• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.765-768
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• 2011

At present, the smart mobile device has been big recognition in general due to fusion, mobility and convenience. On the one hand Industy also needs smart mobile device because more and complex data processing. Hereupon this thesis will study reflected industry needs smart mobile pad's design structure, and applicable area to use this device.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.7
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• pp.579-588
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• 2017

The purpose of this study was to examine the defibrillation efficiency according to the defibrillator type among paramedics by making a comparative analysis of the chest compression pause time and defibrillation efficiency after providing simulation education. The subjects in this study were 15 paramedics who were selected from a provincial 119 safety center. The experiment was conducted using a single-group pretest-post test design from March 2 to August 31, 2016. The collected data were analyzed by SPSS WIN 21.0, and a frequency analysis was conducted. The findings of this study were as follows: First, there was a significantly greater decrease in the chest compression pause time during CPR after providing simulation education when semi-automated defibrillators were used than when manual paddles and manual pads were employed. Second, there was a statistically significant decrease in the performance time of defibrillation when semi-automated defibrillators were used than when manual paddles and manual pads were used. The findings of this study are expected to provide paramedics with simulation education on how to promptly read ECGs using the manual mode of a semi-automated defibrillator to help more patients revive and on how to facilitate their job enlargement.

• Journal of the Korea Concrete Institute
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• v.20 no.3
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• pp.271-282
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• 2008

Specific joint devices composed of end-plates and through bolts are under development to assemble steel beams to PC columns efficiently by dry construction method for the PCS structural system, of which major structural components are precast concrete columns and steel beams. Seismic performance of the joint devices had been evaluated by experimental tests in the previous studies and it was showed that all the performance requirements regarding to strength deterioration, stiffness degradation and energy dissipation capacity were satisfied to the criteria of ACI requirements, but the initial stiffness was not. In order to find out possible causes of the insufficient rigidity of the joint devices and provide the proper measures to improve the performance of the joint accordingly, numerical analyses were carried out by using ABAQUS. Parameters, such as thickness of neoprene pad, conditions of surface between PC column and end-plate, magnitude of pretension forces of through bolts, stiffness of end-plate were taken into consideration. As the result, it was found that the rigidity of the PCS system was negatively affected by the magnitude of initial gaps between PC columns and end-plates, and insufficient stiffness of neoprene fillers and end plates. In order to improve the initial stiffness performance of the joints, measures such as increase of the magnitude of pretension forces on through bolts and increase of the stiffness of end-plate by reducing the bolt pitch and providing adequate stiffeners are recommended.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.326-326
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• 2008

갈륨 질화물 (GaN) 기반의 발광다이오드(Light Emitting Diode, LED)는 최근 디스플레이, 교동신호등, 휴대폰용 키패드의 광원 등에 널리 사용되는 전자소자로, 차세대 조명용 광원으로도 각광받고 있다. 일반적인 수평 구조의 LED에 비해 수직형 구조 LED 는 발광면이 n-GaN 표면 전체이며, 전류 확산 특성이 매우 뛰어남으로 인해 차세대 구조라고 표현되어 진다. 이런 구조에서 활성층 영역에서의 균일한 전류 분포는 전류밀집 현상을 억제하여 결과적으로 광학적 특성을 향상시킨다. 따라서 현재까지도 전류확산에 따른 발광다이오드의 성능향상에 대한 연구가 다각도로 이루어지고 있다. 본 연구에서는 수직형 GaN LED 의 전극 패턴에 따른 활성층 영역에서의 전류밀도 분포에 대해 조사하였다. 전극 패턴의 크기 및 구조 변화에 따른 활성층 영역에서의 전류분포도를 삼차원 회로 모델을 이용하여 분석하였다. 또한 활성층 영역으로 주입되는 전류 밀도의 크기가 내부양자효율에 미치는 영향에 대하여 알아보았다. 활성층 영역에서의 균일한 전류밀도 분포를 갖는 전극구조를 설계하였으며, 각각의 전극구조를 적용한 수직형 GaN LED의 전기/광학적 특성에 대해 전산모사 하였다. 최종적으로, n-GaN 위 전극의 크기 및 구조 변화에 대한 시뮬레이션 결과를 토대로, 균일한 전류분포 및 내부 양자효율 향상을 위한 전극패턴 설계 방침을 제안한다.

• Journal of the Korean Society of Clothing and Textiles
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• v.42 no.4
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• pp.612-625
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• 2018

This study designed 16 kinds of basic structure and 4 kinds of modified structure for impact protection pads with a spacer fabric shape. The pad is a structure in which hexagonal three-dimensional units, composed of a surface layer and a spacer layer, are interconnected. Designed pads were printed with flexible $NinjaFlex^{(R)}$ materials using a FDM 3D printer. The printed pads were evaluated for impact protection performance, compression properties and sensory properties. The evaluation of the impact protection performance indicated that basic structures better than CR foam material at 20cm height were DV1.5, DX1.5, DX1.0, DV1.0 and HV1.5. The evaluation of the compression properties for the five types, with good results in the impact protection performance, indicated that DV1.0, DX1.0, DV1.5, HV1.5 and DX1.5 showed good results, respectively. The sensory evaluation of DV1.0, DX1.0, and DV1.5, which with good results when considering both the impact protection performance and the compression performance, showed that DV1.0 were the best for surface, flexibility, compression and weight. Therefore, DV1.0 is shown to be the best structure for protection pads.

• Journal of the Korean Society of Clothing and Textiles
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• v.41 no.5
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• pp.939-949
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• 2017

This study uses 3D printing technology to design and fabricate a fall impact protection pad with a spacer fabric structure. The design of the pads consists of hexagonal three-dimensional units connected in a honey-comb shape; in addition, the unit consists of a surface layer and a spacer layer. Protect pads were designed as either a hexagonal type or diamond type according to the surface layer structure; subsequently, a spacer filament was also designed as the most basic I-shape type. Designed pads were printed using four types of flexible filaments to select suitable material for a fall impact protection pad. Impact protection performance and bending stiffness were evaluated for the eight type of pad outputs. As a result of the impact protection performance evaluation, when the force of 6,500N was applied, the force passed through the pad was in the range of 1,370-2,132N. FlexSolid$^{(R)}$ and Skinflex$^{TM}$ showed good protection performance and cubicon flexible filament showed the lowest protection. NinjaFlex$^{(R)}$ was found to be the most flexible in the bending stiffness evaluation.

• The Journal of the Convergence on Culture Technology
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• v.8 no.3
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• pp.239-244
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• 2022

In this study, the key parameters affecting the deterioration of each track type were derived based on field inspections and laboratory tests. The existing track deterioration model was limited to the ballasted tracks, and the deterioration evaluation of concrete tracks was insufficient. In this study, the laboratory test was performed to evaluate the performance and condition of track components to derive the deterioration factors reflecting the characteristics of various track structures. In addition, through analysis of track maintenance history data, parameters affecting track deterioration and maintenance were derived. The key parameters for presenting a track deterioration model based on the track performance of ballasted and concrete tracks through field inspection, track maintenance history data analysis, and performance test of track components using on-site specimens were identified as track support stiffness, Ballast gravel, track settlement and Resilience pad were presented.

• Journal of Korean Society of Disaster and Security
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• v.10 no.1
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• pp.85-90
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• 2017

The purpose of this study is to investigate the effect of vertical and horizontal refraction on the lower part of the power supply and control system of various facilities and machinery that use electricity, so that the power distribution system, which is an important electric facility installed in buildings and public facilities, Type earthquake resistant pads to protect the substructure and prevent short-circuiting on the upper part of the system. The GR-63-CORE (Scale 8.3 class) It is earthquake disaster prevention and disaster prevention technology that satisfies seismic performance. As a research result, it is possible to protect the electricity and communication infrastructure, which can contribute to shortening the time for recovering the electric facilities to the normal state in case of an earthquake, and preventing the fire caused by the destruction of the electricity supply facility in case of an earthquake. As a result, it is possible to minimize the spread of fire that occurs when a large-scale earthquake occurs and to minimize the damage of people and damage to property, and it can contribute to the securing of electric infrastructure that enables citizens to quickly recover to daily life even after suffering a major earthquake. In addition, the technology can be applied to ensure the seismic resistance of the equipment in the communication and computer room, and it can be applied to various fields where the facility function can be stopped due to the shaking of the earthquake base.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.25-29
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• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.