Journal of the Institute of Electronics Engineers of Korea SC (전자공학회논문지SC)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Thermal Analysis of Electronic Devices in an Onboard Unit Considering Thermal Conduction Environment

열전도 환경을 고려한 전장탑재물의 소자 열 해석

  • Published : 2006.09.01
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Abstract

Thermal analysis and prediction of electronic components is required to predict and optimize the reliability of onboard electronic unit employed in space vehicles. This paper introduces a methodology on thermal prediction that uses isothermal PCB model, thermal force model, thermal resistance matrix and superposition principle to calculate electronic devices temperatures undergoing thermal conduction environment. An example is Presented including a prediction result by this method and simulation results performed by commercial program.

우주 비행체 전자장비의 신뢰도를 예측하고 최적화하기 위해 탑재장치 내 부품의 온도 예측이 필수적으로 요구된다. 본 논문에서는 전자장비 부품의 온도 예측방법에 관해 기술하고 있다. 본 예측 방법은 PCB 기판의 열전도도를 등방성모델로 설정하여 등가 열전도도를 계산하고 열력 모델을 이용하여 열 저항 행렬을 생성하였으며, 중첩의 원리를 이용하여 각 부품들의 온도를 예측하였다. 또한 본 논문의 온도 예측방법을 이용하여 전장품 소자의 열해석 결과와 상용 프로그램을 이용한 온도 계산 결과를 비교 분석하였다.

Keywords

References

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