• Journal of the Korean Magnetics Society
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• v.7 no.6
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• pp.308-313
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• 1997

The magnetoresistance (MR) and the saturation field behavior of the CoFe-Ag nano granular films as a function of the ferromagnetic underlayer and overlayer materials were investigated. The maximum MR ratio of 25.7 % and the saturation field of 2.1 kOe in the as-deposited 3000 $\AA$ $(Co_{92}Fe_8)_{31}Ag_{69}$ single alloy films at room temperature were obtained. The MR ratio and the saturation field of the 100 $\AA$ alloy film were 1.2 % and 5.2 kOe, respectively. Those of the sandwiched alloy films of 200 $\AA$ thick with the Fe under and overlayer of 100 $\AA$ were 11 % and 1.8 kOe respectively. The reduction of saturation field in the sandwiched alloy films is due to the exchange coupling between the ferromagnetic layers and the alloy layer. Among the Fe and FeNi, the more effective materials to reduce the saturation field of the sandwiched alloy films was Fe.

• Journal of the Korean Magnetics Society
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• v.7 no.1
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• pp.31-37
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• 1997

The magnetoresistance and the saturation field behavior of the Co-Ag nano granular films as a function of the composition and the ferromagnetic underlayer and overlayermaterials were investigated. The maximum magnetoresistance of 23% and the saturation field of 2.3 kOe at room temperature were obtained in the as-deposited 3000$\AA$ $Co_{30}Ag_{70}$ single alloy films. The magnetoresistance and the saturation field of 100$\AA$ $Co_{30}Ag-{70}$ alloy film were 3.65 % and 3.0 kOe respectively. Those of the sandwiched films with 200$\AA$ Fe were 3.3 % and 1.23 kOe respectively. The saturation field of the sandwiched alloy films could be reduced by the exchange coupling between the ferromagnetic layers and the alloy layer. The effective depth of the exchange coupling was approximately 150$\AA$ in each Fe layer. Among the Fe, Co, and FeNi, the most effective materials to reduce the saturation field of the sandwiched alloy films was Fe.

• Korean Journal of Materials Research
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• v.6 no.1
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• pp.49-56
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• 1996

TiO2/Ag 계 적층형 투명 열절연 박막의 최적 제작조건 설정을 위한 기초 연구로써, 스퍼터조건에 따른 결정구조 및 광학특성 변화거동을 관찰하였다. 반응성 스퍼터링에 의한 TiO2박막 제작조건에 따른 결정구조 및 광학특성 변화거동을 관찰하였다. 반응성 스퍼터링에 의한 TiO2 박막 제작시 Po2/PAr$\leq$0.2에서는 $\alpha$-TiO2 의 결정구조였으나, Po2/PAr$\leq$0.2에서는 기판 온도(RT-37$0^{\circ}C$) 및 열처리 온도(100-80$0^{\circ}C$)에 관계없이 non-stoichiometric 화합물로 판명되어, 산소 분압비가 TiO2 의 조성제어에 가장 중요한 변수로 나타났다. TiO2 박막은 열처리 온도의 증가(100-80$0^{\circ}C$)에 따라 굴절률이 증가(2.19-2.37)하는 경향이었는데, 이는 박막의 밀도증가에서 기인하는 것으로 판단된다. Ag 박막은(111)면과 (200)면이 우세한 결정립으로, 기판 온도(RT-37$0^{\circ}C$) 및 열처리(100-80$0^{\circ}C$)에 따라 등축상의 결정립 성장을 관찰할 수 있었다.

• Journal of the Korean Magnetics Society
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• v.9 no.3
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• pp.159-165
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• 1999

Structural, magnetic and magnetoresistance behavior of NiFe/Ag multilayers prepared by a magnetron sputter under an Ar and $Ar/H_2$ atmosphere was studied. It was difficult to make a uniform multilayer by using an Ar atmosphere. However, the uniform multilayers could be fabricated by using an $Ar/H_2$ atmosphere. This was thought to be due to decrease in the energy of the sputtered atom and Ar content of the film. Typical magnetoresistance behavior of the discontinuous NiFe/Ag multilayers appeared when the uniform multilayer was formed and annealed. Substrate temperature did not improve the uniformity of the multilayers. Above 20$0^{\circ}C$ of the substrate temperature, the films were almost formed into granular alloys rather than multilayers.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.103.2-103.2
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• 2011

비정질 실리콘 태양전지의 효율을 증가하기 위하여 많이 사용되는 방법 중 하나는 입사되는 빛의 산란을 증가하여 태양전지의 광흡수를 증가시키는 방법이다. 이를 위하여 양극전극으로 사용되는 TCO층의 일정한 패턴 처리를 통하여 광산란을 증가시키는 방법이 사용되고 있다. 본 연구에서는 나노 임프린트 리소그래피방법을 사용하여 Ag 나노로드를 증착한 기판을 제조하고 이를 비정질 실리콘 태양전지에 적용하였다. 실험결과, 그림과 같이 높이와 너비가 300nm 정도로 일정한 패턴의 Ag 나노로드를 제조하였다. 또한, 그 위에 증착된 Si 박막의 경우, 나노로드 전체를 감싸는 돔 형태로 성장하였다. 이와 같은 나노로드 위에 substrate n-i-p 구조의 비정질 박막 태양전지를 증착하고 그 특성변화를 분석하고자 하였다.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.233-236
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• 2000

The structural, electrical and chemical characteristics of Al alloy thin film with low impurity concentrations AlW deposited by using dc magnetron sputtering deposition are investigated for the applications as data bus line in the TFT-LCD panel. The deposited thin films show the decrease of resistivity and the increase of grain size after the RTA at $300^{\circ}C$ for 20 min.. Moreover, the resistivity of AlW does not show appreciable grain size dependence after RTA. It is concluded that the decrease of resistivity after RTA is due to the increase of grain size. The annealed AlW is found to be hillock free. And for investigating chemical attack in TFT-LCD etching processing the electric potential of AlW alloy for Ag/AgCl were investigated by cyclic voltammetry. When W wt.% of AlW alloy was higher than about 3%, the electric potential of AlW was more positive than ITO's. Therefore AlW alloy thin film can be propose to use for data bus line.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.350-350
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• 2012

TCO 물질로 널리 사용되는 ITO 박막은 우수한 특성에도 불구하고 투과도와 전기적 특성 사이에 trade-off 현상이 존재하여 상온에서 증착시 두 가지 특성을 향상시키는데 큰 어려움이 있다 [1]. 본 실험에서는 ITO와 Ag embedded ITO (ITO-Ag) 샘플의 Ag의 증착 시간과 열처리에 따른 전기적 및 광학적 특성 변화를 연구하였다. 열처리 전에는 ITO-Ag 샘플들의 비저항이 ITO 보다 향상 되는 것을 확인 하였다. 하지만 ITO-Ag 샘플의 Ag 증착 시간이 증가 할수록 투과도는 예상한 바와 같이 계속 저하됨을 확인하였다. 열처리 이후에는 Figure 1에서와 같이 ITO와 ITO-Ag 샘플 모두 비저항과 투과도가 향상 되는 것을 알 수 있는데, 비저항의 경우 ITO-Ag 샘플 보다 ITO 샘플이 더욱 큰 향상을 나타내었다. 이러한 결과는 열처리 과정에서 일어나는 ITO의 결정화, 산소공공의 형성 등을 Ag가 방해하기 때문으로 사료된다. 하지만 투과도의 경우 Ag가 금속임에도 불구하고 박막을 형성하지 않을 정도로 매우 얇게 증착 되었기 때문에 열처리 이후 투과도가 향상되어 ITO와 ITO-Ag 샘플 모두 비슷한 향상을 나타내었다고 사료된다. 즉, embedded된 Ag는 열처리에 의해 전기적으로는 나쁜 영향을 주지만, as-deposit 상태에서는 순수 ITO 보다 좋은 전기적 특성을 나타냄을 알 수 있었으며, 이러한 결과는 유기물 반도체 소자에 적용 가능 할 것으로 사료된다.

• Journal of the Korean Vacuum Society
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• v.15 no.1
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• pp.89-96
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• 2006

Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to less than $0.25{\mu}m$, which results in high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in Ag, Cu, Au, and Al thin films, etc. EM resistance characteristics of Ag, Cu, Au, and Al thin films with high electrical conductivities were investigated by measuring the activation energies from the TTF (Time-to-Failure) analysis. Optical microscope and XPS (X-ray photoelectron spectroscopy) analysis were used for the failure analysis in thin films. Cu thin films showed relatively high activation energy for the electromigration. Thus Cu thin films may be potentially good candidate for the next choice of advanced thin film interconnection materials where high current density and good EM resitance are required. Passivated Al thin films showed the increased MTF(Mean-time-to-Failure) values, that is, the increased EM resistance characteristics due to the dielectric passivation effects at the interface between the dielectric overlayer and the thin film interconnection materials.

• Korean Journal of Optics and Photonics
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• v.3 no.4
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• pp.205-216
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• 1992

Distribution of electric fields of surface plasmons at resonance and off-resonance angles were calculated and compared. As applications of surface plasmon resonance, (1) optical constants of ZnS films overcoated on Ag films were measured as the thickness of ZnS films increased, (2) four surface plasmon resonances distributed spatially due to the different thickness of SiO thin films overcoated on Ag films were observed in a picture frame by employing diverging waves of incidence, and (3) patterns of SiO thin films such as a grating and a character "가" overcoated on Ag films were measured by employing collimated waves of incidence.

• Journal of Convergence for Information Technology
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• v.10 no.8
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• pp.137-143
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• 2020

This study examined the effects of rapid thermal annealing (RTA) on the physical and chemical characteristics of thin silver (Ag) layers on SiO2 coated metal foils. Ag layers were annealed at various temperatures of the range between 150 ℃ and 550 ℃ for 20 min. The surface roughness and resistivity are increased at the annealing temperatures of 550 ℃. We also found that oxygen (O) and silicon (Si) atoms exist at the Ag film surface by using compositional analysis in the annealing temperatures of 550 ℃. The total reflectance is decreased with increasing temperature. These phenomena are due to an out-diffusion of Si atoms from SiO2 layers during the RTA annealing. The results offer the possibility of using it as a substrate for various flexible optoelectronic devices.