• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.49-49
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• 1999

리튬 이차 전지를 박막화함으로써 개발된 고상의 마이크로 박막전지는 임의의 크기 및 형태로의 제작이 가능하며 액체전해질을 사용하지 않기 때문에 작동 중 열 또는 기체 생성물이 생기지 않아 높은 안정성을 갖으며 광범위한 사용 온도 범위를 가진다. 위와 같은 장점으로 인하여 충전 가능한 고상의 박막형 리튬 이차 전지는 점진적으로 그 사용 범위가 크게 확대될 것으로 판단된다. 즉, 초소형 전자, 전기 소자는 물론이며 조만간 실현될 스마트 카드, 셀루러폰 및 PCS와 같은 개인용 휴대 통신장비의 전력 공급계로의 응용이 가능할 것이다. 특히 장수명, 고에너지 밀도를 갖는 초소형의 전지를 필요로 하는 microelectronics, MEMS등에 이용될 수 있는 이차전지에 대한 요구가 점점 가시화 됨에 따라 박막공정을 이용한 이차전지개발기술이 요구되고 있으며, 박막제조기술을 이용한 고상의 박막형 및 전지에 관한 연구가 증가하고 있다. 본 연구에서는 박막형 리튬 이차전지의 Cathode 물질로써 비정질의 산화바나듐 박막을 반응성 스퍼터링에 의하여 상온에서 증착하였다. 박막형 이차전지의 여러 가지 Cathode 물질중 산화바나듐은 다른 물질들과는 달리 비정질 형태로 매우 우수한 충방전 특성을 나타낸다. 이런 특성으로 인해 다소 전지자체의 성능은 낮지만 저전력 저전압을 필요로 하는 초소형 전자 소자와 혼성되어 이용할 수 있는 잠재성이 매우 높은 물질이다. 바나듐 타겟의 경우 타겟 표면의 ageing에 따라 증착되는 박막의 특성이 매우 달라지게 되므로 presputtering의 시간을 변화시키면서 실험하였다. 또한 스퍼터링 중의 산소의 분압도 타겟의 ageing에 많은 영향을 주므로 실험 변수로 산소분압을 변화시키면서 실험하였다. 증착된 산화바나듐 박막의 표면은 scanning electron microscopy로 분석하였으며 구조 분석은 X-선 회절분석, X-ray photoelectron spectroscopy 그리고Auger electron spectroscope로 하였다. 증착된 산화바나듐 박막의 전기화학적 특성을 분석하기 위하여 리튬 메탈을 anode로 하고 EC:DMC=1:1, 1M LiPF6 액체 전해질을 사용한 Half-Cell를 구성하여 200회 이상의 정전류 충 방전 시험을 행하였다. Half-Cell test 결과 박막의 결정성과 표면상태에 따라 매우 다른 전지 특성을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.41-49
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• 2008

Thermoelectric properties of the n-type Bi-Te and the p-type Bi-Sb-Te films were measured and the growth behaviors of the electrodeposited Bi-Te and Bi-Sb-Te nanowires were characterized. Filling ratios of 81% and 77% were obtained for electrodeposition of the Bi-Te and the Bi-Sb-Te nanowires, respectively, into the nano pores of 200 nm-diameter of an alumina template. A thermoelectric module, composed of the Bi-Te nanowires and the Bi-Sb-Te nanowires was processed by electrodeposition, and a resistance value of $15{\Omega}$ was measured between the Ni electrodes formed on the Bi-Te nanowires and the Bi-Sb-Te nanowires of the module.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.14 no.5
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• pp.223-230
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• 2014

In this paper, the single-fed microstrip parasitic array antenna for low-cost three-dimensional beam steering in 5.8GHz ISM(5.725GHz~5.825GHz) band is designed and implemented. The antenna is comprised of one feed active element and four passive elements with variable reactance loads. The beam steering range of implemented antenna is achieved three-dimensional beam steering of ${\pm}28^{\circ}$ at azimuth angle ${\Phi}=0^{\circ}$, ${\Phi}=45^{\circ}$, ${\Phi}=90^{\circ}$, and ${\Phi}=135^{\circ}$ by adjusting variable reactance loads. The maximum gain of the antenna in the beam steering range have within 7.23dBi~9.36dBi and the bandwidth of return loss lower than -10dB covers 5.8GHz ISM band regardless of the beam steering angles.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.8 no.5
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• pp.442-451
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• 1997

We described a miniaturization of microstrip filters by the exact synthesis. With the exact synthesis, we can design completely new circuits physically realizable. The complex procedure for the network synthesis could be reduced by using computer software. It is a new design procedure ensuring the creation of optimum networks which have minimum number of elements. The exact synthesis gives more possibilities to make wideband filters which require bandwidth of 50~100 %. S-plane Bandpass prototypes are made with non-redundant filter synthesis technique that has transmission zero locations at required frequencies. Because this method uses the transmission lines which lengths are ${\lambda}$/4 at the stopband center frequency, we can reduce the size of the filter dramatically.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.61-71
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• 1999

The recent trend toward higher frequencies, miniaturization and lower-cost in wireless communication equipment is demanding high density packaging technologies such flip chip interconnection and multichip module(MCM) as a substitute of conventional plastic package. With analyzing the recently reported research results of the RF flip chip, this paper presents the technical issues and advantages of RF flip chip and suggest the flip chip technologies suitable for the development stage. At first, most of RF flip chips are designed in a coplanar waveguide line instead of microstrip in order to achieve better electrical performance and to avoid the interaction with a substrate. Secondly, eliminating wafer back-side grinding, via formation, and back-side metallization enables the manufacturing cost to be reduced. Finally, the electrical performance of flip chip bonding is much better than that of plastic package and the flip chip interconnection is more suitable for Transmit/Receiver modules at higher frequency. However, the characterization of CPW designed RF flip chip must be thoroughly studied and the Au stud bump bonding shall be suggested at the earlier stage of RF flip chip development.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.7
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• pp.998-1009
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• 1999

In this paper, a microstrip aperture-patch antenna and a microstrip ring antenna, which have single microstrip line feeding systems for the circular polarization, are designed, and experimental results are presented at X-band. The microstrip aperture-patch antenna is characterized by its wide operating frequency range, and the microstrip ring antenna is suitable for a basic radiator in the large array antenna due to its small size. Several design parameters for these antennas are considered and analyzed to improve antenna characteristics such as VSWR bandwidth and axial ratio. Initially, the sizes of the aperture and ring radiator are determined on a basis of the cavity model, then shapes of the patch within the aperture and the inner stub of the ring are optimized using Ensemble software. Measurement results show that the aperture-patch antenna has 25% of VSWR bandwidth and 1.2dB of axial ratio at the boresight, and the ring antenna has 6.7% of VSWR bandwidth and 1.6dB of axial ratio at the boresight.

• Polymer(Korea)
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• v.26 no.5
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• pp.634-643
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• 2002

Ultrathin film of polyamic acid having benzene and sulfonyloxyimide moieties was prepared using the Langmuir-Blodgett (LB) technique, and then photosensitive polyimide LB film was obtained by the thermal treatment of precursor polyamic acid multilayers at 200$\^{C}$ for 1 hr. The polyamic acid was synthesized by condensation polymerization under THF and pyridine cosolvent. All monomers and polymers were identified through elemental analysis, FT-IR and $^1$H-NMR spectroscopic measurements. The microarray patterning of photosensitive polyimide LB film on a gold substrate was generated with a deep UV lithography technique. The well-characterized monolayer of cytochrome c was immobilized on the microarray patterns using two different self-assembly processes. Physical and electrochemical properties of the self-assembled cytochrome c monolayer were investigated based on cyclic voltammetry and atomic force microscopy (AFM). Also, its application in bioelectronic device was examined.

• Applied Chemistry for Engineering
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• v.30 no.1
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• pp.23-28
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• 2019

We report a supercapacitor cable, which consists of three-dimensional (3D) porous graphene coated onto the surface of carbon thread. The 3D porous framework of graphene was constructed by microwave-activated process using a graphene oxide-coated carbon thread. The use of microwave irradiation enabled to convert graphene oxide into reduced graphene oxide without any reducing agents and activate graphene sheets into exfoliated and porous graphene sheets. Combining two wire electrodes with a polymer gel electrolyte successfully completed supercapacitor device in a form of cable construction. The supercapacitor cables were highly flexible, and thus can be transformed into various shapes of devices and be integrated into textile items. A high area-capacitance of 38.1 mF/cm was obtained at a scan rate of 10 mV/s. This capacitance was retained 88% of its original value at 500 mV/s. The cycle life was also demonstrated by repeating a charge/discharge process during 10,000 cycles even under bent states, showing a high capacitance retention of 96.5%.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.45-49
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• 2019

Herein we developed the hot extrusion technology to prepare n-type Bi-Te-Se-based thermoelectric materials with high reliability. Starting ingot was fabricated via melt-solidification process, then pulverized it into powders (${\sim}30{\mu}m$) by using high energy ball milling. By optimization of mold design and temperature-pressure conditions for hot extrusion, dense extrudate of 1.8 mm in diameter with high 00l orientation could be obtained from disc-shape compacted powders (20 mm in diameter). High power factor ${\sim}4.1mW/mK^2$ and enhanced mechanical strength ~50 MPa were simultaneously observed at 300 K.