• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.745-746
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• 2006

This lecture introduces new press, adapter and control concepts to size multi-level sintered components. The essential thing here is that the advantages of the multi-plate technology have been applied to the sizing adapter concept. Thus, the new concept meets the demands for a modern P/M manufacture and offers sufficient potential to size any future, complex sintered components such as synchronizer hubs, oil pump wheels and VCT parts with highest precision. Furthermore, it outlines a new flexible concept for the parts transfer, including feeding, orientation and lubrication while responding to the high demands on process stability and short change-over times.

• IMMUNE NETWORK
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• v.9 no.3
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• pp.75-83
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• 2009

Recent years have seen an explosion of new knowledge defining the molecular events that are critical for development and activation of immune cells. Much of this new information has come from a careful molecular dissection of key signal transduction pathways that are initiated when immune cell receptors are engaged. In addition to the receptors themselves and critical effector molecules, these signaling pathways depend on adapters, proteins that have no intrinsic effector function but serve instead as scaffolds to nucleate multimolecular complexes. This review summarizes some of what has been learned about one such adapter protein, SH2 domain-containing leukocyte phosphoprotein of 76 kDa (SLP-76), and how it regulates and integrates signals after engagement of immunoreceptors and integrins on various immune cell lineages.

• Journal of information and communication convergence engineering
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• v.3 no.2
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• pp.96-100
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• 2005

Since ubiquitous embedded software is sensitive to the resources and environment of target system, it should be debugged in the same environment as actual target system. However, existing tools to debug embedded software, in which access to internal signal or resources is limited, are uneconomical. In the thesis, economical and practical USB-JTAG Adapter that can use open GDB is suggested. It can remove existing limitations of environment implementation that have many difficulties in implementing an environment for remote debugging. Hence, the thesis provides economical interfacing environment that can debug ubiquitous embedded software inside remote system.

• Journal of Power Electronics
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• v.19 no.1
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• pp.296-306
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• 2019

The flyback topology is being widely used in power adapters. The coupling capacitance between primary and secondary windings of a flyback transformer is the main path for common-mode (CM) noise conduction. A Y-cap is usually used to effectively suppress EMI noise. However, this results in problems in space, cost, and the danger of safety leakage current. In this paper, the CM noise behaviors due to the electric field coupling of the transformer windings in a flyback adapter with synchronous rectification are analyzed. Then a scheme with balance winding is proposed to reduce the CM noise with a transformer winding design that eliminates the Y-cap. The planar transformer has advantages in terms of its low profile, good heat dissipation and good stray parameter consistency. Based on the proposed scheme, with the help of a full-wave simulation tool, the key parameter influences of the transformer PCB winding design on CM noise are further analyzed. Finally, a PCB transformer for an 18W adapter is designed and tested to verify the effectiveness of the balance winding scheme.

• Proceedings of the KIEE Conference
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• 1983.07a
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• pp.170-171
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• 1983

• The KIPS Transactions:PartA
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• v.10A no.4
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• pp.389-396
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• 2003

InfiniBand technology is being accepted as the future system interconnect to serve as the high-end enterprise fabric for cluster computing. This paper presents the design and implementation of the InfiniBand system interconnect, focusing on an InfiniBand host channel adapter (HCA) based on dual ARM9 processor cores The HCA is an SoC tailed KinCA which connects a host node onto the InfiniBand network both in hardware and in software. Since the ARM9 processor core does not provide necessary features for multiprocessor configuration, novel inter-processor communication and interrupt mechanisms between the two processors were designed and embedded within the KinCA chip. Kinch was fabricated as a 564-pin enhanced BGA (Bail Grid Array) device using 0.18${\mu}{\textrm}{m}$ CMOS technology Mounted on host nodes, it provides 10 Gbps outbound and inbound channels for transmit and receive, respectively, resulting in a high-performance cluster system.

• Journal of IKEEE
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• v.22 no.3
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• pp.613-618
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• 2018

In this paper, an active snubber type flyback converter was applied to a 60W class adapter and its test results are reported by producing a prototype. Especially, the prototype of the adapter was designed for both input voltage of 110V and 220V. The output voltage was designed for 60W with 19V class which is the most commonly used in laptops. The prototype was designed to a volume of about $50cm^3$ and a power density of about $1.22W/cm^3$ to minimize the size and verify portability. The maximum efficiency of the prototype was 90.88% at its maximum load of 60W against input voltage change and 91.04% was observed at 60W under input voltage of 220V. Furthermore, the stability of the output voltage against load power was observed to be within about 0.07%.

• Journal of Advanced Navigation Technology
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• v.19 no.4
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• pp.330-337
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• 2015

A service in the environments of internet of things (IoT) exist various types with automation facilities and sensors. There can configure so many communication protocols to networking facilities and sensors. To provide efficient various kind of service, a middleware platform, is based on the internet protocol network, is needed a unified access with devices, controlling and monitoring huge kind of facilities and sensors, to provide a efficient IoT service and application configurations. In this paper, we propose a middleware that an application and service interact with automation facilities and monitor sensors. The proposed middleware is designed with adapter pattern that one of the software engineering design pattern. The adapter pattern is to ensure communication with each sensor and to make sure of service scalability. Finally, the proposed component middleware shows that variety sensors can be easily configure the service in the IoT environment.

• Journal of IKEEE
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• v.24 no.3
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• pp.828-837
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• 2020

This paper presents the optimal design of planar flyback transformer suitable for small-size and low-profile of AC to DC adapter for 10W tablet. This paper also proposes the injection winding transformer of Hybrid and Drum types capable of the winding method of automatic type and the reduction of transformer size and leakage inductance(L_k) compared to the conventional mass-production flyback transformer with the winding method of manual type. In particular, the injection winding transformer of Drum type proposed in this paper is constructed in a horizontal laying of its transformer to solve the connection problem of copper plate injection winding on the secondary side of the one of Hybrid type. The primary and secondary windings of the injection winding transformer of Hybrid and Drum types used the conventional winding and the copper plate injection winding, respectively. For the injection winding transformer of Hybrid and Drum types proposed in this paper, the optimal design of planar flyback transformer suitable for small-size and low-profile was carried out using Maxwell 2D and 3D tool.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.148-154
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• 2022

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.