• Proceedings of the KIPE Conference
• /
• 2019.07a
• /
• pp.424-425
• /
• 2019

본 논문은 1차 RC 등가회로를 이용하여 리튬이온 배터리의 저항성 발열인 비가역 발열의 파라미터를 제시하였다. 발열 추정을 위해 1 C-rate에서 HPPC(Hybrid Pulse Power Characterization) 실험을 통하여 비가역 발열의 파라미터인 SOC 5%별 내부 저항을 추출하였다. 추출된 SOC 5%별 저항을 이용하여 1C-rate에서 3C-rate로 변화하는 조건에서 열 추정 성능을 확인하였다. 높은 C-rate로 방전 전류가 변화하는 상황에서 발열 시뮬레이션과 실험값을 비교하였으며, 1C-rate의 HPPC 실험에서 얻어진 내부 저항이 부하의 변동에 따른 리튬이온 배터리의 발열 추정 파라미터로써 사용될 수 있음을 검증하였다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.5 no.4
• /
• pp.295-305
• /
• 1993

Thermal performance of test cell of model hot water Ondol house was simulated by equivalence heat resistence and heat capacity method. In this method wall was replaced by two equivalence and one heat capacity. This method enables to simulate the variation of temperature of each element of model house. The effect of pipe diameter, pitch of pipe and with or without consideration of inter-radiation between wall surfaces on the energy consumption rate were investgated. Results show that radiations between the ground surface of room and wall surfaces contribute to the heating of room air by reducing the convection heat loss through the wall surfaces.

• Proceedings of the KIEE Conference
• /
• 2015.07a
• /
• pp.780-781
• /
• 2015

영구자석 전동기(PMSM)의 온도 상승은 권선 저항 증가에 의한 동손 증가와 희토류 계열 영구자석의 성능 저하, 고온 불가역감자 등의 원인이 되기 때문에 전동기의 성능이 저하되고 수명이 단축된다. 따라서 본 논문에서는 영구자석의 온도 상승 억제를 위하여 자속 장벽을 설치하고, 이를 열 등가회로망으로 열 해석을 수행하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.4
• /
• pp.23-33
• /
• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Journal of IKEEE
• /
• v.25 no.3
• /
• pp.528-533
• /
• 2021

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.18 no.8
• /
• pp.664-671
• /
• 2006

We propose the correlation to predict the spreading thermal resistance on a plate with symmetrical four heat sources. The correlation transforms four heat sources to a single equivalent heat source and then the spreading thermal resistance can be obtained with the existing equation for a single heat source. When the four heat sources are mounted on a square base plate, the correlation is expressed as a function of the heat source size, the length of base plate, the plate thermal conductivity and the distance between heat sources. Compared to the results of three-dimensional numerical analysis, the spreading thermal resistance by the proposed correlation is in good agreement within 10 percent accuracy.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.43 no.5 s.311
• /
• pp.60-67
• /
• 2006

Thermal analysis and prediction of electronic components is required to predict and optimize the reliability of onboard electronic unit employed in space vehicles. This paper introduces a methodology on thermal prediction that uses isothermal PCB model, thermal force model, thermal resistance matrix and superposition principle to calculate electronic devices temperatures undergoing thermal conduction environment. An example is Presented including a prediction result by this method and simulation results performed by commercial program.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.6 no.2
• /
• pp.78-92
• /
• 1994

Thermal performance of pipe network of continuous heating system controlled by thermostat and flow control valve was simulated in consideration of radiation heat transfer and solved by linear analysis method. Thermal performance of real apartment building with radiant floor heating system was simulated by equivalence heat resistance-capacity method. This method enables to simulate the unsteady variation of temperature or each element of building. Heat transfer characteristics of each element were also investigated.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.40 no.4
• /
• pp.316-329
• /
• 2012

In this paper, optimum design process of ICP (Inductively Coupled Plasma) torch, which has been used widely in aerospace application, such as supersonic plasma wind tunnel, is presented. For this purpose, the behaviors of equivalent circuit parameters (equivalent resistance and inductance, coupling efficiency) were investigated according to the variations of torch design parameters (frequency, $f$, confinement tube radius, $R$ and coil turn numbers, $N$) in the basis of analytical and numerical MHD (Magneto Hydro-Dynamics) models combined with electrical circuit theory. From the results, it is found that equivalent resistance is increased with the increase of $f$ values but vice versa for equivalent inductance. For elevated values of $R$ and $N$, however, both parameters tend to increase. Based on these observations, ICP torch with a power level of 10 kW can be optimized at the design ranges of $f$=4~6 MHz, $R$=17~25 mm and $N$=3~4 to maximize the electrical coupling efficiency, which is the ratio of equivalent resistance to equivalent inductance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.481-482
• /
• 2005

유기발광소자의 발광층의 전압에 따른 임피던스의 변화를 살펴보았다. 임피던스는 전압의 변화에 따른 의존성을 보이며, 그에 따른 임피던스와 Cole-Cole 반원의 변화를 전기전도기구와 비교하여 살펴보았다. 소자의 구조는 ITO/$Alq_3$/Al의 구조로 발광층의 두께는 60 nm로 열증착하여 실험하였다. 실험에서 전기전도기구의 Ohmic 영역, SCLC 영역, 부성저항영역, TCLC 영역에서 각각 임피던스를 측정하였고, 전압의 증가에 따라 임피던스의 크기가 감소하고, 위상각은 0V에서 용량성을 보이다가 발광영역에서 저항성을 나타내는 것을 알 수 있었다. 또한 전압에 따른 Cole-Cole 반원을 살며보면 전압이 증가할수록 반원의 크기가 감소하는 것을 알 수 있으며, 이를 통해 간단한 등가회로를 예측할 수 있었다.