• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.4
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• pp.805-811
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• 2012

In this paper, movement of conduction path has been analyzed for electron distribution in the channel of double gate(DG) MOSFET. The analytical potential distribution model of Poisson equation, validated in previous researches, has been used to analyze transport characteristics. DGMOSFETs have the adventage to be able to reduce short channel effects due to improvement for controllability of current by two gate voltages. Since short channel effects have been occurred in subthreshold region including threshold region, the analysis of transport characteristics in subthreshold region is very important. Also transport characteristics have been influenced on the deviation of electron distribution and conduction path. In this study, the influence of electron distribution on conduction path has been analyzed according to intensity and distribution of doping and channel dimension.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.881-883
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• 2005

In case is below length 100nm of gate, various kinds problem can be happened with by threshold voltage change of device, occurrence of leakage current by tunneling because thickness of oxide by 1.5nm low scaling is done and doping concentration is increased. SiO$_2$ dielectric substance can not be used for gate insulator because is expected that tunneling current become 1A/cm$^2$ in 1.5nm thickness low. In this paper, devised double gate MOSFET(DGMOSFET) to decrease effect of leakage current by this tunneling. Therefore, could decrease effect of these leakage current in thickness 1nm low of SiO$_2$ dielectric substance. But, very big gate insulator of permittivity should be developed for develop device of nano scale.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.5
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• pp.876-884
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• 2017

The current-voltage characteristics of Silicon(Si), Germanum(Ge), and hetero tunnel field-effect transistors(TFETs) with source-overlapped gate structure was investigated using TCAD simulations in terms of tunneling. A Si-TFET with gate oxide material $SiO_2$ showed the hump effects in which line and point tunneling appear simultaneously, but one with gate oxide material $HfO_2$ showed only the line tunneling due to decreasing threshold voltage and it shows better performance than one with gate oxide material $SiO_2$. Tunneling mechanism of Ge and hetero-TFETs with gate oxide material of both $SiO_2$ and $HfO_2$ are dominated by point tunneling, and showed higher leakage currents, and Si-TFET shows better performance than Ge and hetero-TFETs in terms of SS. These simulation results of Si, Ge, and hetero-TFETs with source-overlapped gate structure can give the guideline for optimal TFET structures with non-silicon channel materials.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.9
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• pp.1599-1604
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• 2008

In this paper, it has been analyzed how transport characteristics is influenced on gate oxide properties in the subthreshold region as nano structure FinFET is fabricated. The analytical model is used to derive transport model, and Possion equation is used to obtain analytical model. The thermionic emission and tunneling current to have an influence on subthreshold current conduction are analyzed for nano-structure FinFET, and subthreshold swings of this paper are compared with those of two dimensional simulation to verify this model. As a result, transport model presented in this paper is good agreement with two dimensional simulation model, and this study shows that the transport characteristics have been changed by gate oxide properties. As gate length becomes smaller, funneling characteristics, one of the most important transport mechanism, have been analyzed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.7 s.337
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• pp.5-12
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• 2005

The device performance of nano-scale center-channel (CC) double-gate (DG) MOSFET structure was investigated by numerically solving coupled Schr$\"{o}$dinger-Poisson and current continuity equations in a self-consistent manner. The CC operation and corresponding enhancement of current drive and transconductance of CC-NMOS are confirmed by comparing with the results of DG-NMOS which are performed under the condition of 10-80 nm gate length. Device optimization was theoretically performed in order to minimize the short-channel effects in terms of subthreshold swing, threshold voltage roll-off, and drain-induced barrier lowering. The simulation results indicate that DG-MOSFET structure including CC-NMOS is a promising candidates and quantum-mechanical modeling and simulation calculating the coupled Schr$\"{o}$dinger-Poisson and current continuity equations self-consistently are necessary for the application to sub-40 nm MOSFET technology.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.301.1-301.1
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• 2014

모바일 전자기기 시장의 큰 증가세로 인해 플래시 메모리 소자에 대한 수요가 급격히 증가하고 있다. 특히, 저 전력 및 고집적 대용량 플래시 메모리의 필요성이 커짐에 따라 플래시 메모리 소자의 비례축소에 대한 연구가 활발히 진행되고 있다. 하지만 10 nm 이하의 게이트 크기를 가지는 플래시 메모리 소자에서 각 셀 간의 간섭에 의한 성능저하가 심각한 문제가 되고 있다. 본 연구에서는 10 nm 이하의 낸드 플래시 메모리 소자에서 인접한 셀 간의 간섭으로 인해 발생하는 전기적 특성의 성능 저하를 관찰하고 메커니즘을 분석하였다. 4개의 소자가 배열된 낸드플래시 메모리의 전기적 특성을 3차원 TCAD 시뮬레이션을 툴을 이용하여 계산하였다. 인접 셀의 프로그램 상태에 따른 측정 셀의 읽기 동작과 쓰기 동작시의 전류-전압 특성을 게이트 크기가 10 nm 부터 30 nm까지 비교하여 동작 메커니즘을 분석하였다. 게이트의 크기가 감소함에 따라 플로팅 게이트에 주입되는 전하의 양은 감소하는데 반해 프로그램 전후의 문턱전압 차는 커진다. 플래시 메모리의 게이트 크기가 줄어듦에 따라 플로팅 게이트의 공핍영역이 차지하는 비율이 커지면서 프로그램 동작 시 주입되는 전하의 양이 급격히 줄어든다. 게이트의 크기가 작아짐에 따라 인접 셀 과의 거리가 좁아지게 되고 이에 따라 프로그램 된 셀의 플로팅 게이트의 전하가 측정 셀의 플로팅 게이트의 공핍영역을 증가시켜 프로그램 특성을 나쁘게 한다. 이 연구 결과는 10 nm 이하의 낸드 플래시 메모리 소자에서 인접한 셀 간의 간섭으로 인해 발생하는 전기적 특성의 성능 저하와 동작 메커니즘을 이해하고 인접 셀의 간섭을 최소로 하는 소자 제작에 많은 도움이 될 것이다.

• Journal of IKEEE
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• v.27 no.4
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• pp.644-649
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• 2023

As the cell spacing decreases during the scaling process of DRAM(Dynamic Random Access Memory), the reduction in STI(Shallow Trench Isolation) thickness leads to an increase in sub-threshold leakage due to the passing word line effect. The increase in sub-threshold leakage current caused by the voltage applied to adjacent passing word lines affects the data retention time and increases the number of refresh operations, thereby contributing to higher power consumption in DRAM. In this paper, we identify the causes of the passing word line effect through TCAD Simulation. As a result, we confirm the DRAM operational conditions under which the passing word line effect occurs, and observe that this effect alters the proportion of the total leakage current attributable to different causes. Through this, we recognize the necessity to consider not only leakage currents due to GIDL(Gate Induced Drain Leakage) but also sub-threshold leakage currents, providing guidance for improving DRAM structure.

• Journal of the Korean Vacuum Society
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• v.6 no.2
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• pp.103-108
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• 1997

Silicon field emitter arrays (FEAs) have been fabricated by a novel method employing a two-step tip etch and a spin-on-glass (SOG) etch-back process using double layered thermal/tetraethylortho-silicate (TEOS) oxides as a gate dielectric. A partial etching was performed by coating a low viscous photo resist and $O_2$ plasma ashing on order to form the double layered gate dielectric. A small gate aperture with low gate leakage current was obtained by the novel process. The hight and the end radius of the fabricated emitter was about 1.1 $\mu\textrm{m}$ and less than 100$\AA$, respectively. The anode emission current from a 256 tips array was turned-on at a gate voltage of 40 V. Also, the gate current was less than 0.1% of the anode current.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.12
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• pp.179-183
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• 2012

The random dopant fluctuation (RDF) effects of tunneling field-effect transistors (TFETs) have been observed by using atomistic 3-D device simulation. Due to extremely low body doping concentration, the RDF effects of TFETs have not been seriously investigated. However, in this paper, it has been found that the randomly generated and distributed source dopants increase the variation of threshold voltage ($V_{th}$), drain induced current enhancement (DICE) and subthreshold slope (SS) of TFETs. Also, some ways of relieving the RDF effects of TFETs have been presented.

• Journal of IKEEE
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• v.14 no.2
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• pp.82-89
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• 2010

In this paper, a buck-boost converter using three DTMOS(Dynamic Threshold Voltage MOSFET) switching devices is presented. The efficiency of the proposed converter is higher than that of conventional buck-boost converter. DTMOS with low on-resistance is designed to decrease conduction loss. The threshold voltage of DTMOS drops as the gate voltage increases, resulting in a much higher current handling capability than standard MOSFET. In order to improve the power efficiency at the high current level, the proposed converter is controlled with PWM(pulse width modulation) method. The converter has maximum output current 300mA, input voltage 3.3V, output voltage from 700mV to 12V, 1.2MHz oscillation frequency, and maximum efficiency 90%. Moreover, the LDO(low drop-out) is designed to increase the converting efficiency at the standby mode below 1mA.