• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.547-552
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• 2007

In this paper, the coupled microstrip lines of hairpin type are applied to design a compact microstrip ring hybrid. When the gap decreases, three attenuation poles are created by coupling between the lines. The proposed structure can achieve a significant reduction of size and suppression of the harmonics. And it has the same frequency responses of conventional ring hybrid at 2.55 GHz. The harmonics are suppressed to below -20 dB up to 12 GHz, including the third harmonic. The ring part size of the proposed ring hybrid is reduced to one forth of the conventional ring hybrid. The measured frequency responses agree well with simulated ones.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.12
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• pp.1359-1364
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• 2012

The C-band semi-lumped lowpass filter with broad stopband and compact size characteristic using chip inductor is proposed. To provide an additional attenuation pole in stopband by SRF, a separable inductor is added to proposed structure, and it has broad stopband characteristic. The third order elliptic function lowpass filter with chip inductor(L: 9.1 nH, SRF: 5.5 GHz, Q: 25) has insertion loss of 0.38 dB, cutoff frequency of 920 MHz, broad stopband(below 20 dB) of 1.43~7.8 GHz and the size is reduced 37.4 % compared to distributed inductor.

• Journal of Digital Convergence
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• v.19 no.6
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• pp.299-308
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• 2021

This study aimed at identifying the significant effects and effectiveness of patients with mild dementia when using personalized reminiscence therapy digital services using AI voice technology. In the process of interpreting the results of stakeholder interviews, the design idea of personal customization using voice AI technology was derived, and prototypes were created and usability tests were conducted in the first and second rounds. The main results are as follows: Since reminiscence therapy itself is highly influenced by personal experience and can receive customized care guides based on treatment status and results through customized treatment programs, the concept of personalization can improve the quality of treatment than existing treatment methods. However, it is expected that the usability of the service will further increase if we study micro-interactions that can prevent errors and increase usability, as issues that may arise due to the forgetting cognitive characteristics of mild dementia patients are observed.

• Journal of the Korea Society of Computer and Information
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• v.28 no.12
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• pp.221-229
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• 2023

Recently, Grid-forming(GFM) converter, which offers features such as virtual inertia, damping, black start capability, and islanded mode operation in power systems, has gained significant attention. However, in low-voltage microgrids(MG), it faces challenges due to the coupling phenomenon between active and reactive power caused by the low line impedance X/R ratio and a non-negligible power angle. This power coupling issue leads to stability and performance degradation, inaccurate power sharing, and control parameter design problems for GFM converters. Therefore, this paper serves as a review study on not only control methods associated with GFM converters but also power decoupling techniques. The aim is to introduce promising control methods and enhance accessibility to future research activities by providing a critical review of power decoupling methods. Consequently, by facilitating easy access for future researchers to the study of power decoupling methods, this work is expected to contribute to the expansion of distributed power generation.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.3 no.1 s.4
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• pp.13-19
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• 2004

The VCO(Voltage Controlled Oscillator) with low phase noise and high reliability is implemented using nonlinear design, and its phase noise characteristics are compared with that of Lesson's equation. The microstripline coupled with dielectric resonator is realized as a high impedance inverter to improve the phase noise, and the qualify factor of resonator circuit can be transferred to active device with the enhanced the loaded quality factor. The worst case and part stress analyses are achieved to obtain the high reliability of VCO. The developed VCO has the oscillating tuning factor of 0.56MHz/V for the control voltage range of 0$\~$12V This VCO requires the DC power of 160mW. The phase noise characteristics exhibit good performances of -96.51dBc/Hz @ 10KHz and -116.3dBc/Hz @ 100KHz, respectively. And, the output power of 7.33 dBm is measured.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.2 no.2
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• pp.19-24
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• 1991

This paper propose a new taegeuk shaped directional couper and verify the possibility of high power division rate in those directional coupler through the experiments. We took the taegeuk shaped structure in those proposed directional coupler to utilize a $3\lambda/4$ section of hybrid ring directional coupler actively, and calculated the branch admittances, which satisfied the condition of perfect matching and isolation in the center frequency, by even odd mode analyzing methodes. On the result, we knew that it can be realized a much higher power division rate than reported result in same circuit area within the producible resistance limit in the microstrip line, made the taegeuk shaped directional couplers with 0, 8, 16 dB power split ratio in the 10 GHz frequency using CGP - 502 plate, and confirmed the validity of theory through the experiments.

• Journal of the Korean Society for Nondestructive Testing
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• v.35 no.1
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• pp.12-17
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• 2015

In this study, we analyzed and showed the enhanced thermal resolution of a lock-in infrared thermography system by employing a blackbody system and micro-register sample. The noise level or thermal resolution of an infrared camera system is usually expressed by a noise equivalent temperature difference (NETD), which is the mean square of the deviation of the different values measured for one pixel from its mean values obtained in successive measurements. However, for lock-in thermography, a more convenient quantity in the phase-independent temperature modulation amplitude can be acquired. On the basis of results, it was observed that the NETD or thermal resolution of the lock-in thermography system was significantly enhanced, which we consider to have been caused by the averaging and filtering effects of the lock-in technique.

• Journal of Advanced Navigation Technology
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• v.11 no.1
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• pp.64-71
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• 2007

In this paper, we have designed and fabricated microstrip antenna of S-band for the wireless LAN and the ISM. It array $2{\times}2$ circular patch antenna elements at plane instead of conventional rectangular patch antenna elements. It optimized to size calculated of single patch antenna. The radiation elements distance is array $0.24{\lambda}$. The fabricated circular patch antenna decreased 8% of size compared to the conventional rectangular patch antenna. In the E-plane, designed circular microstrip patch $2{\times}2$ array antenna gain is 12.7[dBi], half power beam width is $40^{\circ}$ and in the H-plane, antenna gain is 12.1[dBi], half power beam width is $45^{\circ}$. Bandwidth is 250[MHz] (VSWR < 2).

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.7 no.3
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• pp.142-146
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• 2014

In this paper, an antenna which has quad band in GSM/DCS/PCS/Bluetooth is proposed. This structure is designed with miniaturization for wide band characteristic based on monopole antenna and log-periodic toothed trapezoid patch antenna which has slots. To achieve multi-bandwidth is used the microstrip line on the substrate. An antenna size is $35mm{\times}20mm$ on FR-4(${\varepsilon}r=4.4$) ground substrate of $35mm{\times}75mm{\times}1mm$ size. And proposed antenna is satisfied with impedance bandwidth(VSWR ${\leq}$ 3). The simulated maximum radiation gain is 1.92 dBi, 3.26 dBi, 3.97 dBi at the center frequency of 0.92 GHz, 1.97 GHz, 2.45 GHz, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.63-69
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• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.