• Title/Summary/Keyword: 슬러리 재료

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A Study on the Oxide CMP Characteristics According to the $CeO_2$ Abrasive Adding (세리아 연마제 첨가에 따른 산화막 CMP 특성 연구)

  • Han, Sang-Jun;Lee, Young-Kyun;Park, Sung-Woo;Seo, Yong-Jin;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.542-542
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    • 2008
  • 본 논문에서는 기존에 상용화된 슬러리에 비해 새로운 혼합 연마제 슬러리의 우수성을 입증하고, 최적화 된 공정기술을 연구의 기반으로 활용하고자 Silica slurry에 $CeO_2$ 연마제를 혼합하여, 어떠한 연마 특성을 나타내는지 알아보았고, AFM, EDX, XRD, TEM 분석을 통해 그 가능성을 비교 분석하였다.

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Adhesion of Alumina Slurry Particles on Wafer Surfaces during Cu CMP (Cu CMP 공정중 Wafer 표면의 알루미나 연마입자의 점착)

  • Hong, Yi-Koan;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.1292-1295
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    • 2004
  • 본 연구는 Cu CMP공정 중 알루미나 연마입자의 wafer 표면에서의 점착과 오염을 AFM (Atomic Force Microscopy)을 사용하여 슬러리내에서 점착력 측정과 실제 연마 후 wafer 표면의 오염을 실험적으로 비교 평가하였다. 연마입자의 adhesionn force 측정에 있어서도 역시 wafer들의 zetapotential 결과와 잘 일치하였으며, 모든 wafer 종류에 관계없이, 산성 영역에서 염기성영역의 슬러리가 적용됨에 따라 adhesion force가 작아짐을 확인할 수 있었다. 특히 FSG wafer의 zetapotential 결과는 비록 산성 분위기에서는 양성 전하값을 나타내었으나, 염기성 분위기의 pH에서는 급격하게 음성 전하값을 나타내었고, 이는 adhesionn force결과와 FESEM 결과와 잘 일치하였다.

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The Study on the Slurry Wear Behavior of Rubber Vulcanizates (고무 소재의 슬러리 마모 거동에 관한 연구)

  • Chung, Kyung-Ho;Hong, Young-Keun;Park, Moon-Soo
    • Elastomers and Composites
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    • v.46 no.1
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    • pp.70-77
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    • 2011
  • A new piece of test equipment, the slurry wear tester (SWT), was proposed in this study to evaluate the wear behavior of rubber vulcanizate in environmental contact with slurry. Natural rubber (NR) and chloroprene rubber (CR) were chosen as the basic matrices to test the slurry wear. The fluids used to fill the chamber of the SWT were 35% HCl and NaCl solution. The Akron abrasion test was used for comparison with SWT. According to the results of the Akron abrasion test, CR vulcanizate abraded more rapidly than NR vulcanizate under same test condition. It was found that the hysteresis of rubber was key factor contribute to the wear behavior. However, the slurry wear rate of the NR and CR vulcanizates did not change significantly, even with changes in the concentration of acid and the immersion time in both HCl and NaCl solutions; the fluid decreased the friction between the abrasive paper and the specimen. It also reduced the heat generated from repeated deformation and wear debris at the surface of the SWT's abrasion arm. Thus, these phenomena affected the wear behavior of rubber vulcanizate and caused different results in the conventional Akron abrasion test. This outcome could have resulted in an incorrect analysis if the slurry wear behavior of the rubber vulcanizate was estimated by the conventional abrasion tests, which are operated under dry conditions.

Compressive and Tensile Strength Properties of Slurry Infiltrated Fiber Concrete (슬러리 충전 강섬유 보강 콘크리트의 압축 및 인장강도 특성)

  • Kim, Suk-Ki;Choi, Jin-Ho
    • Journal of the Korea Concrete Institute
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    • v.18 no.5 s.95
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    • pp.703-708
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    • 2006
  • The slurry infiltrated fiber concrete(SIFCON) is recognized as one of the most promising new construction materials. Compressive and direct tensile tests are performed to investigate the mechanical property of SIFCON. Hooked-end steel fibers are used in the mix with fiber volume fraction varied from 4% to 10%. The water/cement ratio is kept constant at 0.4. The amount of silica fume added is 10% by weight of cement and 0.5% of water reducing agent is added to improve the workability of the slurry. The test results in this study show that the compressive strength of SIFCON is about 1.59 to 2.68 times in comparison with the cement paste. Tensile strength is showed the enhancement of about 2.51 to 8.77 times. It is also observed that the toughness and ductility of SIFCON are increased significantly with the increasing in fiber volume fraction.

Effect of Sintering condition on Mechanical Properties of Zircon Shell Molds (소결조건이 지르콘 쉘 몰드의 기계적 특성에 미치는 영향)

  • Kim, Jae-Won;Kim, Du-Hyeon;Seo, Seong-Mun;Jo, Chang-Yong;Choe, Seung-Ju
    • Korean Journal of Materials Research
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    • v.9 no.9
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    • pp.865-871
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    • 1999
  • Effect of sintering condition in mechanical properties of ZrSiO\ulcorner shell molds was investigated. Number of microcrack in primary layer of the mold was maximized after preheating at $1000^{\circ}C$ for 1.5 hours. Yield strength and specific surface area of the mold were inversely proportion to sintering temperature and time. After hot deformation test at $1500^{\circ}C$ for 4 hours, molds were deformed opposite to the loading direction and backup layers were cracked along the interface between stucco and zircon slurry. Reverse deformation of the molds during hot deformation test was considered to be resulted from the difference of thermal expansion coefficient between alumina stucco and zircon slurry in primary coat, and size difference between zircon stucco and zircon slurry in backup coat.

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CMP Properties of ZnO thin film deposited by RF magnetron sputtering (RF-sputtering에 의해 제작된 ZnO박막의 연마특성)

  • Choi, Gwon-Woo;Han, Sang-Jun;Lee, Woo-Sun;Park, Sung-Woo;Jung, Pan-Geom;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.166-166
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    • 2007
  • ZnO는 육방정계(wurtzite) 결정구조를 지니며 상온에서 3.37eV의 wide band gap을 갖는다. ZnO의 엑시톤 결합 에너지는 GaN에 비해 2.5배 높은 60meV로서 고효율의 광소자 적용 가능성이 높다. 또한 고품위의 박막합성이 가능하다. 이러한 특성 때문에 display소자의 투명전극, 광전소자, 바리스터, 압전소자, 가스센서 등에 폭 넓게 응용되고 있다. ZnO박막의 제조는 스퍼터링, CVD, 진공증착법, 열분해법 등이 있다. 본 논문에서는 RF 마그네트론 스퍼터에 의해 제작된 ZnO 박막에 CMP공정을 수행하여 연마율과 비균일도 특성 및 광투과 특성을 연구하였다. ZnO박막은 $2{\times}2Cm$의 Corning glass위에 증착되었다. 로터리 펌프와 유확산 펌프를 이용하여 초기진공을 $2{\times}10^{-6}$ Torr까지 도달시킨 후 Ar과 $O_2$를 주입하였다. 증착은 상온에서 이루어졌으며 공정압력은 $6{\times}10^{-2}$Torr이였다. 초기의 불안정한 상태의 풀라즈마를 안정시키기 위해 셔터를 이용하여 pre-sputtering을 하였다. CMP 공정조건은 플레이튼 속도, 슬러리 유속, 압력은 칵각 60rpm, 90ml/min, $300g/cm^2$으로 일정하게 유지하였으며 헤드속도는 20rpm에서 100rpm까지 증가시키면서 연마특성을 조사하였다. 실리카슬러리의 적합성을 알아보기 위해 DIW와 병행하여 CMP공정을 수행하고 비교 분석하였다. CMP공정 결과 광투과도는 굉탄화된 표면의 확보로 인해 향상된 특성을 보였다. 실리카 슬러리를 사용하여 CMP를 할 경우는 헤드속도는 저속으로 하여야 양호한 연마특성을 얻을 수 있었다.

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CMP Slurry Induction Properties of Silicate Oxides Deposited on Silicon Wafer (실리콘 웨이퍼위에 증착된 실리케이트 산화막의 CMP 슬러리 오염 특성)

  • 김상용;서용진;이우선;장의구
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.2
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    • pp.131-136
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    • 2000
  • We have investigated the slurry induced metallic contaminations of undoped and doped silicate oxides surface on CMP cleaning process. The metallic contaminations by CMP slurry were evaluated in four different oxide films, such as plasma enhanced tetra-ethyl-orthyo-silicate glass(PE-TEOS), O3 boro-phos-pho-silicate glass(O3-BPSG), PE-BPSG, and phospho-silicate glass(PSG). All films were polished with KOH-based slurry prior to entering the post-CMP cleaner. The Total X-Ray fluorescence(TXRF) measurements showed that all oxide surfaces are heavily contaminated by potassium and calcium during polishing which is due to a CMP slurry. The polished O3-BPSG films presented higher potassium and calcium contaminations compared to PE-TEOS because of a mobile ions gettering ability of phosphorus. For PSG oxides, the slurry induced mobile ion contamination increased with an increase of phosphorus contents. In addition, the polishing removal rate of PSG oxides had a linear relationship as a function of phosphorus contents.

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