• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.59-64
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• 2022

Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.55-59
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• 2012

Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.

• Korean Chemical Engineering Research
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• v.52 no.1
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• pp.26-39
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• 2014

Cu interconnection in electronic devices is fabricated via damascene process including Cu electrodeposition. In this review, Cu electrodeposition and superfilling for fabricating Cu interconnection are introduced. Superfilling results from the influences of organic additives in the electrolyte for Cu electrodeposition, and this is enabled by the local enhancement of Cu electrodeposition at the bottom of filling feature formed on the wafer through manipulating the surface coverage of organic additives. The dimension of metal interconnection has been constantly reduced to increase the integrity of electronic devices, and the width of interconnection reaches the range of few tens of nanometer. This size reduction raises the issues, which are the deterioration of electrical property and the reliability of Cu interconnection, and the difficulty of Cu superfilling. The various researches on the development of organic additives for the modification of Cu microstructure, the application of pulse and pulse-reverse electrodeposition, Cu-based alloy superfilling for improvement of reliability, and the enhancement of superfilling phenomenon to overcome the current problems are addressed in this review.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1567-1573
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• 2010

In printing systems, the reliability of printed material depends on the ability of the toner film to remain adhered to the paper surface. In order to measure the strength between the toner film and the paper surface, a peel-off test is often performed. After conducting the test, the amount of toner film remaining on the paper is measured in order to determine the interfacial strength. The results of this test can be affected by many factors such as the peeling rate, weight of the roller used, and dwell time of tape. Sensitivity analysis was performed with respect to peeling rate, weight of roller and dwell time of tape at different levels. It was found that the interfacial strength increased with an increase in these main parameters. On the other hand, the trend with respect to the percentage of toner loss was different. Further, the interfacial strength and percentage of toner loss were significantly affected by the peeling rate.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.4
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• pp.8-12
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• 2009

We propose BMPA(balanced multimedia packet allocation) scheme. This scheme considers the issue of optimal sub-carrier allocation in OFDMA multicast system. When RT(real time) packets and NRT(non-real time) packets arrive at the same time, BMPA scheme gives higher weight to RT packets than NRT packets and then, it allocates sub-carriers according to the total weight sum of packets in each user. This process acts as both packet scheduler and sub-carrier allocation. Therefore, each user receives multimedia packets with reliability. With simulation results, it shows that BMPA scheme ensures long-term system throughput and, in average RT packet delay, BMPA scheme greatly outperforms multi-user water-filling algorithm.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.5A
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• pp.447-451
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• 2010

We propose an advanced BMPA (balanced multimedia packet allocation) scheme. The proposed scheme considers the optimal resource allocation problem in OFDMA system. When NRT (non-real time), RT (real time), multicast packets arrive at the same time in OFDMA system, the advanced BMPA chooses the best sub-carrier as a multicast channel for multicast packets, gives more weight to RT packets and multicast packets than NRT packets and allocates sub-carriers according to the total weight sum of packets in each user. With simulation results, this paper shows that the advanced BMPA scheme ensures QoS (long-term system throughput and multimedia packet delay) in heterogeneous traffic compared with multicast MU-WF (multi-user water-filling) and BMPA schemes.

• Journal of Broadcast Engineering
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• v.17 no.2
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• pp.363-373
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• 2012

This paper proposes a method to generate a depth image at an arbitrary intermediate view-point, which is targeting a video service for free-view, auto-stereoscopy, holography, etc. It assumes that the leftmost and the rightmost depth images are given and they both have been camera-calibrated and image-rectified. This method calculates and uses a disparity increment per depth value. In this paper, it is obtained by stereo matching for the given two depth image by considering more general cases. The disparity increment is used to find the location in the intermediate view-point depth image (IVPD) for each depth in the given images. Thus, this paper finds two IVPDs, from left image and from right image. Noises are removed and holes are filled in each IVPDs and the two results are combined to get the final IVPD. The proposed method was implemented and applied to several test sequences. The results revealed that the quality of the generated IVPD corresponds to 33.84dB of PSNR in average and it takes about 1 second to generate a HD IVPD. We evaluate that this image quality is quite good by considering the low correspondency among the left images, intermediate images, and the right images in the test sequences. If the execution speed is improved, the proposed method can be a very useful method to generate an IVPD at an arbitrary view-point, we believe.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.8
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• pp.1908-1918
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• 2013

Free-view, auto-stereoscopic video service is a next generation broadcasting system which offers a three-dimensional video, images of the various point are needed. This paper proposes a method that parallelizes the algorithm for arbitrary intermediate view-point image fast generation and make it faster using General Propose Graphic Processing Unit(GPGPU) with help of the Compute Unified Device Architecture(CUDA). It uses a parallelized stereo-matching method between the leftmost and the rightmost depth images to obtain disparity information and It use data calculated disparity increment per depth value. The disparity increment is used to find the location in the intermediate view-point image for each depth in the given images. Then, It is eliminate to disocclusions complement each other and remaining holes are filled image using hole-filling method and to get the final intermediate view-point image. The proposed method was implemented and applied to several test sequences. The results revealed that the quality of the generated intermediate view-point image corresponds to 30.47dB of PSNR in average and it takes about 38 frames per second to generate a Full HD intermediate view-point image.