• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.73-77
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• 2004

Failure predictions of composite single-lap bonded joints were performed considering both of composite adherend failure and bondline failure. An elastic-perfectly plastic model of adhesive and a delamination failure criterion are used. The failure prediction results such as failure mode and strength have very good agreements with the test results of joint specimens with various bonding methods and parameters. The influence of variations in the effective strength (that is, adhesion performance) and plastic behavior of adhesive on the failure characteristics of composite bonded joints are investigated numerically. The numerical results show that optimal joint strength is archived when adhesive and delamination failure occur in the same time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1018-1021
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.541-546
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• 2001

Application of bonding by adhesives can be found in many industries, particularly in advanced technological domains such as the aeronautical and space industries, automobile manufacture, and electronics. Periodic inspection with conventional ultrasonic NDE techniques is capable of indicating the presence and possible location of crack. Continuous ultrasonic attenuation monitoring has potential to supply information. This study used adhesive-bonded single-lap joints specimen to evaluate such possibility by ultrasonic signal processing method.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1448-1452
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin-film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the tangential forces simultaneously as the probe tip of the equipment approaches to the interface between thin-film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ${\sim}$ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester, the feasibility test was performed to evaluate the adhesive strength of thin-film.

• Proceedings of the KACD Conference
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• 2001.11a
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• pp.559.2-559
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• 2001

Fanning et al.(1995) suggested that the incorporation of filler particles into a system's adhesive could increase the shear bond strength by improving the mechanical properties. In this study, shear bond strengths of experimental filled adhesives with varying filler levels were tested to determine the optimal filler level. The diametrile tensile strength and thickness of each experimental adhesive were also examined to evaluate if there is a relation between shear bond strength and mechanical properties of adhesive.(omitted)

• Journal of the Korean Wood Science and Technology
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• v.24 no.2
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• pp.42-45
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• 1996

A residue from the newsprint waste was investigated as a filler in adhesive for bonding southern pine plywood. The residue was prepared by drying the wet residue to 8% moisture content and grinding the dry material using a laboratory Wiley mitt with a 75-${\mu}m$(200-mesh) screen. The residue was compared to a commercial filler commonly used in structural plywood adhesives. A total of 48 three-ply panels. 12.7mm nominal thickness and 0.3 by 0.3 m in size, were fabricated at two press times(4 and 5 min) and three assembly times(20, 40 and 60 min). Evaluations of the residue were carried out by performance tension shear tests after two 4-hour boil accelerated aging tests on plywood. The test results included tension shear strength and estimated wood failure values. All plywood made with the residue filler were comparable to the control-bonded plywood. These results indicate that residue from the newsprint waste streams would be suitable as filler for plywood adhesives.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.11a
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• pp.163-164
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• 2020

The purpose of this study was to evaluate the shrinkage properties of a tile reinforced with epoxy resin, which has the advantages of high adhesion and low shrinkage, and causes a hardening reaction by chemical bonding with cement mortar. As a result, since the epoxy resin adhesive suppresses the moisture evaporation of the mortar, the drying shrinkage of the mortar itself is reduced, accordingly, the shrinkage of the tile itself is greatly reduced, and it is thought that it is possible to prevent a decrease in adhesion due to shear stress.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.395-403
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• 2012

This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.545-546
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1577-1578
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• 2011