• 환경사랑
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• s.49
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• pp.8-9
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• 2007

2007년 그림 및 액자제품 전시회(Deco-Expo Atlanta)가 지난 9월 7일부터 9일까지 3일간 미국 애틀란타(Atlanta)주의 조지아 월드 콩그레스 센터(Georgia World Congress Center)에서 세계 각국의 액자관련 업체(몰딩, 프레임제품, 자재 및 기기 등)및 관계자들 10,000여 명이 참가한 가운데 열렸다. 올해도 국내 업체들을 이끌고 전시회에 참석했던 한국프레임공업협동조합의 진영존 전무에게서 전시회 관련 이야기를 들어 본다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Journal of the Korea Organic Resources Recycling Association
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• v.31 no.1
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• pp.5-14
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• 2023

In this study, LiDAR-reflective black hollow-structured silica/titania(B-HST) materials are successfully synthesized by employing the NaBH₄ reduction and etching method on silica/titania core/shell(STCS) materials, which also effectively enhance near-infrared(NIR) reflectance. Moreover, core-etched supernatant solutions are collected and recycled for the synthesis of extracted silica(e-SiO₂) process, which successfully applies as filler materials for semiconductor epoxy molding compound(EMC). In detail, B-HST materials, fabricated by the sequential experimental steps of sol-gel, reduction, and sonication-mediated etching method, manifest blackness(L^*) of 13.2 similar to black paint and excellent NIR reflectance(31.1%). Consequently, B-HST materials are successfully prepared as LiDAR-reflective black materials. Additionally, core-etched supernatant solution with silanol precursors are employed for synthesis of homogeneous silica filler materials via sol-gel method. As-synthesized silica fillers are incorporated with epoxy resin and carbon black for the preparation of semiconductor EMC. Experimentally synthesized EMC exhibits comparable mechanical-chemical properties to commercial EMC. Conclusively, this study successfully proposes designing procedure and practical experimental method for simultaneously synthesizing the NIR-reflective black materials for self-driving vehicles and EMC materials for semiconductors, which are materials suitable for the industrial 4.0 era, and presented their applicability in future industries.

• Journal of the Korea Organic Resources Recycling Association
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• v.32 no.3
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• pp.57-66
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• 2024

In this study, silicon sludge from a semiconductor packaging process is recycled to fabricate silica coated silicon-sludge and applied as a filler for an epoxy molding compound(EMC). Silicon-sludge powder(S-sludge) is treated with acid to remove metallic impurities and then coated using the sol-gel method to synthesize silica coated silicon-sludge powder(SS-sludge). The as-synthesized SS-sludge is subsequently mixed with epoxy resin, a curing agent, and carbon black to create an EMC(SS-sludge EMC). The heat dissipation properties of the EMC were examined using an IR camera. IR camera analysis confirmed that the SS-sludge EMC exhibited the highest surface temperature of 58.5℃ compared to SiO₂-based EMC. This enhancement in heat dissipation using SS-sludge EMC is attributed to the excellent thermal conductivity(150W/mK) of the silicon substrate and the presence of the silica layer on the SS-sludge surface which effectively enhances the thermal property of the EMC. Therefore, this study successfully demonstrates the recycling of silicon sludge from a semiconductor packaging process by synthesizing silica coated silicon-sludge and suggests a novel application of this material in semiconductor packaging.

• Proceedings of the Korean Fiber Society Conference
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• 2007.11a
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• pp.415-416
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• 2007

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2003.02a
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• pp.284-291
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• 2003

농산물은 수확된 후부터 계속해서 호흡, 증발, 대사작용을 계속한다. 이런 제반 활동에 기인된 품질손실을 수송과정에서 회복시킬 수는 없으며 단지 농산물은 자체내의 대사작용에 의해서만 에너지를 공급받아 품질을 유지해야 한다. 수확 직후부터 농산물은 세포의 부패로 인해 품질이 저하되기 시작하며 저장기간이 줄어들게 된다 결국 농산물은 수송하고 처리하는 동안의 온도변화, 수분감소, 가스발생 빈도, 물리적 손상, 위생상의 문제 등에 노출된다. (중략)

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.107-110
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• 2005

몰딩 공정중에 발생된 보이드(void)는 제품의 기계적인 물성치에 큰 영향을 준다. 미세균열(micro crack)이나 박리(delamination)등의 결함을 유발하는 보이드의 형성을 최소화시킬 수 있는 방법으로 진공 몰드를 제시하였다. 본 연구에서는 대기압 상태와 진공 상태에서 나타나는 유동 선단에서의 보이드 생성과 소멸을 실험관찰 하였고 몰드 패키지의 현상을 실험적으로 비교하였다. 아울러 진공 몰드의 공정 이론과 조건을 구하였다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.64-68
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• 2002

플립칩 공정에서는 반도체 칩과 기판사이의 열팽창계수(CTE : Coefficient of Thermal Expansion)의 차와 외적 충격과 같은 이유로 인해 피로균열(Fatigue crack)이나 치명적인 전기적 결함이 발생하게 된다. 이런 부정적인 요인들로부터 칩을 보호하고 신뢰성을 향상시키기 위해서 플립칩 언더필 공정이 적용되고 있다. 본 연구에서는 기존의 몰딩 공정을 응용한 플립칩 언디필 방법을 소개하였다. 공정 이론과 디바이스를 소개하였으며, 시뮬레이션 및 수식을 통하여 최적의 언더필을 위한 몰더 설계 조건을 구하였다. 그리고 본 연구를 통해 기대되는 공정의 장점을 제시하였다.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.29-33
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• 2002

In the flip-chip process, the problem like electric defect or fatigue crack caused by the difference of CTE, between chip and substrate board had occurred. Underfill of flip chip to overcome this defects is noticed as important work developing in whole reliability of chip by protecting the chip against the external shock. In this paper, we introduce the underfill methods using mold and plunge and improvement of process and reliability, and the advantage which can be taken from embodiment of device.

• Journal of Hydrogen and New Energy
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• v.22 no.3
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• pp.409-414
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• 2011

To promote the industry of PEMFC, the commercialization of its parts especially bipolar plate is needed. The bipolar plate is one of key parts for PEMFC, which occupies cost portion of 5~8% in the system. To replace the bipolar plate of machined graphite highly costly, the stamped thin matal or the molded carbon composite has been developed. According to the merits and demerits of each material and its forming process, the stamped metallic plate has been considered to the bipolar plate of PEMFC for automotive, and on the other hand, the molded composite plate has been considered to one for building applications. Hankook Tire Co., Ltd. has developed the carbon composite material and the manufacturing process for the bipolar plates. The developed bipolar plates were proved to be fully applicable to PEMFC of building applications in characteristics and performance, and so government strategic project to develop the mass-production technology for bipolar plates was started and is being conducted by the company. Through the government project for obtaining both the commercialization technology and production capacity for the bipolar plates, the price and the performance of domestic PEMFCs are expected to become competitive in international market.