• Title/Summary/Keyword: 5 다층박막

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Fabrication of coated conductor by continuous PVD methods (연속 공정 PVD 방법에 의한 coated conductor 제조)

  • Ko, Rock-Kil;Chung, Jun-Ki;Kim, Ho-Sup;Ha, Hong-Soo;Shi, Dongqi;Park, Yu-Mi;Choe, Su-Jeong;Song, Kyu-Jeong;Yoo, Sang-Im;Moon, Seung-Hyun;Park, Chan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07a
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    • pp.93-96
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    • 2004
  • 다층의 산화물 박막 구조를 갖는 coated conductor의 장선 제조를 위해서는 연속 증착 공정이 필요하다. 본 연구에서는 RABiTs와 IBAD 공정을 사용한 texture template을 사용하였으며, 금속 테잎을 연속적으로 이동하면서 증착할 수 있는 박막증착 장치(PLD, sputtering, evaporation)를 구축하여 PVD 방법으로 coated conductor를 제조하였다. $CeO_2/YSZ/Y_2O_3$의 완충층을 sputtering 과 evaporation을 이용하여 2축배향성을 가지는 NiW 위에 연속적으로 증착하였다. YBCO 초전도층은 연속 PLD 방법으로 증착하고, Tc, Ic, XRD, SEM을 통해 그 특성을 분석하였다. 그 결과 RABiTS template을 사용하여 Ic가 34A/cm(@77K)인 0.4m 길이의 coated conductor를 제조하였다. IBAD template를 사용하여 Ic가 34A/cm(@77K)인 0.5m길이의 coated conductor를 제조하였고, Jc는 $1.2MA/cm^2$ 이였다.

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Additional Impurity Roles of Nitrogen and Carbon for Ternary compound W-C-N Diffusion Barrier for Cu interconnect (Cu 금속 배선에 적용되는 질소와 탄소를 첨가한 W-C-N 확산방지막의 질소불순물 거동 연구)

  • Kim, Soo-In;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.16 no.5
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    • pp.348-352
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    • 2007
  • In submicron processes, the feature size of ULSI devices is critical, and it is necessary both to reduce the RC time delay for device speed performance and to enable higher current densities without electromigration. In case of contacts between semiconductor and metal in semiconductor devices, it may be very unstable during the thermal annealing process. To prevent these problems, we deposited tungsten carbon nitride (W-C-N) ternary compound thin film as a diffusion barrier for preventing the interdiffusion between metal and semiconductor. The thickness of W-C-N thin film is $1,000{\AA}$ and the process pressure is 7mTorr during the deposition of thin film. In this work we studied the interface effects W-C-N diffusion barrier using the XRD and 4-point probe.

Exchange Bias Perpendicular Magnetic Anisotropy by Buffer Layer and Inserted Layer in [Pd/Co]5/FeMn Multilayer ([Pd/Co]5/FeMn 막에서의 바닥층과 삽입층에 의한 교환바이어스수직자기이방성)

  • Joo, Ho-Wan;An, Jin-Hee;Lee, Mi-Sun;Kim, Bo-Keun;Choi, Sang-Dea;Lee, Kee-Am
    • Journal of the Korean Magnetics Society
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    • v.14 no.5
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    • pp.192-195
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    • 2004
  • Magnetic properties by exchange biased perpendicular magnetic anisotropy in [Pd(0.8 nm)/Co(0.8 nm)]$_{5}$/FeMn(15 nm) multilayers deposited by dc magnetron sputtering system are investigated. As inserted Pd layer of interface between [Pd/Co] multilayer and FeMn film, the Hex of perpendicular anisotropy was improved from 127 Oe to 145 Oe. But result of an experiment by thermal stability, the Hex of the case that an inserted layer was inserted in decreased from low 20$0^{\circ}C$ in about 5$0^{\circ}C$ more if not inserted. If Ta was a buffer layer, the experiment results along material of buffer layer, the H$_{ex}$ obtained the largest 127 Oe. And if Pd was a buffer layer, H$_{ex}$ obtained the largest 169 Oe. Also, the Hc in buffer layer of Ta and Pd obtained the largest 203 Oe and 453 Oe, respectively.

Thermoelectric Characteristics of the Electroplated Bi-Te Films and Photoresist Process for Fabrication of Micro Thermoelectric Devices (전기도금 공정으로 제조한 Bi-Te 박막의 열전특성 및 미세열전소자 형성용 포토레지스트 공정)

  • Lee, Kwang-Yong;Oh, Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.2 s.43
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    • pp.9-15
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    • 2007
  • Thermoelectric properties of the electrodeposited Bi-Te films and photoresist process have been investigated to apply for thermoelectric thin film devices. After plating in Bi-Te solutions of 20 mM concentration, which were prepared by dissolving $Bi_2O_3$ and $TeO_2$ into 1M $HNO_3$, thermoelectric properties of the films were characterized with variation of the Te/(Bi+Te) ratio in a plating solution. With increasing the Te/(Bi+Te) ratio in the plating solution from 0.5 to 0.65, Seebeck coefficient of Bi-Te films changed from $-59{\mu}V/K$ to $-48{\mu}V/K$ and electrical resistivity was lowered from $1m{\Omega}-cm$ to $0.8m{\Omega}-cm$ due to the increase in the electron concentration. Maximum power factor of $3.5{\times}10^{-4}W/K^2-m$ was obtained for the Bi-Te film with the $Bi_2Te_3$ stoichiometric composition. Using multilayer overhang process, the photoresist pattern to form thermoelectric legs of 30 m depth and 100m diameter was successfully fabricated fur micro thermoelectric device applications.

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Local Magnetization Reversal of FeMn/NiFe Films Using Laser Annealing (Laser 열처리를 이용한 FeMn/NiFe 박막의 자화 반전)

  • Choi, S.D.;Jin, D.H.;Kim, S.W.;Kim, Y.S.;Lee, K.A.;Lee, S.S.;Hwang, D.G.
    • Journal of the Korean Magnetics Society
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    • v.14 no.6
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    • pp.228-231
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    • 2004
  • We have studied local magnetization reversal and magnetic properties induced by Laser annealing method in the strip-patterned Ta/NiFe/FeMn/Ta and Ta/NiFe/FeMn/NiFe/Ta multilayers fabricated by ion-beam deposition. The films were exposed to the emission of the DPSS (Diode Pumped Solid State, Nd:YAG) laser under 600 G. The laser beam intensity increased up to 440 mW. When the laser illuminated the patterned film with the power of above 200 m W, the intensity of MR peak located in +87 Oe shrunk. A new MR peak was generated at -63 Oe. When the laser power is 400 mW, the location of positive MR peak(H$\sub$ex/) was changed slightly from +87 Oe to +76 Oe, and the MR ratio was decreased from 0.9% to 0.1 %. On the other hand, the new (negative) MR peak shifted from -63 Oe to -80 Oe, with the MR ratio increased up to 0.3%. As the illuminated area expanded, the intensity of opposite MR peak increased and it of negative MR peak decreased. This proved that the local reversal of exchange biasing should be realized by laser annealing.

The Optical properties of Fe2O3/Na3AlF6/Fe2O3/Cu, Al, Cr Multi Layered Thin Film depending on the Optical Thickness (Fe2O3/Na3AlF6/Fe2O3/Cu, Al, Cr 다층박막의 광학적 두께에 따른 광학특성)

  • Kim, Jun-Sik;Jang, Gang-Jae;Jang, Gun-Eik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.7
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    • pp.665-668
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    • 2008
  • Multi-layered thin films of $Fe_2O_3/Na_3AlF_6/Fe_2O_3/Cu$, Cr, Al were deposited on glass substrate by evaporation process. As high and low refractive index material, $Fe_2O_3$ and $Na_3AlF_6$ were selected and additionally Cu, Al and Cr were chosen as mid reflective layer respectively. Optical properties including reflectance were systematically studied depending on optical thickness of $Na_3AlF_6$ especially $0.25{\lambda}$ and $0.5{\lambda}$. In order to expect the experimental result, the simulation program, the Essential Macleod Program(EMP) was adopted and compared with the experimental data. Based on the results taken by spectrophotometer at viewing angle $45^{\circ}C$, the $Fe_2O_3/Na_3AlF_6/Fe_2O_3/Cu$ show the colour rage between red and orange in $0.25{\lambda}$ and green and pupple in $0.5{\lambda}$ respectively. When the Al was used as mid reflective layers in $Fe_2O_3/Na_3AlF_6/Fe_2O_3$ system, typical yellow colour and mixed colour between green and pupple were appeared in $0.25{\lambda}$ and $0.5{\lambda}$ of $Na_3AlF_6$ respectively. As compared the experimental result to simulation data, it was found out that the experimental data is relatively well matched with the EMP simulation data.

A Study on the Optimization of Silicon Antiresonant Reflecting Optical Waveguides (ARROW) for Integrated Optical Sensor Applications (집적광학 센서 응용에 적합한 실리콘 비공진 반사형 광도파로 최적화에 관한 연구)

  • Jung, Hong-Sik
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.10 no.5
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    • pp.153-160
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    • 2010
  • We optimized the Si(substrate)/$SiO_2$(cladding)/$Si_3N_4$(antiresonant cladding)/$SiO_2$(core)/air multi-layers rib-optical waveguides of antiresonant reflecting optical waveguide (ARROW) for integrated optical biosensor structure utilizing beam propagation method (BPM). Thickness of anti-resonant cladding was derived to minimize the propagation loss and leaky field mode deeply related with evanescent mode was theoretically derived. Depth, width, refractive index and cladding thickness of anti-resonant cladding were numerically calculated into 2.3${\mu}m$, 5${\mu}m$, 1.488, and 0.11${\mu}m$ respectively to minimize propagation loss using the BPM simulation tool. Finally one- and two-dimensional propagation characteristics of ARROW was confirmed.

Effect of Substrata Surface Energy on Light Scattering of a Low Loss Mirror (기판의 표면에너지가 반사경의 산란에 미치는 영향)

  • Lee, Beom-Sik;Yu, Yeon-Serk;Lee, Jae-Cheul;Hur, Deog-Jae;Cho, Hyun-Ju
    • Korean Journal of Optics and Photonics
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    • v.18 no.6
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    • pp.452-460
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    • 2007
  • Ultra-low loss ZERODUR and fused silica mirrors were manufactured and their light scattering characteristics were investigated. For this purpose, ZERODUR and fused silica substrates were super-polished by the bowl feed method. The surface roughness were 0.292 ${\AA}$ and 0.326 ${\AA}$ in rms for ZERODUR and fused silica, respectively. To obtain the high reflectivity, 22 thin film layers of $SiO_2$ and $Ta_2O_5$ were deposited by Ion Beam Sputtering. The measured light scattering of ZERODUR and fused silica mirror were 30.9 ppm and 4.6 ppm, respectively. This shows that the substrate surface roughness is not the only parameter which determines the light scattering of the mirror. In order to investigate the mechanism for additional light scattering of the ZERODUR mirror, the surface roughness of the mirror was measured by AFM and was found to be 2.3 times higher than that of the fused silica mirror. It is believed that there is some mismatch at the interface between the substrate and the first thin film layer which leads to the increased mirror surface roughness. To clarify this, the contact angle measurements were performed by SEO 300A, based on the Giriflaco-Good-Fowkes-Young method. The fused silica substrates with 0.46 ${\AA}$ in its physical surface roughness shows lower contact angle than that of the ZERODUR substrate with 0.31 ${\AA}$. This indicates that the thin film surface roughness is determined by not only its surface roughness but also the surface energy of the substrate, which depends on the chemical composition or crystalline orientation of the materials. The surface energy of each substrate was calculated from a contact angle measurement, and it shows that the higher the surface energy of the substrate, the better the surface roughness of the thin film.

The Dielectric Properties of the PZT Multilayered Thin Films for FRAM (FRAM 응용을 위한 PZT 다층 박막의 유전 특성)

  • Nam, Sugn-Pill;Lee, Sang-Chul;Lee, Sang-Heon;Bea, Seon-Gi;Lee, Young-Hie
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.1618-1620
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    • 2004
  • The $Pb(Zr_{0.4}Ti_{0.6})O_3/Pb(Zr_{0.6}Ti_{0.4})O_3$ [PZT(4060)/(6040)] multilayered thin films were deposited by RF Sputtering method on the Pt/Ti/$SiO_2$/Si substrate. This procedure was repeated several times to form PZT(4060)/(6040) heterolayerd thin films. The effects on the structural and dielectric properties of PZT multilayered thin films were investigated. The MFM(Metal Ferroelectric Metal) type capacitors were made using the PZT(4060)/(6040) multilayered thin films deposited with optimum deposition condition. An enhanced dielectric property was observed in the PZT(4060)/(6040) multilayered thin films. The relative dielectric constant and dielectric loss at 100Hz of the PZT(4060)/(6040)-5 multilayered thin films were about 1106 and 0.016, respectively.

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Growth and Characterization of Superconducting Thin Films of BiSrCaCuO / Bi ( Pb ) SrcaCuO Multilayers (BiSrCaCuO / Bi ( Pb ) SrCaCuO의 다층구조를 갖는 초전도 박막의 성장 및 특성)

  • Mun, Gwang-Seok;Gwon, Tae-Ha
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.30 no.4
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    • pp.350-356
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    • 1994
  • We have prepared superconducting Bi-Pb-Sr-Ca.Cu-O thin films by RF magnetron sputtering technique, on heated MgO(100) substrates. Sputtering was carried out in a mixture of argon and oxygen(10%) and the pressure was maintained at 5 mTorr during deposition. The substrate temperature was maintained $400^{\circ}C$ during deposition. The films sputtered were amorphous and insulating. All the films became superconducting by annealing, The films annealed at $880^{\circ}C$ for 30 minutes in air showed high-Tc phase with zero resistivity of 93K. These results indicate that the growth of the high-Tc phase is promoted by the presence of Pb at annealing temperature.

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