• Title/Summary/Keyword: 무연 솔더

Search Result 194, Processing Time 0.024 seconds

Fluxless Plasma Soldering of Pb-free Solders on Si-wafer -Effect of Plasma Cleaning - (Si-wafer의 플럭스 리스 플라즈마 무연 솔더링 -플라즈마 클리닝의 영향-)

  • 문준권;김정모;정재필
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.11 no.1
    • /
    • pp.77-85
    • /
    • 2004

  • To evaluate the effect of plasma cleaning on the soldering reliability the plasma cleaning using Ar-10vol%$H_2$ gas was applied on a UBM(Under Bump Metallization). The UBM consisted of Au/ Cu/ Ni/ Al layers which were deposited on a Si-wafer with 20 nm/ 4 $\mu\textrm{m}$/ 4 $\mu\textrm{m}$/ 0.4 $\mu\textrm{m}$ thickness respectively. Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-37%Pb solder balls sized of 500 $\mu\textrm{m}$ in diameter were used. Solder balls on the UBM were plasma reflowed under Ar-10%$H_2$ plasma (with or without plasma cleaning). They were compared with air reflowed solder balls with flux. The spreading ratios of plasma reflowed solder with plasma cleaning was 20-40% higher than that of plasma reflowed solder without plasma cleaning. The shear strength of plasma reflowed solder with plasma cleaning was about 58-65MPa. It showed 60-80% higher than that of plasma reflowed solder without plasma cleaning and 15-35% higher than that of air reflowed solder. Thus it was believed that plasma cleaning for the UBM using Ar-10vol%$H_2$ gas was considerably effective for the improvement of the strength of solder ball.

  • PDF

Evaluation of Mechanical Property for Pb-free Solder/Ni Plate Joints with Artificial Aging Time (인공시효시간에 따른 Ni 기판 Pb-free 솔더접합부의 기계적 물성평가)

  • Park, So Young;Yang, Sung Mo;Yu, Hyo Sun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.39 no.5
    • /
    • pp.467-471
    • /
    • 2015

  • Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.

  • https://doi.org/10.3795/KSME-A.2015.39.5.467 인용 PDF KSCI