• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1918-1920
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• 2001

초소형 히트파이프는 고집적 반도체 소자에서 발생되는 열을 효과적으로 소산하기 위한 열교환 장치이다. 초소형 히트파이프는 작동유체가 상 변화 잠열을 이용한 칩 레벨의 냉각 장치이다. 작동유체는 진공으로 밀봉된 공간내에서 외부 동력 없이 모세관력에 의하여 이동한다. 본 논문에서는 실리콘보다 열전도도가 우수하여 발생되는 열을 더욱 빠르게 소산시킬 수 있는 구리 모재의 초소형 히트파이프를 제작한다. 특히, 모세관력은 히트파이프의 성능을 좌우하는 요소이다. 모세관력 향상을 위해서 구리 전기도금으로 이용하여 홈(groove)부분을 제작한다. 윅(wick) 제작, 구리판 접합, 작동유체 충전등으로 초소형 히트파이프를 제작한 후, 성능 실험한 결과를 보여준다.

• The Korean Journal of Zoology
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• v.37 no.1
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• pp.58-65
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• 1994

Phosphatase의 저해제로 알려진 okadaic acid(OA)가 한국산 개구리(북방산개구리 참개구리) 난자의 성숙에 미치는 효과를 조사하였다. 북방산개구리 난자에 약 50 nl의 okadaic acid(0 5-500 mM)를 미세주입한 후 18시간 배양한 결과 0.5 mM의 농도에서 부터 난자의 핵붕괴를 일으키기 시작하였다 동면초기에 처리한 progesterone에 반응하지 않는 난자들도 OA에 의하여 성숙을 일으켰으며. 이 성숙은 배양액에 첨가한 cycloheximide(10 mg/ml)에 영향을 받지 않았다 또한 OA의 처리를 받고 일정시간 배양한 난자의 세포질에는 미성숙 난자의 성숙을 유도하는 maturation promoting factor (MPF)의 활성이 생기었다 참개구리의 난자도 역시 OA에 의해 성숙이 유도되었으며, 주입 후 6시간에서부터 핵붕괴가 일어나기 시작하였다 참개구리에서도 OA의 처리가 MPF의 활성을 촉진하는 것을 세포질내에 Hl histone kinase의 활성도가 증가하는 것으로 확인할 수 있었다 참개구리에서도 OA에 의한 성숙은 cycloheximide나 CAMP에 의해 영향을 받지 않았다 이러한 결과들은 개구리 난자의 MPF 활성화와 성숙과정에 phosphatase가 관여함을 보여주는 것이다.

• Korean Journal of Environmental Biology
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• v.21 no.2
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• pp.203-207
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• 2003

Amphibian biodiversity, community structure and habitats were surveyed in the Mt. Myungji area from April 2002 to March 2003. During the survey period 2orders, 4 families, 7 species of amphibians were observed. Bombina orientalis (DI =45.1%) was dominant and Bufo stejnegeri (DI = 12.8%), Rana rugosa and Rana dybowskii (DI = 9.9% each) Rana nigromaculata and Rana huanrenensis (DI 1.4% each), and Onycodactylus fisheri (DI = 7.0%) followed. Frequency of occurrence of O. fisheri and B. stejnegeri was largely different according to the altitude and human residence in their habitats.R. nigromaculata and R. huanrenensis showed low frequency of occurrence (<10%) suggesting the decrease in habitation density in this area. The species richness (R'), general diversity (H'), and evenness (E') of amphibians in this area were 0.98, 2.12, and 0.76, respectively, suggesting relatively healthy condition of amphibian community in this area.

• Journal of Korean Society of Environmental Engineers
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• v.27 no.9
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• pp.958-964
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• 2005

Experiment was conducted to investigate the amount of hydrogen gas and the characteristics of organic acids production from various carbohydrates by anaerobic bacteria. The variation characteristics of organic acids and hydrogen gas production at the fermentative culture were also studied in the presence of heavy metals such as cadmium or lopper. 3.43 mole hydrogen per mole of hexose was produced when sucrose was used as a carbon source. Acetic acid and butyric acid were main products by the anaerobic fermentation. Hydrogen production rate was decreased and formation of acetic acid was increased as the concentration of heavy metals was increased in the medium. The inhibition of hydrogen production by the copper was more serious than the cadmium.

• Resources Recycling
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• v.10 no.6
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• pp.15-21
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• 2001

Shape-controlled copper oxides have been recovered from copper-containing waste etchant by neutralization with alkalihydroxide. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. In recycling process of copper oxide from the waste etchant, reaction temperature controls shapes and sizes of the products. Copper oxide recovered below reaction temperature $40^{\circ}C$ was of a needle shape, while copper oxide comes in a platy shape above $40 ^{\circ}C$ . Physical properties of samples have been characterized using SEM, XRD, TGA and Atomic absorption spectroscopy.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.61-66
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• 2018

This research scrutinizes the self-annealing characteristics of copper used to metal interconnection for application of DRAM fabrication process. As the time goes after the copper deposited, the grain of copper is growing. It is called self-annealing. We use the electroplating method for copper deposition and estimate two kinds of electroplating chemicals having different organic additives. As the time of self-annealing is elapsed, sheet resistance decreases with logarithmic dependence of time and is finally saturated. The improvement of sheet resistance is approximately 20%. The saturation time of experimental sample is shorter than that of reference sample. We can find that self-annealing is highly efficient in grain growth of copper through the measurement of TEM analysis. The structure of copper grain is similar to the bamboo type useful for current flow. The results of thermal excursion characteristics show that the reliability of self-annealed sample is better than that of sample annealed at higher temperature. The self-annealed sample is not contained in hillock. The self-annealed samples grow until $2{\mu}m$ and develop in [100] direction more favorable for reliability.

• Journal of the Korean Geotechnical Society
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• v.16 no.4
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• pp.157-170
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• 2000

In this study, we conducted a combined adsorption-sequential extraction analysis(CASA) to investigate temperature effects of single and competitive adsorption of zinc and copper on natural clays. As a result, it was found out that in a single adsorption of zinc, the adsorption was mostly in the exchangeable phase, with increase n temperature. In a competitive adsorption of zinc, this trend was so strong that the exchangeable phase adsorption increase up to 80~90%. On the other hand, about 50% of copper was adsorbed in the carbonate occluded phase in single and competitive adsorptions. In the single adsorption the adsorption of carbonate occluded phase increased by 5% with the temperature increase and in the competitive adsorption the increase rate is about twice. The adsorption of zinc and copper on natural clays is an endothermic reaction with the exception of exchangeable phase adsorption.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.20-27
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• 1997

We have investigated the formation techniques of copper thin films which would be useful for sub-quarter-micron integrated circuits. A chemical vapor deposition technology has been tried for the better side wall formation of the thin films, and a metal organic compound, named (hface)Cu(VTMS) (hexafluoroacetylacetonate vinyltrimethylsilane copper(I)) was used as the precursors. We have deposited the copper thin films on TiN and $SiO_2$substrates. The film resistivity and deposition selectivity have been measured as functions of substrate temperature and chamber pressure. Best electrical properties were obtained at $180^{\circ}C$ of substrate temperature and 0.6 Torr of chamber pressure. Under the optimum deposition conditions, polycrystalline copper structures were observed to be grown, and the deposition rate of 120 nm/min was measured. The electrical resistivity as low as 0.25$mu \Omega$.cm, and the surface roughness of 15.5 nm were also measured. These are the suitable electrical and material properties required in the sub-quarter-micron device fabrication. Also, in the substrate temperature range of 140-$250^{\circ}C$, high deposition selectivity was observed between TiN and $SiO_2$.

• Journal of the Mineralogical Society of Korea
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• v.26 no.4
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• pp.219-228
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• 2013

To understand characteristics of biogeochemical corrosion for the metal canisters that usually contain the radioactive wastes for a long-term period below the ground, some metal materials consisting of cast iron and copper were reacted for 3 months with D. desulfuricans, a sulfate-reducing bacterium, under a reducing condition. During the experiment, concentrations of dissolved metal ions were periodically measured, and then metal specimen and surface secondary products were examined using the electron microscopy to know the chemical and mineralogical changes of the original metal samples. The metal corrosion was not noticeable at the absence of D. desulfuricans, but it was relatively greater at the presence of the bacterium. In our experiment, darkish metal sulfides such as mackinawite and copper sulfide were the final products of biogeochemical metal corrosion, and they were easily scaled off the original specimen and suspended as colloids. For the copper specimen, in particular, there appeared an accelerated corrosion of copper in the presence of dissolved iron and bacteria in solution, probably due to a weakening of copper-copper binding caused by a growth of other phase, iron sulfide, on the copper surface.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.632-638
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• 2021

With the copper interconnection in the semiconductor process, complex residues including copper oxide, fluoride, and polymeric fluorocarbon are formed by plasma etching. In this study, a cleaning solution was prepared with a component having an amine group (-NH₂) and a carboxyl group (-COOH), and the characteristics of removing post-etch residues in the copper wiring process were analyzed. In the cleaning solution containing an amine group, the length of the component substituted with nitrogen and the length of the carbon chain influenced the cleaning effect, and the etching rate of copper oxide increased as the pH of the cleaning solution increased. The activity of the amine group is in the basic region, and the activity of the carboxyl group is in the acidic region, and the cleaning process proceeds through complex formation with copper or copper oxide in each region.