• Journal of The Korean Radiological Technologist Association
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• v.27 no.2
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• pp.57-65
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• 2001

This study was performed to measure about exposure dose during simple abdomen x-ray Radiography. The exposure dose was measured by PDD, surface dose, percentage scatter dose, respectively. The result was as followed: 1. When tube voltage were increased wi

• Journal of the Korean institute of surface engineering
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• v.48 no.1
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• pp.7-10
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• 2015

Recently, oxide TFTs has attracted a lot of interests due to their outstanding properties such as excellent environmental stability, high mobility, wide-band gap energy and high transparency, and investigated through the method using vacuum system and wet solution. In the case of the method using wet solution, process is very simple, however, annealing process should be included. In this study, to overcome the problem of annealing process, atmospheric pressure plasma was used for annealing, and the electrical characteristics such as on/off ration and mobility of device were investigated.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.139-139
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• 2013

본 발표에서는 3차원 안테나 유도 방식(3DAI)의 대기압 플라즈마 발생기술을 소개하고 그 응용에 대해 논의하고자 한다. 3DAI (3 Dimensional Antenna Induced) 방식의 가장 큰 특징은 하나의 전원 장치로 아크 발생 없이 다수의 금속 전극에서 플라즈마를 발생 할 수 있다는 특징과 3차원과 같은 높이 100 mm 이상의 큰 volume에서 플라즈마를 발생할 수 있는 기술로 그 적용을 확대할 수 있을 것으로 기대되는 기술이다. 다수의 금속 전극에서 플라즈마를 발생 시키는 기술은 대면적 처리가 가능하다는 의미이며 금속 전극을 사용한다는 것은 반 영구적 전극 사용을 할 수 있다는 의미로 해석할 수 있다. 본 연구에서는 신발 접착에 필요한 플라즈마 처리면적 350 mm, 플라즈마 발생 높이 100 mm급 3DAI 대기압 플라즈마 발생 장치를 개발하였다. 개발된 3DAI 플라즈마 기술을 이용하여 신발 재료 접착에 적용하였다. 화학 약품인 프라이머를 사용하지 않고 수성접착제를 사용하여 밑창인 고무와 중창인 IP 및 PU 등에서 모두 초기 접착 강도 1.5 kg/cm 이상, 경시 접착강도 3.5 kg/cm 이상으로 모재가 대부분 파괴되는 접착 강도를 얻었으며, 접착 수율이 99.9% 이상의 높은 생산성을 보여주고 있다.

• Proceedings of the Membrane Society of Korea Conference
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• 1997.04b
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• pp.3-10
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• 1997

제염농축공정은 증류, 증발법을 일반적으로 사용하나, 에너지 절약차원에서 전기투석 (Electro dialysis)장치를 증발기 선단에 도입한 복합공정을 국내에서도 사용하고 있는 실정이다. 그러나, 전기투석장치는 전기적인 소모와 막의 재생, 교체처리비가 문제점이 되므로 역삼투 장치를 제염농축 공정 최선단에 도입한 복합공정을 이용할 경우 전기 투석 및 증발 복합공정에 비해 40%의 에너지 절감 효과를 기대할 수 있다. 이와 같은 장점에도 불구하고 역삼투 공정은 공급용액의 삼투압보다 큰 적용압력을 막표면에 가하여 물질분리를 수행하므로 농축공정에서 유발되는 배제액 농도의 상승은 삼투압의 증가를 일으켜 실적적용압력의 효과를 떨어뜨리게 되며 결과적으로 농축효과를 감소시키게 된다. 본 연구에서는 효과적인 염농축 공정을 위하여 막모듈 투과부에 고농도 삼투압 감소액(osmotic sink solution)을 향류식(막투과흐름을 맞받아치며 흐르는 방식)으로 유입시키는 향류식 역삼투 (counter-current reverse osmosis, CCRO) 나권형 모듈을 고안 제작하였으며, 제작된 모듈을 기존 역삼투 공정과 향류식 염삼투 공정에 적용하여 염농축도의 성능을 상호 비교하고 염농축에 관계되는 공급농도, 공급유량, 투과유량, 배제유량, 향류 유입유량, 압력구배, 삼투압차 및 농축단수 등의 인자들을 이용하여 두 공정에 대한 염농축 분리조작의 제반조건과 제작된 모듈 내의 농축관련 특성을 실험 및 수치적으로 비교, 고찰하였다.

• Korean Chemical Engineering Research
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• v.48 no.5
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• pp.556-560
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• 2010

An atmospheric surface modification using plasma treatment method was applied to butadiene rubber to improve its adhesion strength by plate type reactor. In order to investigate the optimum reaction condition of plasma treatment, type of reaction gas(nitrogen, argon, oxygen, air), gas flow rate(30~100 mL/min), treated time(0~30 s) and primer modification method(GMA, 2-HEMA) were examined in a plate type plasma reactor. The results of the surface modification with respect to the treatment procedure was characterized by using SEM and ATR-FTIR. As the gas flow rate and treated time increases the contact angle decreases. The greatest adhesion strength was achieved at optimum condition such as flow rate of 60 mL/min, treated time 5 s and modification primer containing 2-HEMA for air. Due to the atmospheric surface modification using plate plasma method consequently reduced the wettability of butadiene rubber and resulted in the improvement of the adhesion.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.16 no.1
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• pp.35-43
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• 2002

In the last decade, considerable efforts have been made to make a new class of solid state high power, high speed electronic device, namely, the Photo-Conductive Power Switch(PCPS), and to characterize the high-field performance of PCPS under high power, high voltage conditions. But the problem of surface flashover phenomena persist, preventing the realization of reliable and efficient high-speed, high voltage switching devices. It is essential to have a clear understanding on the physical processes behind the surface flashover problem to develop new technologies and device architectures so as to fabricate PCPS that are capable of high-field high-voltage. Also, it is imperative to identify new materials that could satisfy the requirements for high-field, high-power devices. Since surface flashover, surface breakdown phenomena is observed for all the devices that foiled at the applied field much lower than semiconductor bulk breakdown field, surface passivation is considered one of the important practical methods to improve the high field performance of the devices. Therefore, this paper was studied the main properties and mechanism of the semiconductor surface flashover before and after passivation under high electric-field.

• Polymer(Korea)
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• v.36 no.3
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• pp.302-308
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• 2012

The objective of this study is to investigate optimum reaction conditions for the grafting of poly($N$-vinyl- 2-pyrrolidone) (PVP) onto the surface of plasma-treated polypropylene film. The plasma treatment conditions were fixed as 200 W rf power, 6 LPM Ar flow rate, 30 sec treatment time, and 5 min exposure time after treatment. For graft copolymerization, we investigated the change of grafting degree with respect to reaction time, reaction temperature and $N$-vinyl-2-pyrrolidone concentration. Maximum grafting degree was obtained at the conditions of 6 h reaction time, $90^{\circ}C$ reaction temperature, and 40% $N$-vinyl-2-pyrrolidone concentration. The introduction of PVP was confirmed by ATR-FTIR, XPS, and SEM analysis.

• Korean Chemical Engineering Research
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• v.54 no.6
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• pp.830-837
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• 2016

In order to improve the compressive strength of graphite foams (GFms), mesophase pitch (MP) was stabilized in air atmosphere and then fluorinated at different conditions. The Fluorine/Carbon (F/C) in surface-chemical contents of fluorinated MP has range of 23.75%~61.48% according to the different fluorine partial pressure. The compressive strengths of GFms prepared from fluorinated MP were increased in proportion to the apparent densities. The compressive strength of the GFm produced from MP with 35.93% of F/C (%) showed maximum value in $2.93{\pm}0.06MPa$, which was increased up to 27.95% than that of the GFm prepared from un-fluorinated MP. This result was attributed that the interface bonding between of MPs due to fluorine functional groups with high surface energy helped to improve compressive strength of the GFm.

• Journal of the Society of Naval Architects of Korea
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• v.30 no.2
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• pp.112-122
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• 1993

A potential-based panel method is presented for the analysis of a partially or supercavitating two-dimensional hydrofoil at a finite submergence beneath a free surface, treating without approximation the effects of the finite Froude number and the hydrostatic pressure. Free surface sources and normal dipoles are distributed on the foil and cavity surfaces, their strength being determined by satisfying the kinematic and dynamic boundary conditions on the foil-cavity boundary. The cavity surface is determined iteratively as a part of the solution. Numerical results show that the wave profile is altered significantly due to the presence of the cavity. The buoyancy effect due to the hydrostatic pressure, which has usually been neglected in most of the cavitating flow analysis, is found playing an important role, especially for the supercavitating hydrofoil; the gravity field increases the cavity size in shallow submergence, but decreases it when deeply submerged, while the lift reduces at all submergence depth.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.3
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• pp.9-14
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• 2004

In this study, Si anisotropic etching characteristics of tetramethylammonium hydroxide (TMAH)/ ammonium persulfate(AP)/isopropyl alcohol(IPA) solutions were investigated to realize the optimum structure of a diaphragm for the piezoresistive pressure sensor application. Due to its low toxicity and its high compatibility with the CMOS processing, TMAH was used as Si anisotropic etchants. The variations of Si etch rate on the etching temperature, TMAH concentration, and etching time were obtained. With increasing the etching temperature and decreasing TMAH concentrations, the Si etch rate is increased while a significant non-unifonnity exists on the etched surface because of formation of hillocks on the (100) surface. The addition of IPA to TMAH solution leads to smoother etched surfaces but, makes the Si etch rate lower. However, with the addition of AP to TMAH solution, the Si etch rate is increased and an improvement in flatness on the etching front is observed. The Si etch rate is also maximized with increasing the number of addition of AP to TMAH solution per one hour. The Si square membranes of 20${\mu}{\textrm}{m}$ thickness and l00-400${\mu}{\textrm}{m}$ one-side length were fabricated successfully by applying optimum Si etching conditions of TMAH/AP solutions.