• Title/Summary/Keyword: 전자부품연구원

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Identification of Contact State between Parts during Peg-in-Hole Process by Fuzzy Inference Method (Fuzzy 추론법에 의한 부품 삽입 공화의 접합상태 판별)

  • Chung, Gwang-Jo;Ryu, Sang-Uk;Lee, Hyon-Woo;Chong, Won-Yong;Lee, Soo-Heum
    • Journal of the Korean Society for Precision Engineering
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    • v.11 no.1
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    • pp.80-88
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    • 1994
  • In the automation of rigid parts mating process with the intelligent robots, Peg-In-Hole is the most available task since inserting is some analytic and needs suitable range of forces that can be controlled by induatrial manipulators. In this Peg-In-Hole process, it is very important to identify the contact state between tow parts, peg and hole, to build the strategies for robot motion that leads to avoid the jamming condition occurs during insertion process. In this paper, we adpopted 3 parameters for identification, lFzl, lFxy/Fzl, and lMxy/Fxyl, derived from axes value of Whitney's jamming diagram. Also, we defined the fuzzy membership functions for these parameters and developed the identification algorithm based on fuzzy inference method of max-product. As an experimental result, we obtained about 96% of identification ratio that could be raised up to industrial requirements by further research.

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A Study on Fostering Plan for the Hydrogen Industry in Changwon City (창원시 수소 산업 2040 중장기 육성계획 수립 연구)

  • PARK, MIN-JU;KIM, HAK-MIN;GU, YUN-JEONG;JEONG, CHANG-HOON;KANG, BOO MIN;HA, SEUNG WOO;JEONG, DAE-WOON
    • Journal of Hydrogen and New Energy
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    • v.31 no.6
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    • pp.509-521
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    • 2020
  • This study aims to propose a mid- to long-term fostering plan for the hydrogen industry customized to Changwon City by reviewing the government's policy and the status of the domestic and foreign hydrogen industry. The adopted methodologies were policy analysis, literature review, field investigation, and committee operation that could consider institutions, knowledge (technology), and networking between activity subjects. The short-term projects and long-term projects for the fostering plan are established using these methodologies. The short-term projects were structured so that the ongoing hydrogen industry fostering plan leads to a successful result, and the hydrogen mobility field is expanded to not only land vehicles but also marine and air vehicles. The long-term projects consist of a high proportion of the hydrogen utilization field to take advantage of the industrial strength of Changwon City, and a support system for new and turning companies for localization of parts was added to provide industrial competitiveness.

The Impact of Environmental TBTs on Exports of Korean Manufactures (환경 TBT가 국내 주요 제조업 수출에 미치는 영향)

  • Sun-Kyung Huh;Sul-Ki Lee
    • Korea Trade Review
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    • v.48 no.1
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    • pp.193-213
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    • 2023
  • The impact of each country's environmental protection and climate change policies on trade is increasing. The strengthening of trade barrier resulted in an increase of Technical Barriers to Trade(TBTs). This international trend carries important implications for Korean manufacturers, which is highly dependent on trade. Discussions on the trade effects of TBT are still ongoing. This study that quantitatively analyzed the effect of TBT on trade have employed a gravity model. As a result of the analysis using the basic model, it was found that the effect of environmental TBT notifications on trade is positive(+) overall. However, the electrical machinery and equipment·electronics industries are negatively affected by environmental TBT. There is a pressing need to preemptively identify the impact of environmental TBT in major countries on the exports of Korean manufacturing industries in order to strengthen the competitiveness of domestic industries and pursue countermeasures.

Heating Characteristics of Carbon Fiber Polyimide-Coated by Electrophoretic Deposition (전기영동증착법으로 폴리이미드를 코팅한 탄소섬유의 발열 특성 연구)

  • Geon-Joo Jeong;Tae-Yoo Kim;Seung-Boo Jung;Kwang-Seok Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.1
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    • pp.90-94
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    • 2023
  • Carbon fiber(CF) with excellent thermal conductivity and electrical conductivity is attracting attention as an alternative material because metal heating elements have problems such as high heat loss and fire risk. However, since CF is oxidized and disconnected at about 200℃ or higher, the application of heating elements is limited, and CF heating elements in the form of vacuum tubes are currently used in some commercial heaters. In this work, polyimide(PI) with high heat resistance was coated on the surface of carbon fiber by electrophoretic deposition to prevent oxidation of CF in the atmosphere without using a vacuum tube, and the coating thickness and heat resistance were investigated according to the applied voltage. The heater made by connecting the PI-coated CF heating elements in series showed stable heating characteristics up to 292℃, which was similar to the heating temperature result of the heat transfer simulation. The PI layer coated by the electrophoretic deposition method is effective in preventing oxidation of CF at 200℃ or higher and is expected to be applicable to various heating components such as secondary batteries, aerospace, and electric vehicles that require heat stability.

KOREA STAR AWARDS 2013 (제7회 미래패키징 신기술 정부포상)

  • (사)한국포장협회
    • The monthly packaging world
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    • s.242
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    • pp.42-60
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    • 2013
  • 산업통상자원부가 주최하고 한국생산기술연구원이 주관하는 "제7회 미래패키징 신기술 정부포상" 출품작에 대한 수상작이 선정, 지난 달 28일 KINTEX(일산) 그랜드볼룸에서 시상식이 있었다. 미래패키징 신기술 정부포상은 미래지식산업인 패키징산업 종사자의 긍지와 자부심 함양의 계기를 실천하고, 패키징산업 종사자의 사기진작과 패키징산업 활성화 도모할 목적으로 운영되고 있다. 또한 한국국제포장기자재전(KOREA PACK)과의 동시개최로 패키징산업 종사자간 정보교류 극대화 및 공동체 의식 함양으로 일체감을 조성하고 있으며, 패키징산업 기술인의 기술개발 의욕을 고취하는데 그 목적이 있다. 미래패키징 신기술 정부포상은 코리아스타상(기업부문, 학생부문, 공로부문)으로 구분하여 시상하고 있다. 기업부문은 패키징 완제품, 친환경패키징, 패키징관련기계(설비) 및 관련부품, 패키징인쇄(라벨링), 패키징원부자재 생산 및 가공공정, 패키징디자인 등의 분야에서 신기술 개발 또는 개선으로 수출신장, 매출 수익 증대 및 발명특허 획득을 통해 패키징 기술력 발전에 기여한 기업의 패키징제품 또는 패키징디자인을 대상으로 한다. 학생부문은 패키징 디자인 관련분야 전공자로 패키징과 연관된 컨셉으로 상품성, 창의성, 표현성, 친환경성, 지속가능성 등이 어우러진 독창적인 패키징제품 또는 패키징디자인을 대상으로 한다. 공로부문은 패키징 산업 관련 산업계, 학계, 연구계, 유관기관에 종사하는 자로서 패키징 관련 핵심 기술개발, 경영, 마케팅 면에서 패키징 산업 발전에 기여한 공적이 뚜렷한 자, 패키징산업발전 정책연구 및 패키징산업 육성에 기여한 기업 또는 개인을 대상으로 한다. 이번 코리아스타상 기업부문 수상자로는 산업통상자원부 장관상에 대륙제관, 드림, 삼성전자, LG전자 4개사가 선정됐으며, 한국생산기술연구원장으로는 율촌화학(주) 외 10개사, 한국포장기술사회장상에는 (주)농심 외 11개사가 선정됐다. 학생부문에서는 한국생산기술연구원장상에 홍익대학교 외 2개 학교가 선정됐으며, 한국포장기술사회장상에 국민대학교 외 4개 학교가 선정됐다. 코리아스타상 공로부문에는 강원대학교 조병묵 교수가 산업통상자원부 장관 표창을 수상했으며, (주)코르피아 유영일 이사가 한국생산기술연구원장 표창을 받았다. 본 고에서는 "제7회 미래패키징 신기술 정부포상" 부문명 수상작에 대해 살펴보도록 한다.

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Effect of Thermal Grease on Thermal Conductivity for Mild Steel and Stainless Steel by ASTM D5470 (ASTM D5470 방법으로 연강과 스테인리스강의 열전도도 측정시 열그리스의 영향)

  • Cho, Young-Wook;Hahn, Byung-Dong;Lee, Ju Ho;Park, Sung Hyuk;Baeg, Ju-Hwan;Cho, Young-Rae
    • Korean Journal of Materials Research
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    • v.29 no.7
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    • pp.443-450
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    • 2019
  • Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance($R_{th}$) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

Implementation of System Using Kinect an Expression of Recognition and Advertising Media Control System (소켓통신 기반의 Kinect를 이용한 표정인식 및 영상제어 시스템 구현)

  • Lee, Hojae;Yoon, chul Jun;Lim, Youhyuk;Kim, Hyunsik;Seo, Jeongwook
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2016.10a
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    • pp.904-906
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    • 2016
  • In this paper, advertising and public relations services to provide kincet to implement a control system using face recognition and media. Traditionally, this unilateral system for delivering advertisements to consumers, is currently directed interactive ads. In other words, interactive advertising service that offers bi-directional communication. In the proposed system, the kincet using face recognition, to recognize faces with eyes, mouth, jaws and eyebrows. Presently used kinect version is the face of instability in the recognition and accurately is difficult to separate the three parts of the jaw, eyes, eyebrows only leverage. the classification has an easy immoyangProvide control services by separating the media, Hwanam-myeon, laughing. Also, consumers understand the expression of the control of the media and using picture for advertising to consumers through the transfer on both had indelibly imprinted by advertising.Effective are expected to appear.

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Separation of Single-Wall Carbon Nanotubes by Agarose Gel (아가로스 겔을 이용한 단일벽 탄소나노튜브 분리)

  • Yu, Lan;Lim, Yun-Soo;Han, Jong-Hun
    • Applied Chemistry for Engineering
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    • v.22 no.3
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    • pp.272-276
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    • 2011
  • The separation of metallic and semiconducting single-wall carbon nanobubes (SWCNTs) by agarose gel method was carried out in this study. The effect of concentration of agarose, SDS (sodium dodecyl sulfate), and pH in the solution on separation behavior was investigated. With increasing the concentration of agarose in the solution, it showed that the ratio of metallic SWCNTs, which was analyzed from UV-vis-NIR spectroscopy, was increased in the solution phase, while the overall concentration of SWCNTs was decreased. With increasing the concentration of SDS, we could observe that the ratio of metallic SWCNTs was increased due to more affinity between SDS molecules and metallic SWCNT. The highest metallic SWCNTs ratio was reached up to 58.4% when the pH of solution was 8.2.

Evaluation of Technology Activity, Innovation and Productivity using Korean Patent Information (한국특허정보를 통한 기술활동성, 혁신성 및 생산성 평가)

  • Yun, In-Sik;Kim, Seok-Jin;Jeong, Eui-Seob
    • Journal of Information Management
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    • v.42 no.2
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    • pp.151-165
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    • 2011
  • Patent information as the innovative index for activity of industry, science and technology reflects the inventive outcome of the nation, region, technology, or company etc.. and is able to be used as a tool evaluating the R&D product and technology diffusion. In this study, the index for analysing the productivity, innovation, and activity of the technology is provided to evaluate the technology in fields of the pharmaceutic, transport, biotechnology, textile, construction, machine parts, information media, and electric/telecommunication, which are becoming the national core technology. As a result of analysis, the technology activity in fields of the construction, pharmaceutic, and biotechnology shows a growing trend which reflect the interest in the quality and the extension of the life, but vice versa in fields of the textile, and information media. The innovation index in fields of the construction, pharmaceutic, and biotechnology index more than average, but vice versa in fields of the information media and electric/telecommunication. In case of technology productivity, more than 2 patentees are included in one patented technology. It has been determined that the technology productivity is decreased because of an increasing number of researcher participating the technology development, which is the recent trend of technology advancement.

The Study on the Embedded Active Device for Ka-Band using the Component Embedding Process (부품 내장 공정을 이용한 5G용 내장형 능동소자에 관한 연구)

  • Jung, Jae-Woong;Park, Se-Hoon;Ryu, Jong-In
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.3
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    • pp.1-7
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    • 2021
  • In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (Pin) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.