469
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• 2013

This research is performed to investigate the changes in the physicochemical properties and microbial growths of seasoned anchovies with various packaging materials (PET/CPP : polyethylene terephthalate/cast polypropylene, PET/EVOH : polyethylene terephthalate/ethylene-vinyl alcohol, PET/AL/LDPE: polyethylene terephthalate/aluminum/low density polyethylene), which are stored at various temperatures (25, 35, $45^{\circ}C$) for 60 days. Generally, it is being observed that changes in physicochemical properties (i.e., moisture content, color, brown intensity, TBA value, TMA, VBN etc) of seasoned anchovies are significant when stored at higher temperatures. Particularly, the packaging materials are found to influence substantially on the physicochemical properties of seasoned anchovies. With packaging materials of high oxygen transmission rates and moisture vapor transmission rates (i.e., PET/CPP), the changes in physicochemical properties of seasoned anchovies are significant, while being low with low oxygen transmission rates and low moisture vapor transmission rates (i.e., PET/EVOH). In addition, results of microbial growths in seasoned anchovies show that significant increases in total aerobic bacteria counts (about 100-fold after 60 day of storage) are observed in samples with packaging materials of high oxygen transmission rates and moisture vapor transmission rates (i.e, PET/CPP), while with only small increases for samples of low oxygen transmission rates and low moisture vapor transmission rates (i.e., PET/EVOH). Based on the changes in the physicochemical properties and results of microbial growths, it is being concluded that PET/EVOH film is suitable for the packaging of seasoned anchovies.

• Transactions of Materials Processing
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• v.6 no.3
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• pp.239-249
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• 1997

The behaviour of alloys in the semi-solid state strongly depends on the imposed stress state and on the morphology of the phase which can vary from dendritic to globular. To optimal net shape forging of semi-solid materials, it is important to investigate for filling phenomena in forging process of arbitrarily shaped dies. To produce a automotive part which has good mechanical property, the filling pattern according to die velocity and solid fraction distribution has to be estimated for arbitrarily shaped dies. Therefore, the estimation of filling characteristic in the forging simulation with arbitrarily shaped dies of semi-solid materials are calculated by finite element method with proposed algorithm. The proposed theoretical model and a various boundary conditions for arbitrarily shaped dies is investigated with the coupling calculation between the liquid phase flow and the solid phase deformation. The simulation process with arbitrarily shaped dies is performed to the isothermal conditions of two dimensional problems. To analysis of forging process by using semi-solid materials, a new stress-strain relationship is described, and forging analysis is performed by viscoelastic model for the solid phase and the Darcy's law for the liquid flow. The calculated results for forging force and filling limitations will be compared to experimental data. The filling simulation of simple products performed with the uniform billet temperature(584$^{\circ}C$) from the induction heating by the commercial package MAGMAsoft. The initial step of computation is the touching of semi-solid material with the end of die gate and the initial concept of proposed system just fit with the capability of MAGMAsoft.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.9
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• pp.19-27
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• 2002

Characteristics of interconnect lines considering underlayer geometries of a silicon substrate and crossing metal lines are experimentally analyzed through elaborately devised patterns. In this work, test patterns for transmission lines having several kinds of underlayer geometries were devised, and the signal characteristics and responses are measured by S-parameter and time domain reflection meter (TDR). The patterns were designed and fabricated with a deep-submicron CMOS DRAM technology having 1 Tungsten and 2 Aluminum metals. From the analysis of measured results on the patterns, it is founded that the effects of underlayter line structures on line parameters (especially line capacitance and resistance) and signal distortions occurred from them cannot be negligible. The results provide useful and insightful understanding in the skew balance of package leads and global signal lines such as high-speed clock and data lines.