• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.1
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• pp.50-57
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• 2016

Transmission equipment is mainly used for the XLPE (cross-linked polyethylene) insulation cable for ultra high voltage power to minimize power loss. The experiment examined the partial discharge characteristics according to the insertion of the bar electrode and needle electrode into the XLPE specimen and the air voids. XLPE insulation cable manufactured by T. company and tungsten electrode material by K. company were used for specimens, by adhering conductive tape on the semi-conductive material of the lower electrode of XLPE specimen with the dimension of $16{\times}40{\times}30$ [mm] was used as negative electrode. In order to investigate the PD with ${\phi}$-q-n of XLPE specimen according to the electrode shape and the size of air voids. we examined the PD by varying the voltage after applying voltage of 3~20 kV on the electrode. Therefore, it was confirmed from the result of PD characteristics of specimen that the larger the air void than the gap between electrode (+) and electrode(-), the larger effect on the discharge when the bar electrode and needle electrode inserted into XLPE, and the closer the distance between the insulation and the needle electrode, the faster insulation breakdown.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.5
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• pp.7-12
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• 2008

This paper described results for desiging the best effective bushing geometry by comparing the distribution of the electric field according to bushing geometry. Twelve cases of the geometrical change are tried to analysis. Improvement of the insulation strength related with the vector and the electric field distribution are reached to about 0.7[%] and $21{\sim}26[%]$ by changing the electrode length, respectively. Moreover, in cases of the change of insulator thickness at high-voltage parts, the insulation strength relevant to the same parameters as mentioned above are 2[%] and $23{\sim}43[%]$, respectively Consequently, the quenching voltage for interrupting the partial discharge might be improved due to increasing the insulation strength by the geometrical change.

• Journal of Biomedical Engineering Research
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• v.22 no.1
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• pp.81-90
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• 2001

본 연구에서는 디지털 영상 뇌파계(digital video electroencephalogram, Digital VEEG)에서 비디오 영상과 뇌전도 파형의 동기화된 편집 시스템을 구성한다. 이 시스템은 기존 아날로그 영상 뇌파계(analog video electroencephalogram)의 동기화 문제와 디지털 영상 시스템에서의 영상편집 문제를 해결하기 위하여 MPEG-I(이하 MPEG) 고압축 기술을 이용한 MPEG 인코딩 보드(encoding board)와 MPEG 편집 엔진(editing engine)을 각각 사용하였다. 시스템은 디지털 영상뇌파계모듈과 디지털 편집 모듈로 구성되며, 뇌전도모듈에서는 환자에게 연결된 전극을 통해 들어온 뇌파를 생체신호증폭기를 이용하여 증폭한 후 AD 보드(analog to digital board)를 이용 디지털화한다. 디지털 카메라로 촬영된 환자영상의 아날로그 영상신호(NTSC 신호)는 MPEG 인코딩 보드를 이용하여 고압축 디지털화한다. 이후 디지털화된 뇌전도신호와 MPEG 형식의 영상을 시간 동기화하여 두 개의 모니터에 각각보여준다. 편집 모듈에서는 영상신호와 뇌파신호를 어느 부분이든 간단한 조작으로 오려 붙이기(cut and paste) 기능을 이용할 수 있다. 본 시스템은 사용된 데이터 모두 디지털 기술을 이용하여 영상과 뇌파신호의 정확한 동기화 및 각각의 데이터의 오려 붙이기 기능을 가능케 하였으며, 이는 환자의 데이터를 관리 및 보관하는데 있어, 임상의에게 의미 있는 자료만을 모아서 효율적으로 관리할 수 있게 해준다. 이와 같은 장점을 갖는 디지 영상뇌파계 편집시스템을 구현하였다.

• Journal of IKEEE
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• v.23 no.3
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• pp.793-799
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• 2019

In this study, the diffusion process and the thermal energy distribution gradient of the sensor were confirmed by using the finite element analysis program (COMSOL) of the mesh method to analyze the thermal diffusion in the wearable fabric (Nylon) + MWCNT gas sensor. To analyze the diffusion process of thermal energy, the structure of the gas sensor was modeled in a two dimension plane. The proposed modeling was presented with the characteristic value for the component of the sensor, and the gas sensor designed using the mesh finite element method (FEM) was proposed and analyzed by suggesting the one-way partial differential equation in the governing equation to know the degree of thermal energy diffusion and the thermal energy gradient. In addition, the temperature gradient 10[K/mm] of the anode-cathode electrode layer and the gas detection unit was investigated by suggesting the heat velocity transfer equation.

• Journal of Soil and Groundwater Environment
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• v.10 no.5
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• pp.11-17
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• 2005

Characteristics of phenanthrene removal in the Electrokinetic (EK)-Fenton process were investigated in a 2-dimensional test cell in a viewpoint of the effect of gravity and electrosmotic flow (EOF). When the constant voltage of 100 V was applied to this system, the current decreased from 1,000 to 290 mA after 28 days, because soil resistance increased due to the exhaustion of ions in soil by electroosmosis and electromigration. Accumulated EOF in two cathode reservoirs was 10.3 L and the EOF rate was kept constant for 28 days. At the end of operation, the concentration of phenanthrene was observed to be very low near the anode and increased in the cathode region because hydrogen peroxide was supplied from anode to cathode region following the direction of EOP. Additionally, the concentration of phenanthrene decreased at the bottom of the test cell because the electrolyte solution containing hydrogen peroxide was largely transported toward the bottom due to a low capillary action in the soil with high porosity. Average removal efficiency of phenanthrene by EK-Fenton process was 81.4% for 28 days. In-situ EK-Fenton process would overcome the limitations of conventional remediation technologies and effectively remediate the contaminated sites.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.48 no.2
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• pp.28-34
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• 2011

In previous reports, we investigated a selective assembly method of fabricating single-walled carbon nanotubes (SWCNTs) on a silicon-dioxide ($SiO_2$) surface by using only a photolithographic process. In this paper, we have fabricated field effect transistors (FETs) with SWCNT channels by using the technique mentioned above. Also, we have electrically measured gating effects of these FETs under different source-drain voltages ($V_{SD}$). These FETs have been fabricated for sensor applications. Photoresist (PR) patterns have been made on a $SiO_2$-grown silicon (Si) substrate by using a photolithographic process. This PR-patterned substrate have been dipped into a SWCNT solution dispersed in dichlorobenzene (DCB). These PR patterns have been removed by using aceton. As a result, a selectively-assembled SWCNT channels in FET arrays have been obtained between source and drain electrodes. Finally, we have successfully fabricated 4 FET arrays based on SWCNT-channels by using our simple self-assembly technique.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.4
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• pp.347-353
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• 2002

A structure of a glass electrode-type pH sensor for measuring any concentration of $H^+$ in an aqueous solution was embodied with bulk micromachining technology. Two open well structures were formed, and a reference electrode was secured by the Ag/AgCl thin film in the sloped side of the etched structure. A sensitive membrane of an indicator electrode for generating a potential by an exchange reaction to $H^+$ was made with a glass containing Na 20% or more finely so that its thickness might be $100{\mu}m$ or so, and then it was bonded to one pyramidal structure. A liquid junction for a current path was formed by filling an agar in the anisotropically etched part of the Si wafer, which had a size of $50{\mu}m{\times}50{\mu}m$, and then bonded it to the other. After complete fabrication of each part, it was filled with a 2M KCl reference solution and encapsulated the sensor structure with a cold expoxy. The potential value of fabricated pH sensor was about 90mV/pH in the standard pH solutions.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.91-96
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• 2014

Through silicon via (TSV) technology is to form a via hole in a silicon chip, and to stack the chips vertically for three-dimensional (3D) electronics packaging technology. This can reduce current path, power consumption and response time. In this study, Cu-filling substrate size was changed from Si-chip to a 4" wafer to investigate the behavior of Cu filling in wafer level. The electrolyte for Cu filling consisted of $CuSO_4$ $5H_2O$, $H_2SO_4$ and small amount of additives. The anode was Pt, and cathode was changed from $0.5{\times}0.5cm^2$ to 4" wafer. As experimental results, in the case of $5{\times}5cm^2$ Si chip, suitable distance of electrodes was 4cm having 100% filling ratio. The distance of 0~0.5 cm from current supplying location showed 100% filling ratio, and distance of 4.5~5 cm showed 95%. It was confirmed good TSV filling was achieved by plating for 2.5 hrs.

• Journal of the Korean Electrochemical Society
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• v.12 no.2
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• pp.148-154
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• 2009

With respect to the durability of large scale ($150cm^2$) membrane electrode assembly (MEA) of direct methanol fuel cell (DMFC), degradation phenomena at cathode is monitored and analyzed according to the position on the cathode surface. After constant current mode operation of large scale MEA for 500 hr, the MEA is divided into three parts along the cathode channel; (close to) inlet, middle, and (close to) outlet. The performance of each MEA is tested and it is revealed that the MEA from the cathode outlet of large MEA shows the worst performance. This is due to the catalyst degradation and GDL delamination caused by flooding at cathode outlet of large MEA during the 500 hr operation. Particularly on the catalyst degradation, the loss of electrochemically active surface area (ECSA) of catalyst gets worse along the cathode channel from inlet to outlet, of which the reason is believed to be loss of catalysts by dissolution and migration rather than their agglomeration. The extent of loss in the performance and catalyst degradation has strong relation to the cathode flooding and it is required to develop proper water management techniques and separator channel design to control the flooding.

• Journal of the Korean Chemical Society
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• v.27 no.4
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• pp.279-286
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• 1983

An apparatus was made for the electrodeposition of alpha emitting actinide nuclides, $^{207}Bi$ and $^{210}Po$. The electrodeposition was made on a polished stainless steel plate cathode. The anode was made of platinum wire and to stir the solution. With the ammonium chloride as electrolyte initial pH = 4, chloride concentration = 0.6M and solution volume = 15ml, a current of 1.5 ampere(current density = 0.59A/$cm^2$) was flowed for 100 minutes for the quantitative recovery of electrodeposition and on average recovery of 98.3% was obtained within ${\pm}$0.7% uncertainty. Alpha spectrometry of the electrodeposited sample showed alpha peaks from $^{210}Po, ^{234}U$ and $^{239}Pu$ having energy resolution (FWHM) of 18.3, 21.8 and 36.0 keV respectively. The electrodeposition and alpha spectrometry for a natural uranium sample of domestic origin gave $^{238}U : ^{234}U = 1 : 6.1{\times}10^{-5}$ and for a neutron-irradiated uranium sample did $^{238}U : ^{239}Pu : ^{241}Am = 100 : 0.0263 : 5.20{times}10^{-5}$. The result of $^{238}U$ determination in the irradiated sample by electrodeposition-alpha spectrometry was in accord within ${\pm}1.6%$ of relative error with the results of solid fluorimetry and mass spectrometry. For $^{239}Pu$ the result of electrodeposition-alpha spectrometry was in accord within ${\pm}$4.0% of relative error with the results of anion exchange separation and the thenoyltrifluoroacetone(TTA) extraction both followed by alpha spectrometries.