• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.3
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• pp.233-237
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• 2002

A giga-bit DRAM(dynamic random access memory) technology with W/WNx/poly-Si dual gate electrode is presented in 7his papers. We fabricated $0.16\mu\textrm{m}$ CMOS using this technology and succeeded in suppressing short-channel effects. The saturation current of nMOS and surface-channel pMOS(SC-pMOS) with a $0.16\mu\textrm{m}$ gate was observed 330 $\mu\A/\mu\textrm{m}$ and 100 $\mu\A/\mu\textrm{m}$ respectively. The lower salutation current of SC-pMOS is due to the p-doped poly gate depletion. SC-pMOS shows good DIBL(dram-induced harrier lowering) and sub-threshold characteristics, and there was no boron penetration.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.11-15
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• 2002

3 V, 2.46GHz Low Noise Amplifier (LNA) have been designed for standard 0.35$\mu\textrm{m}$ CMOS process with one poly and four metal layers. This design includes on-chip biasing, matching network and multilayer spiral inductors. The single-ended amplifier provides a forward gain of 20.5dB with a noise figure 3.35dB, and an IIP3 of -6dBm while drawing 59mW total Power consumption

• Journal of Korea Multimedia Society
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• v.6 no.1
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• pp.161-166
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• 2003

This paper presents a high gain LNA for a bluetooth application using 0.25$\mu\textrm{m}$ CMOS technology. The conventional one stage LNA has a low power gain. The presented one stage LNA using a cascode inverter LNA with a voltage reference and without a choke inductor has an improved Power gain. Simulation results of the 2.4GHz designed LNA shows a high power gain of 21dB, a noise figure of 2.2dB, and the power consumption of 255mW at 2.5V power supply.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.273-279
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• 2002

This paper presents a fabrication technology for the integration of single crystal Si microstructures with on-chip circuitry. It is a dissolved wafer technique that combines an electro-chemical etch-stop for the protection of circuitry with an impurity-based etch-stop for the microstructures, both of which are defined in an n-epi layer on a p-type Si wafer. A CMOS op. amp. has been integrated with $p^{++}$ Si accelerometers using this process. It has a gain of 68 dB and an output swing within 0.2 V of its power supplies, unaffected by the wafer dissolution. The accelerometers have $3{\;}\mu\textrm{m}$ thick suspension beams and $15{\;}\mu\textrm{m}$ thick proof masses. The structural and electrical integrity of the fabricated devices demonstrates the success of the fabrication process. A variety of lead transfer methods are shown, and process details are discussed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.10
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• pp.25-34
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• 2002

In this paper, silicidation induced Schottky contact area was obtained using the current voltage(I-V) characteristics of shallow cobalt silicided p+-n and n+-p junctions. In reverse bias region, Poole-Frenkel barrier lowering influenced predominantly the reverse leakage current, masking thereby the effect of Schottky contact formation. However, Schottky contact was conclusively shown to be the root cause of the modified I-V behavior of n+-p junction in the forward bias region. The increase of leakage current in silicided n+-p diodes is consistent with the formation of Schottky contact via cobalt slicide penetrating into the p-substrate or near to the junction area and generating trap sites. The increase of reverse leakage current is proven to be attributed to the penetration of silicide into depletion region in case of the perimeter intensive n+-p junction. In case of the area intensive n+-p junction, the silicide penetrated near to the depletion region. There is no formation of Schottky contact in case of the p+-n junction where no increase in the leakage current is monitored. The Schottky contact amounting to less than 0.01% of the total junction was extracted by simultaneous characterization of forward and reverse characteristics of silicided n+-p diode.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.9
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• pp.11-17
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• 2004

This paper describes the implementation of monolithic optical transceiver circuitry being used as a part of the fiber optic modules. It has been fabricated in 0.6 ${\mu}{\textrm}{m}$ 2-poly 3-metal silicon CMOS analog technology and operates at 155.52 Mbps(STM-1) data rates. It drives laser diode to transmit intensity modulated optical signal according to 155.52 Mbps electrical data from system. Also, it receives 155.52 Mbps optical data that transmitted from other systems and converts it to electrical data using photo diode and amplifier. To avoid noise and interference between transmitter and receiver on one chip, layout techniques such as special placement, power supply separation, guard ring, and protection wall were used in the design. The die area is 4 ${\times}$ 4 $\textrm{mm}^2$, and it has 32.3 ps rms and 335.9 ps peak to peak jitter on loopback testing. the measured power dissipation of whole chip is 1.15 W(230 mW) with a single 5 V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.11
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• pp.35-42
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• 2004

A CMOS folding ADC with transistor differential pair folding circuit for low power consumption and high speed operation is presented in this paper. This paper explains the theory of transistor differential pair folding technique and many advantages compared with conventional folding and interpolation circuits. A ADC based on transistor differential pair folding circuit uses 16 fine comparators and 32 interpolation resistors. So it is possible to achieve low power consumption, high speed operation and small chip size. Design technology is based on fully standard 0.25${\mu}{\textrm}{m}$ double poly 2 metal n-well CMOS process. A power consumption is 45mW at 2.5V applied voltage and 250MHz sampling frequency. The INL and DNL are within $\pm$0.15LSB and $\pm$0.15LSB respectively. The SNDR is approximately 50dB at 10MHz input frequency.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.1
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• pp.7-18
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• 2002

Single-ended differential RF circuit topologies fully utilizing complementary characteristics of both NMOS and PMOS are proposed, which have inherent advantage of both single-ended and differential circuits. Using this concept, we propose a CCPP (Complementary CMOS parallel push-pull) amplifier which has single-ended input/output with differential amplifying characteristics, leading to more than 30 dB improvement on $IIP_2$. In addition, complementary resistive mixer is also proposed, which provides not only differential IF outputs from single-ended RF input, but much better linearity as well as isolation characteristics. Experimental results using $0.35{\;}\mu\textrm{m}$ CMOS process show that, compared with conventional NMOS resistive mixer, the proposed mixer shows 15 dB better LO-to-IF isolation, 4.6 dB better $IIP_2$, and 4.5 dB better $IIP_3$performances.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.11
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• pp.46-54
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• 1999

The output values of cellular neural networks would have errors because they can be stabilized at local minimums depending on the initial states of each cell. So, in this paper, we design the $6\times6$cellular neural networks with annealing capability which guarantees that the outputs reaches the global minimum to have correct output values independent of the initial states of each cell. This chip is designed using a $0.8\mu\textrm{m}$ CMOS technology The designed chip contains about 15,000 transistors and the chip size is about $2.89\times2.89\textrm{mm}^2$. The simulation results of edge extraction and hole filling using the designed circuit show that the outputs values would have errors in un-annealed case, but not in annealed case. In the simulation, the annealing time of $3\musec$ is employed.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.7A
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• pp.1090-1098
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• 1999

In this paper ERP-4 viterbi decoder for magnetic disk read channel is designed. The viterbi decoder consists of ACS circuit, path memory circuit, minimum detection circuit, and output selection circuit. In the viterbi decoder the number of state is reduced from 8 to 6 using (1,7) RLL codes and modulo comparison based on 2's complement arithmetic is applied to handle overflow problem of ACS module. Also to determine the correct symbol values in nonconvergent condition of path memory, pipelined minimum detector which determines path with minimum state metric is used. The EPR-4 viterbi decoder is designed using 0.35${\mu}{\textrm}{m}$ CMOS technology and consists of about 15,300 transistors and has 250 Mbps data rates under 3.3 volts.