• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.168-176
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• 2006

Nowadays, Three dimensional printing (3DP) technique that is one of solid freeform fabrication (SFF) technology has been notable issue, and has been applied by various fields. The SFF system can fabricate three dimensional objects of solid freeform with high speed and low cost using ink jet printing technology. In this research, a SFF system to analyze 3DP process technology is developed. We applied sliding mode control with sliding perturbation observer (SMCSPO) algorithm and minimized position error to the developed SFF system. We analyzed and optimized process variables such as jetted volume, layer thickness, powder bed and so on experimentally. Also. the dimensional error of a developed SFF system is evaluated. Finally, the feasibility of application to bio manufacturing is presented through successful fabrication of teeth and cranium model.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.3-10
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• 2002

In this study on machine measuring system based on solid feature was developed. This system was applied with injection mold using 3 dimensional solid modeler for verification. Developed program include pre-processor, main processor, and post processor. In pre-processor there are functions which check intersection, simulate motion of probe and calculate measuring time. Main processor generates measuring path and output NC code in Unigraphics. In post-processor functions that include evaluation of undercut or overcut and display of measuring procedure are offered. In addition analysis module for quality control of measured data on manufactured product was developed with geometric and dimensional tolerance concept. As the result developed program could get stability of system, precision of product, rapidity and cost down of manufacturing process compared with before measuring process.

• Journal of the Korean Society of Costume
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• v.55 no.5 s.95
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• pp.55-64
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• 2005

The concern with three-dimensional measurement has been growing in recent years. And over the last few years, several studies have been made on three-dimensional measurement. Some of the studies using a three-dimensional measurement have focused on type of form of human body and evaluation of fitness. But there has been no study about applications of three-dimensional measurement system for shape analysis. So, the purpose of this study was to investigate about application of three-dimensional mea-surement system lot shape analysis. The instrument and tools for three-dimensional measurement was Whole Body 3D scanner(model name: Exyma-WBS2H). Analysis program used in experiment is Rapid Form 2004 PPI (INUS technology, Int, Korea). The following results were obtained; 1. The point data using three-dimensional measurement system built 3D model. 2. The three-dimensional data were used to analyze length and curvature of shape. 3. The shape using three-dimensional measurement system could be used in variety field.

• Journal of the Korean Mathematical Society
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• v.34 no.1
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• pp.23-42
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• 1997

A 6-dimensional sphere considered as a homogeneous space $G_2/SU(3)$ where $G_2$ is the group of automorphism of the octonians O. From this representation, we can define an almost comlex structure on a 6-dimensional sphere by making use of the vector cross product of the octonians. Also it is known that a homogeneous space $G_2/U(2)$ coincides with the Grassmann manifold of oriented 2-planes of a 7-dimensional Euclidean space.

• Current Applied Physics
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• v.18 no.11
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• pp.1235-1239
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• 2018

We present a novel process to fabricate three-dimensional (3D) metallic patterns from 3D printed polymeric structures utilizing different hygroscopic swelling behavior of two different polymeric materials. 3D patterns are printed with two different polymers as cube shape. The surface of the 3D printed polymeric structures is plated with nickel by an electroless plating method. The nickel patterns on the surface of the 3D printed cube shape structure are formed by removing sacrificial layers using the difference in the rate of hygroscopic swelling between two printing polymer materials. The hygroscopic behavior on the interfaced structure was modeled with COMSOL Multiphysics. The surface and electrical properties of the fabricated three-dimensional patterns were analyzed and characterized.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.1
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• pp.99-104
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• 2013

As a demand for the portable device requiring smaller size and better performance is in hike, reducing the size of conventionally used planar 2 dimensional integration circuit(IC) cannot be a solution for the enhancement of the semiconductor integration circuit technology due to an increase in RC delay among interconnects. To address this problem, a new technology of 3 dimensional integration circuit (3D-IC) has been developing. In this study, three-dimensional integrated device was investigated due to improve of reducing the size, interconnection problem, high system performance and functionality.

• Laser Solutions
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• v.16 no.4
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• pp.17-23
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• 2013

The research for the development of roll-to-roll printing process is actively underway on behalf of the existing semiconductor process. The roll-to-roll printing system can make the electronic devices to low-cost mass production. This study is performed for developing the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser engraving technology is used to create printable roll and the printable roll is made out of the chrome coated roll after coating copper and polymer on the surface of steel roll, ablating the polymer on the surface of roll and etching the roll. The 3 dimensional laser scanner and roll rotating systems are constructed and the system control program is developed. We have used the fiber laser of 100 W grade, the 3 dimensional laser scanner and the 3 axes moving stage system with a rotating axis. We have found the optimal conditions by performing the laser patterning experiments and can make the minimum line width of $24{\mu}m$ by using the developed 3 dimensional laser scanner system.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.3
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• pp.328-336
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• 2017

The exit surface of a lens is designed using a three-dimensional free-form expression in order to easily modify a curved surface. This enables the design of numerical values and mathematical things using three-dimensional free-form expression, and enhances precision because it can be fine-tuned via numerical control. The standard of "Classification of Luminaire Light Distribution" for outdoor lighting fixtures by IESNA is adopted in order to examine the correlation between three-dimensional free-form surface expression and lighting performance. The variation of light distribution type and range is analyzed using the values of maximum light intensity and 50% light intensity. The actual tolerance occurs owing to parameters such as the thickness of the lens, the distance between LEDs, and the movement of the center of the incident surface; the effects of changes in these parameters on the performance are compared and analyzed.

• Interdisciplinary Bio Central
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• v.3 no.3
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• pp.9.1-9.5
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• 2011

Entity Attribute Value (EAV) is the widely used solution to represent high dimensional and sparse data, but EAV is not search efficient for knowledge extraction. In this paper, we have proposed a search efficient data model: Optimized Entity Attribute Value (OEAV) for physical representation of high dimensional and sparse data as an alternative of widely used EAV. We have implemented both EAV and OEAV models in a data warehousing en-vironment and performed different relational and warehouse queries on both the models. The experimental results show that OEAV is dramatically search efficient and occupy less storage space compared to EAV.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.