• Title/Summary/Keyword: AlN layer

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The microstructure and adhesive characteristics of Ti-Al-V-N films prepared by reactive magnetron sputtering (반응성 마그네트론 스퍼터링법으로 제조한 Ti-Al-V-N 박막의 미세조직 및 부착특성에 관한 연구)

  • Sohn, Yong-Un;Lee, Young-Ki
    • Journal of the Korean Society for Heat Treatment
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    • v.12 no.3
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    • pp.199-205
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    • 1999
  • The quaternary Ti-Al-V-N films have been grown on glass substrates by reactive dc and rf magnetron sputter deposition from a Ti-6Al-4V target in mixed Ar-$N_2$ discharges. The Ti-Al-V-N films were investigated by means of X-ray diffraction(XRD), electron probe microanalysis(EPMA) and scratch tester. Both XRD and EPMA results indicated that the Ti-Al-V-N films were of single B1 NaCl phase having columnar structure with the (111) preferred orientation. Scratch tester results showed that the adhesion strength of Ti-Al-V-N films which treated with substrate heating and vacuum annealing was superior to that of as-deposited film. The good adhesion strength was also achieved in the double-layer structure of Ti-Al-V-N/Ti-Al-V/Glass.

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NO2 gas sensor using an AlGaN/GaN Heterostructure FET with SnO2 catalyst deposited by ALD technique (원자막증착법(ALD) SnO2 촉매를 적용한 AlGaN/GaN 이종접합 트랜지스터 NO2 가스센서)

  • Yang, Suhyuk;Kim, Hyungtak
    • Journal of IKEEE
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    • v.24 no.4
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    • pp.1117-1121
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    • 2020
  • In this work, it was confirmed that a SnO2 catalyst deposited by an atomic layer deposition(ALD) process can be employed in AlGaN/GaN heterostructure FET to detect NO2 gas. The fabricated HFET sensors on AlGaN/GaN-on-Si platform demonstrated that the devices with or without n-situ SiN have sensitivity of 5.5 % and 38 % at 200 ℃, respectively with response to 100 ppm-NO2.

A Study on the Fabrication and Structural Properties of Al-Co/AlN-Co Thin Films

  • Han, Chang-Suk;Han, Seung-Oh
    • Korean Journal of Metals and Materials
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    • v.49 no.3
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    • pp.256-263
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    • 2011
  • We have synthesized Al-Co/AlN-Co multilayer films with different layer thicknesses by using a Two-Facing Target Type dc Sputtering (TFTS) system. The deposited films were annealed isothermally at different temperatures and their microstructure, magnetic properties and resistivity were investigated. The magnetization of the as-deposited films was found to be very small, irrespective of layer thickness. It was found that the annealing conditions and layer thickness ratio of Al-Co to AlN-Co (LTR) were able to control the microstructure, as well as the physical properties of the prepared films. The resistivity and magnetization increased and the coercivity decreased with a decreasing LTR. A high resistivity of 2500 ${\mu}{\Omega}-cm$, a magnetization of 360 $emu/cm^3$, and a coercivity of 5 Oe were obtained for the films with LTR=0.175.

Effect of 3C-SiC buffer layer on the characteristics of AlN films supttered on Si Substrates (3C-SiC 버퍼층이 Si 기판위에 스퍼터링된 AlN 막의 특성에 미치는 영향)

  • Ryu, Kyeong-Il;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.04b
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    • pp.3-6
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    • 2009
  • Aluminum nitride (AIN) thin films were deposited on a polycrystalline 3C-SiC intermediate layer by a pulsed reactive magnetron sputtering system. Characteristics of the AIN/SiC heterostructures were investigated by field emission scanning electron microscopy (FE-SEM), atomic force microscopy (AFM), X-ray diffraction (XRD), and Fourier transform infrared spectroscopy (FT-IR). The columnar structure of AIN thin films was observed by FE-SEM. The surface roughness of AlN films on the 3C-SiC buffer layer was measured using AFM. The XRD pattern of AlN films on SiC buffer layers was highly oriented at (002). Full width at half maximum (FWHM) of the rocking curve near (002) reflections was $1.3^{\circ}$. The infrared absorbance spectrum indicated that the residual stress of AIN thin films grown on SiC buffer layers was nearly negligible. The 3C-SiC intermediate layers are promising for the realization of nitride based electronic and mechanical devices.

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Cation Deficiencies in Needles and Fine Roots of Pitch Pine in Seoul Metropolitan Area (首都圈地域에서 리기다소나무 잎과 잔뿌리 속의 陽이온 부족)

  • Rhyu, Tae-Cheol;Kim, Kee-Dae;Kim, Joon-Ho
    • The Korean Journal of Ecology
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    • v.17 no.3
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    • pp.277-286
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    • 1994
  • The contents of major elements were determined in current-year and previous-year needles and fine roots of pitch pine (Pinus yzgida) at 33 sites in Seoul and its vicinity. Contrary to Ca and Al in needles, N, P, Mg and K contents in current-year needles were higher than those in previous-year needles. The N, P, K and Al contents in current-year needles in Seoul were not significantly different from those in rural areas. In contrast, Ca and Mg contents in needles in Seoul were significantly lower than those in suburbs and rural areas. The N /Ca and N /Mg ratios in needles in urban Seoul were higher than those in rural areas. Mg contents in fine roots in soil of 0-5 cm depth increased along with distance from the center of Seoul, while Al contents in fine root in soil of 5-10 cm depth decreased along with distance from the center of Seoul. Al contents in fine roots in soil layer in Seoul and suburbs were higher than those in rural areas. Al contents in fine roots in litter layer were 1 /3 - 1 /2 times lower than those in soil layer for all areas. A1 content in fine roots in deep soil was higher than that in top soil. Therefore growth decline of pitch pine in Seoul and suburbs was thought to be caused by Ca and Mg deficiency in plant tissues and Al toxicity to fine roots. Abnormal vertical distribution of fine roots of pitch pine in Seoul and its vicinity were interpreted as the result of growth reduction of fine roots by Al toxicity in deep layer of acid soil.

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Effect of Laser Ablation on Rear Passivation Stack for N-type Bifacial Solar Cell Application (N형 양면 수광 태양전지를 위한 레이저 공정의 후면 패시베이션 적층 구조 영향성)

  • Kim, Kiryun;Chang, Hyo Sik
    • Korean Journal of Materials Research
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    • v.30 no.5
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    • pp.262-266
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    • 2020
  • In this paper, we investigated the effect of the passivation stack with Al2O3, hydrogenated silicon nitride (SiNx:H) stack and Al2O3, silicon oxynitride (SiONx) stack in the n type bifacial solar cell on monocrystalline silicon. SiNx:H and SiONx films were deposited by plasma enhanced chemical vapor deposition on the Al2O3 thin film deposited by thermal atomic layer deposition. We focus on passivation properties of the two stack structure after laser ablation process in order to improve bifaciality of the cell. Our results showed SiNx:H with Al2O3 stack is 10 mV higher in implied open circuit voltage and 60 ㎲ higher in minority carrier lifetime than SiONx with Al2O3 stack at Ni silicide formation temperature for 1.8% open area ratio. This can be explained by hydrogen passivation at the Al2O3/Si interface and Al2O3 layer of laser damaged area during annealing.

High-temperature Oxidation Kinekics and Scales Formed on the TiAlSiN film (TiAlSiN 코팅의 대기중 고온산화 속도와 스케일 분석)

  • Ji, Gwon-Yong;Park, Sang-Hwan;Kim, Min-Jeong;Park, Sun-Yong;Jeong, Seung-Bu;Lee, Dong-Bok
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.05a
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    • pp.131-132
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    • 2015
  • $Ti_{0.26}Al_{0.16}Si_{0.01}N_{0.57}$ (at%) coatings were synthesized on stainless steel 304 by using arc ion plating systems (AIPS). Targets employed for the deposition were Ti, AlSi(67:33at%) and AlSi(82:18at%). The thickness of TiAlSiN coatings is $4{\mu}m$. The oxidation characteristics of the deposited coatings were studied by thermogravimetric analysis (TGA) in air between 800 and $900^{\circ}C$ for 75 hr. The oxide scale formed on the TiAlSiN coatings consisted of $rutile-TiO_2$ layer and ${\alpha}-Al_2O_3$. At $800^{\circ}C$, the coatings oxidized relatively slowly, and the scales were thin and adherent. When oxidized above $900^{\circ}C$, $TiO_2$ grew fast over the mixed oxide layer, and the oxide scale formed on TiAlSiN coatings was prone to spallation. Microstructural changes of the TiAlSiN coatings that occurred during high temperature oxidation were investigated by EPMA, XRD, SEM and TEM.

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Effect of a 3C-SiC buffer layer on SAW properties of AlN films (3C-SiC 버퍼층이 AlN 박막형 SAW 특성에 미치는 영향)

  • Hoang, Si-Hong;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.235-235
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    • 2009
  • This paper describes the influence of a polycrystalline (poly) 3C-SiC buffer layer on the surface acoustic wave (SAW) properties of poly aluminum nitride (AlN) thin films by comparing the center frequency, insertion loss, the electromechanical coupling coefficient ($k^2$), andthetemperaturecoefficientoffrequency(TCF) of an IDT/AlN/3C-SiC structure with those of an IDT/AlN/Si structure, The poly-AlN thin films with an (0002)-preferred orientation were deposited on a silicon (Si) substrate using a pulsed reactive magnetron sputtering system. Results show that the insertion loss (21.92 dB) and TCF (-18 ppm/$^{\circ}C$) of the IDT/AlN/3C-SiC structure were improved by a closely matched coefficient of thermal expansion (CTE) and small lattice mismatch (1 %) between the AlN and 3C-SiC. However, a drawback is that the $k^2(0.79%)$ and SAW velocity(5020m/s) of the AlN/3C-SiC SAW device were reduced by appearing in some non-(0002)AlN planes such as the (10 $\bar{1}$ 2) and (10 $\bar{1}$ 3) AlN planes in the AlN/SiC film. Although disadvantages were shown to exist, the use of the AlN/3C-SiC structure for SAW applications at high temperatures is possible. The characteristics of the AlN thin films were also evaluated using FT-IR spectra, XRD, and AFM images.

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The effect of heat treatment parameters on the emitter formation of the n-type silicon solar cell (n형 규소 태양전지 emitter형성에 미치는 열처리 변수의 영향)

  • Shim, Ji-Myung;Kim, Young-Kwan
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.18 no.5
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    • pp.179-183
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    • 2008
  • Employing screen printing technology, aluminum is applied to the back side of the n-type silicon wafer to see the effect of the heat treatment parameters on the Voc of the solar cell, Heat treatment at $850^{\circ}C$ produces the highest Voc among various heat treatment conditions. Heat treatment at the temperatures higher than $850^{\circ}C$ results in lower Voc, which is due to the destruction of the Al-Si alloy emitter layer. The destruction of Al-Si layer observed to be caused by the vigorous movement of silicon atoms toward aluminum layer during the heat treatment.

Efficiency Improvement with $Al_2O_3/SiN_x$ Rear Passivation of p-type Mono-crystalline Silicon Solar Cells ($Al_2O_3/SiN_x$ 후면 적층 패시베이션을 이용한 결정질 실리콘 태양전지의 효율 향상 연구)

  • Cheon, Joo Yong;Beak, Sin Hey;Kim, In Seob;Chun, Hui Gon
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.3
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    • pp.47-51
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    • 2013
  • Current research trends of solar cells has focused on the high conversion efficiency and low-cost production technology. Passivation technology that can be easily adapted to mass production. Therefore, this study conducted experiments with aim of the following two methods for the fabrication of high-efficiency crystalline silicon solar cells. In the first task, an attempt is formation of local Al-BSF to a number of locally doped dots to increase the conversion efficiency of solar cells to reduce the loss of $V_{oc}$ overcome. The second major task, rear surface apply in $Al_2O_3/SiN_x$ stack layer, $Al_2O_3$ prominent negative fixed charge characteristics. As the result of task, Local Al-BSF and $Al_2O_3/SiN_x$ stack layer applied to the p-type single crystalline silicon solar cells, the average $V_{oc}$ of 644mV, $I_{sc}$ of 918mV and conversion efficiency of 18.70% were obtained.