Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.06a
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- Pages.542-542
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- 2008
A Study on the Oxide CMP Characteristics According to the $CeO_2$ Abrasive Adding
세리아 연마제 첨가에 따른 산화막 CMP 특성 연구
- Han, Sang-Jun (Department of Electrical Engineering, Chosun University) ;
- Lee, Young-Kyun (Department of Electrical Engineering, Chosun University) ;
- Park, Sung-Woo (Department of Electrical Engineering, Chosun University) ;
- Seo, Yong-Jin (Department of Electrical Engineering, Daebul University:) ;
- Lee, Woo-Sun (Department of Electrical Engineering, Chosun University)
- Published : 2008.06.19
Abstract
본 논문에서는 기존에 상용화된 슬러리에 비해 새로운 혼합 연마제 슬러리의 우수성을 입증하고, 최적화 된 공정기술을 연구의 기반으로 활용하고자 Silica slurry에