• Title/Summary/Keyword: Aluminium metal

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Back Surface Field Properties with Different Surface Conditions for Crystalline Silicon Solar Cells (후면 형상에 따른 결정질 실리콘 태양전지의 후면전계 형성 및 특성)

  • Kim, Hyun-Ho;Kim, Seong-Tak;Park, Sung-Eun;Song, Joo-Yong;Kim, Young-Do;Tark, Sung-Ju;Kwon, Soon-Woo;Yoon, Se-Wang;Son, Chang-Sik;Kim, Dong-Hwan
    • Korean Journal of Materials Research
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    • v.21 no.5
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    • pp.243-249
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    • 2011
  • To reduce manufacturing costs of crystalline silicon solar cells, silicon wafers have become thinner. In relation to this, the properties of the aluminium-back surface field (Al-BSF) are considered an important factor in solar cell performance. Generally, screen-printing and a rapid thermal process (RTP) are utilized together to form the Al-BSF. This study evaluates Al-BSF formation on a (111) textured back surface compared with a (100) flat back surface with variation of ramp up rates from 18 to $89^{\circ}C$/s for the RTP annealing conditions. To make different back surface morphologies, one side texturing using a silicon nitride film and double side texturing were carried out. After aluminium screen-printing, Al-BSF formed according to the RTP annealing conditions. A metal etching process in hydrochloric acid solution was carried out to assess the quality of Al-BSF. Saturation currents were calculated by using quasi-steady-state photoconductance. The surface morphologies observed by scanning electron microscopy and a non-contacting optical profiler. Also, sheet resistances and bulk carrier concentration were measured by a 4-point probe and hall measurement system. From the results, a faster ramp up during Al-BSF formation yielded better quality than a slower ramp up process due to temperature uniformity of silicon and the aluminium surface. Also, in the Al-BSF formation process, the (111) textured back surface is significantly affected by the ramp up rates compared with the (100) flat back surface.

SHEAH BOND STRENGTH OF VENEERING CERAMIC TO ELECTROFORMED GOLD WITH THREE DIFFERENT SURFACE TREATMENT (표면처리방법에 따른 전기성형금속의 도재결합강도)

  • Kim Cheol;Lim Jang-Seop;Jeon Young-Chan;Jeong Chang-Mo;Jeong Hee-Chan
    • The Journal of Korean Academy of Prosthodontics
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    • v.43 no.5
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    • pp.599-610
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    • 2005
  • Purpose: The success of the bonding between electroformed gold and ceramic is dependent on the surface treatment of the pure gold coping. The purpose of this study was to evaluate the bonding strength between the electroformed gold and ceramic with varying surface treatment. Materials and methods: A total of 32 disks,8 were using conventional ceramometal alloy, 24 were using electroforming technique as recommended by manufacturer, were prepared. 24 electroformed disks were divided 3 groups according to surface treatment, i.e. 50 microns aluminium oxide sandblasting(GES-Sand), gold bonder treatment(GES-Bond) and $Rocatec^{TM}$ system(GES-Rocatec). For control group of conventional alloy 50 microns aluminium oxide treatment was done(V-Supragold). Energy dispersive x-ray analysis and scanning electron microscope image were observed. Using universal testing machine, shear bond strength and bonding failure mode at metal-porcelain interface were measured. Results and Conclusion: The following conclusions were drawn: 1. In the energy dispersive x-ray analysis, the Au was main component in electroformed gold(99.9wt%). After surface treatment, a little amount of $Al_2O_3(2.4wt%)$ were found in GES-Sand, and $SiO_2(4wt%)$ in GES-Bond. In GES-Rocatec, however, a large amount of $SiO_2(17.4wt%)$ were found. 2. In the scanning electron microscopy, similar pattern of surface irregu larities were observed in V-Supragold and GES-Sand. In GES-Bond, surface irregularities were increased and globular ceramic particles were observed. In GES-Rocatec, a large amount of silica particles attached to metal surface with increased surface irregularities were observed. 3. The mean shear bond strength values(MPa) in order were $22.9{\pm}3.7(V-Supragold),\;22.1{\pm}3.8(GES-Bond),\;20.1{\pm}2.8(GES-Rocatec)\;and\;13.0{\pm}1.4(GES-Sand)$. There was no significant difference between V-Supragold, GES-Bond, and GES-Rocatec. (P>0.05) 4. Most bonding failures modes were adhesive type in GES-Sand. However, in V-Supragold, GES-Bond and GES-Rocatec, cohesive and combination failures were commonly observed. From the result, with proper surface treatment method electroformed gold may have enough strength compare to conventional ceramometal alloy.

Experimental Study of The Corrosion Protection Performance of The Metal Spraying Process in accordance with ratio of Zn-Al (Zn-Al의 구성비율에 따른 금속용사 공법의 방식성능에 대한 실험적 연구)

  • Kim, Hae;Eom, Sung-Hyun;Jeong, Hyun-Gyu;Lee, Jeong-Bae;Kim, Seong-Soo;Ahn, Jae-Woo
    • Resources Recycling
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    • v.26 no.2
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    • pp.56-65
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    • 2017
  • This study is an experimental study on the corrosion protection performance according to the configuration ratio of the Zn and Al. A metal spraying was used as the arc metal spraying method, a specimen was produced by varying the proportion ratio and coating thickness of the Zn and Al. Experimental methods visually observed to corrosion of the specimen for 1, 3, 7, 15 days was conducted in accordance with the CASS salt spray test. This study has confirmed that the performance of the corrosion protection improved against the increase in the Al content. Further, it was confirmed that excellent perfomance is exhibited when the coating thickness is secured over $80{\mu}m$. In addition, the SEM analysis was performed to observe the cross-sectional shape of the metal spraying specimen after CASS testing. The analysis result showed that the deterioration of the metal spraying coating layer was reduced as the Al content increases.

Estimation of Resource Efficiency and Its Demand for Photovoltaic Systems Using the Life Cycle Assessment (LCA) Method (LCA기법을 활용한 태양광 시스템의 자원효율성 및 자원요구량 예측)

  • Lim, Ji-Ho;Hwang, Yong-Woo;Kim, Jun-Beum;Moon, Jin-Young
    • Journal of Korean Society of Environmental Engineers
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    • v.35 no.7
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    • pp.464-471
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    • 2013
  • In this study, the resource efficiency and future metal resource requirement in photovoltaic (PV) production system were evaluated by using material balance data and life cycle assesment (LCA) method. As a result, in the resource efficiency of ferrous and non-ferrous metal, lead and tin had higher resource efficiency than other materials in all PV systems (SC-Si, MC-Si, CI(G)S, CdTe). In the resource efficiency of rare metals, gallium and rhenium in silicon system and rhenium and rhodium in thin-film system ranked as the first and second high resource efficiency. In case of rare earth metal, gadolinium and samarium took higher resource efficiency. The results of the future metal resource requirement in PV systems showed that 2,545,670 ton of aluminium, 92,069 ton of zinc, 22,044 ton of copper, 1,695 ton of tin and 31 ton of nickel will be needed by 2030 in South Korea, except resource recycling supplement.

Nanodispersion-Strengthened Metallic Materials

  • Weissgaerber, Thomas;Sauer, Christa;Kieback, Bernd
    • Journal of Powder Materials
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    • v.9 no.6
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    • pp.441-448
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    • 2002
  • Dispersions of non-soluble ceramic particles in a metallic matrix can enhance the strength and heat resistance of materials. With the advent of mechanical alloying it became possible to put the theoretical concept into practice by incorporating very fine particles in a flirty uniform distribution into often oxidation- and corrosion- resistant metal matrices. e.g. superalloys. The present paper will give an overview about the mechanical alloying technique as a dry, high energy ball milling process for producing composite metal powders with a fine controlled microstructure. The common way is milling of a mixture of metallic and nonmetallic powders (e.g. oxides. carbides, nitrides, borides) in a high energy ball mill. The heavy mechanical deformation during milling causes also fracture of the ceramic particles to be distributed homogeneously by further milling. The mechanisms of the process are described. To obtain a homogeneous distribution of nano-sized dispersoids in a more ductile matrix (e.g. aluminium-or copper based alloys) a reaction milling is suitable. Dispersoid can be formed in a solid state reaction by introducing materials that react with the matrix either during milling or during a subsequent heat treatment. The pre-conditions for obtaining high quality materials, which require a homogeneous distribution of small dis-persoids, are: milling behaviour of the ductile phase (Al, Cu) will be improved by the additives (e.g. graphite), homogeneous introduction of the additives into the granules is possible and the additive reacts with the matrix or an alloying element to form hard particles that are inert with respect to the matrix also at elevated temperatures. The mechanism of the in-situ formation of dispersoids is described using copper-based alloys as an example. A comparison between the in-situ formation of dispersoids (TiC) in the copper matrix and the milling of Cu-TiC mixtures is given with respect to the microstructure and properties, obtained.

Effects of Ti or Ti/TiN Underlayers on the Crystallographic Texture and Sheet Resistance of Aluminum Thin Films (Ti 또는 Ti/TiN underlayer가 Al 박막의 배향성 및 면저항에 미치는 영향)

  • Lee, Won-Jun;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.10 no.1
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    • pp.90-96
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    • 2000
  • The effects of the type and thickness of underlayers on the crystallographic texture and the sheet resistance of aluminum thin films were studied. Sputtered Ti and Ti/TiN were examined as the underlayer of the aluminum films. The texture and the sheet resistance of the metal thin film stacks were investigated at various thicknesses of Ti or TiN, and the sheet resistance was measured after annealing at $400^{\circ}C$ in an nitrogen ambient. For the Ti underlayer, the minimum thickness to obtain excellent texture of aluminum <111> was 10nm, and the sheet resistance of the metal stack was greatly increased after annealing due to the interdiffusion and reaction of Al and Ti. TiN between Ti and Al could suppress the Al-Ti reaction, while it deteriorated the texture of the aluminum film. For the Ti/TiN underlayer, the minimum Ti thickness to obtain excellent texture of aluminum <111> was 20nm, and the minimum thickness of TiN to function as a diffusion barrier between Ti and Al was 20nm.

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Convergence Study on Fracture at Joint Using Adhesive at Inhomogeneous Materials Bonded with CFRP (CFRP와 결합된 이종재료들에서의 접착제를 이용한 접합부의 파손에 관한 융합 연구)

  • Kim, Jae-Won;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.9 no.5
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    • pp.151-156
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    • 2018
  • In this study, CFRP and metal or nonmetal were bonded with adhesive and the fracture study on this material was carried out. CFRP at the upper side of specimen and metal or nonmetal were assigned at the lower side of specimen by using DCB specimen as the analysis condition. And it was desribed that the structural adhesive were bonded between both upper and lower sides. As this analysis result, the least equivalent stress was shown at the specimen bonded with aluminium. The maximum shear stress was shown to become lowest at the de-bonded CFRP specimen when titanium was used. In conclusion, it was shown that the deformation of specimen became lowest when titanium was used. On the basis of this study result, the esthetic sense can be shown as the fracture data of bonded interface using adhesive are grafted onto the real life.

Design of CFRP-Metal Hybrid Pantograph Upper-arm (탄소섬유 복합재료-금속 하이브리드 팬터그래프 상부암 설계)

  • Jeon, Seung-Woo;Han, Min-Gu;Chang, Seung-Hwan;Cho, Yong-Hyeon;Park, Chul-min
    • Composites Research
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    • v.28 no.5
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    • pp.327-332
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    • 2015
  • In this research, a parametric study was carried out to design a metal-carbon fiber reinforced plastics (CFRP) hybrid pantograph for weight reduction of high speed train (KTX). To design a light-weight and high-stiffness pantograph, some parts of the original steel upper arm was replaced by CFRPs with appropriate stacking sequences. For the parametric study, steel was replaced by aluminium considering structure stiffness and weight of hybrid upperarm of a pantograph. Finite element analysis (FEA) was performed for checking the structure stiffness with varying design parameters. Static vertical load stiffness and weight changing ratio were derived from real CX-PG pantograph model analyses. From the FEA results, the geometries of high-stiffness, light-weight pantograph have been suggested.

Evaluation and Comparison of Nanocomposite Gate Insulator for Flexible Thin Film Transistor

  • Kim, Jin-Su;Jo, Seong-Won;Kim, Do-Il;Hwang, Byeong-Ung;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.278.1-278.1
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    • 2014
  • Organic materials have been explored as the gate dielectric layers in thin film transistors (TFTs) of backplane devices for flexible display because of their inherent mechanical flexibility. However, those materials possess some disadvantages like low dielectric constant and thermal resistance, which might lead to high power consumption and instability. On the other hand, inorganic gate dielectrics show high dielectric constant despite their brittle property. In order to maintain advantages of both materials, it is essential to develop the alternative materials. In this work, we manufactured nanocomposite gate dielectrics composed of organic material and inorganic nanoparticle and integrated them into organic TFTs. For synthesis of nanocomposite gate dielectrics, polyimide (PI) was explored as the organic materials due to its superior thermal stability. Candidate nanoprticles (NPs) of halfnium oxide, titanium oxide and aluminium oxide were considered. In order to realize NP concentration dependent electrical characteristics, furthermore, we have synthesized the different types of nanocomposite gate dielectrics with varying ratio of each inorganic NPs. To analyze gate dielectric properties like the capacitance, metal-Insulator-metal (MIM) structures were prepared together with organic TFTs. The output and transfer characteristics of organic TFTs were monitored by using the semiconductor parameter analyzer (HP4145B), and capacitance and leakage current of MIM structures were measured by the LCR meter (B1500, Agilent). Effects of mechanical cyclic bending of 200,000 times and thermally heating at $400^{\circ}C$ for 1 hour were investigated to analyze mechanical and thermal stability of nanocomposite gate dielectrics. The results will be discussed in detail.

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A HISTOMORPHOMETRIC STUDY OF BONE APPOSITION TO NEWLY DEVELOPED TI-BASED ALLOYS IN RABBIT BONE (가토의 경골에 이식된 새로운 티타늄계 합금 주위의 골형성에 관한 형태학적 연구)

  • Kim, Tae-In
    • The Journal of Korean Academy of Prosthodontics
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    • v.36 no.5
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    • pp.701-720
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    • 1998
  • Research advances in dental implantology have led to the development of several different types of materials and it is anticipated that continued research will lead to advanced dental implant materials. Currently used pure titanium has relatively low hardness and strength which may limit its ability to resist functional loads as a dental implant. Ti-6Al-4V also has potential problems such as corrosion resistance. osseointegration properties and neurologic disorder due to aluminium and vanadium, known as highly toxic elements, contained in Ti-6Al-4V. Newly developed titanium based alloys(Ti-20Zr-3Nb-3Ta-0.2Pd-1In, Ti-20Zr-3Nb-3Ta-0.2Pd) which do not contain toxic metallic components were designed by the Korea Institute of Science and Technology (KIST) with alloy design techniques using Zr, Nb, Ta, Pd, and In which are known as non-toxic elements. Biocompatibility and osseointegration properties of these newly designed alloys were evaluated after implantation in rabbit femur for 3 months. The conclusions were as follows : 1. Mechanical properties of the new designed Ti based alloys(Ti-20Zr-3Nb-3Ta-0.2Pd-1In, Ti-20Zr-3Nb-3Ta-0.2Pd) demonstrated close hardness and tensile strength values to Ti-6Al-4V. 2. New desinged experimental alloys showed stable corrosion resistance similar to the pure Ti but better than Ti-6Al-4V. However, the corrosion rate was higher for the new alloys. 3. Cell culture test showed that the new alloys have similar cell response compared with pure Ti and Ti-6Al-4V with no cell adverse reaction. 4. New designed alloys showed similar bone-metal contact ratio and osseointegration properties compared to pure Ti and Ti-6Al-4V after 3 months implantation in rabbit femur. 5. Four different surface treatments of the metals did not show any statistical difference of the cell growth and bone-metal contact ratio.

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