• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Journal of the Korean Electrochemical Society
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• v.9 no.4
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• pp.141-150
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• 2006

Nanocrystalline CoW thin/thick film alloys were electodeposited from citrate baths to investigate the influences of metal ion concentration, current density and solution pH on chemical composition, current efficiency, residual stress, surface morphology, and microstructure of the film. Deposit W (tungsten) content in CoW thin/thick film increased with increasing W ion concentration, current density, and solution pH in the plating bath. It was observed that residual stress in CoW thin/thick film decreased with increasing W ion concentration and solution pH. CoW thin film exhibited mixed phases of hop Co [(100) and (002)] and hcp $Co_3W$ [(002) and (201)] at W ion concentration with 0.02 to 0.08 M. The microstructure of CoW thin film at W ion concentration of 0.1 to 0.2 M was close to amorphous phase. The dominant phases were found to be hop Co (002) and hop $Co_3W$ [(200), (002) and (201)] at the current densities of 5, 10, 25, and $100mA{\cdot}cm^{-2}$ CoW thin film at the current densities of 50 and $75mA{\cdot}cm^{-2}$ was close to amorphous phase. At solution pH 8.7, CoW thin film exhibited hcp Co (002) and hop $Co_3W$ [(200), (002) and (201)]. Below solution pH 8.7, CoW thin film exhibited amorphous microstructure. The optimum electrodeposition conditions for CoW thin/thick film were found to be W ion concentration of 0.08 M, current density of $10mA{\cdot}cm^{-2}$, and solution pH 8.7.

• Korean Journal of Materials Research
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• v.3 no.1
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• pp.33-42
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• 1993

Abstract The increasing application of $Al_2$,$O_3$ and related ceramics as engineering materials is because of their attractive properties of fine ceramics. One solution to the wide variety of ceramic to metal combination lies in the effective joining. Active metal brazing of $Al_2$,$O_3$, to STS304 was investigated using Cu -Ti alloys. Titanium additive is chosen since it is good oxide former~. Brazing is performed under vacuum($10^{-3}$-$10^{-4}$ torr), a temperature between 1100 and 120$0^{\circ}C$ and time of 0.5-1.5hr. The microstructure of the brazed joints of $Al_2$,$O_3$ to STS304 with Cu-Ti insert metals were examined by using optical microscope and SEM and reaction products were analyzed by using EDX, WDX and XRD. Also interfacial reactions occuring during the brazing of $Al_2$,$O_3$/Cu-Ti/STS304 system are discussed. Experimental results showed formation of Titanium oxide T$i_2$$O_3$ which is attributable to the joining $Al_2$,$O_3$ to STS304 with Cu-Ti insert metal.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.39-46
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• 2003

Sn-Cu eutectic solder bump was fabricated by electroplating for flip chip and its characteristics were studied. A Si-wafer was used as a substrate and the UBM(Under Bump Metallization) of Al(400 nm)/Cu(300 nm)/Ni(400 nm)/Au(20 nm) was coated sequentially from the substrate to the top by an electron beam evaporator. The experimental results showed that the plating ratio of the Sn-Cu increased from 0.25 to 2.7 $\mu\textrm{m}$/min with the current density of 1 to 8 A/d$\m^2$. In this range of current density the plated Sn-Cu maintains its composition nearly constant level as Sn-0.9∼1.4 wt%/Cu. The solder bump of typical mushroom shape with its stem diameter of 120 $\mu\textrm{m}$ was formed through plating at 5 A/d$\m^2$ for 2 hrs. The mushroom bump changed its shape to the spherical type of 140 $\mu\textrm{m}$ diameter by air reflow at $260^{\circ}C$. The homogeneity of chemical composition for the solder bump was examined, and Sn content in the mushroom bump appears to be uneven. However, the Sn distributed more uniformly through an air reflow.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• Journal of the Korean Ceramic Society
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• v.41 no.10 s.269
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• pp.777-782
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• 2004

In this research, $5\times5cm^2$ unit cells were fabricated via liquid condensation process and uniaxial pressing followed by the screen printing of electrolyte and cathode layer. The SOFC stack was assembled with unit cells, gasket-type sealant and metal interconnect. The stack was designed to have a single column with internal-manifold and cross-flow type gas-channels. The SOFC stack produced 15 W, which is $50\%$ of the maximum power being expected from the maximum power density of the unit cell. Controlling factors for the proper operation of the SOFC stack and other designing factors of stack manifold and gas channels were discussed.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2001.11a
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• pp.30-30
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• 2001

$Bi_2Te_3$계 열전재료는 200~400K 정도의 저온에서 네어지 변환효율이 가장 높은 재료로써 열전냉각, 바런재로 등에 응요하기 위하여ㅠ 제조법 및 특서에 관한 많은 연구가 진행되어 왔다. $Bi_2Te_3$계 화합물은 rhombohedral의 결정 구조를 가지는 층상 화 ;물로 결정대칭성으로 인해 연전기적으로 큰 이방성을 나타낸다. 현재는 일반향용고법에 의해서 입자를 a축 방향으로 성장시켜 큰 결정립을 가진 다결정재료를 사용하고 있으나, c면이 매우 취약하기 때문에 가공서이 나쁘다. 따라서 이와같은 단점을 개선하기 위하여 기계적 강도를 높일 수 있는 가공공정 및 합금설계에 대한 연구가 활발히 진행되고 있다. 측히 열간 압출법으로 제조된 열전재료는 결정립의 미세화와 높은 이방성으로 성능지수와 기계적 강도를 향상시킬 수 있다는 연구결과가 보고되고 있다 또한 Schultz드의 연구결과에 의하면 $Bi_2Te_3$ 계 열전재료는 소성변형에 의하여 발생한 점결함에 의하여 캐리어 농도가 변화되며 이로 인하여 재료의 전기적 성질이 결정된다고 하였다. 따라서 상당히 큰 소성가공량과 열전측성과의 관계를 규명하는 것은 매우 중요하다. 이에 본 연구에서는 압출변수 중 소성가공량에 중요한 변수로 작요아는 압출비를 변화시켜 최적의 열간 소성가공량을 검토하고, 이에 따른 열전측성과 압출비와의 상관관계에 대하여 연구하는 것을 목적으로 하였다. 연구에 사용된 N형의 조성은$Bi_2Te_{2.75}Se_{0.15}$로서 순도 99.99를 사용하였고, dopant로 0.1wt%의 $SbI_3$를 사용하였다. $Bi_2Te_{2.75}Se_{0.15}$ 분말은 가스분사법(Gas atomization Process)를 이용하여, 용탕제조시 아르곤가스로 산화를 방지하였고, 냉매로는 질소가스를 이용하였다. 제조된 분말을 기ㅖ적 분급법을 이용하여 분급하였고, 냉매로는 질소가스를 이용하였다. 제조된 분말을 기계적 분급ㅂ법을 이용하여 분급하였고, 압출에 이용된 분말은 250$\mu\textrm{m}$이하의 크기를 사용하였다. 또한 분말제조과정 중 형성되는 표면산화층을 제거하기 위하여 36$0^{\circ}C$에서 4시간동안 수소 환원처리를 행하였다. 제조된 분말은 열간 압출을 위하여 Aㅣcan에 넣고 냉간성형체를 만들고, 진공처리를 한 후 밀봉하여 탈가스처리를 하였다. 압출다이는 압출비가 각각 28:1과 16:1인 평다이(9$0^{\circ}C$)를 사용하여 각각 내경이 9, 12cm이고, 길이가 50, 30cm인 압출재를 제조하였다. 열간압출한 후의 미세조직을 광학현미경으로 압출방향에 평행한 방향과 수직방향으로 관찰하였고, 열간 압출재 이방성을 검토하기 위하여 X선 회절분석을 실실하여 결정방위를 확인하였다. 전기 비저항 및 Seebeck 계수 측정을 위하여 각각 2$\times$2$\times$10$mm^3$ 그리고 5$\times$5$\times$10$mm^3$ 크기의 시편을 준비하였다.준비하였다.

• Journal of Conservation Science
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• v.19
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• pp.67-72
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• 2006

The chemical compositions and lead isotope ratio of Poong-Tag(wind bell) bell excavated from Wanggyeong site, Gyeongju have analyzed by ICP and TIMS. The analysis result of chemical composition of Poong-Tag shows that it consists of 92:4 ratio of Cu:Sn. Other 8 minor elements(Pb, Zn, Fe, Ag, Ni, As, Sb and Co) show the concentration of below 0.2% respectively. This result means that Poong-Tag have made using highly purified Cu and Sn ore. For the study of provenance of raw material with the lead isotope ratio, the origin of the raw material of Poong-Tag can not be presumed owing to beyond the scope. The observation result of microstructure of Poong-Tag show the dendrite structure made through casting process. The chemical composition, microstructure, and lead isotope ratio of Poong-Tag excavated from Wanggyeong site, Gyeongju can be used as fundamental data to compare with other Poong-Tag of different regions and periods.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.2
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• pp.535-541
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• 2020

FCAW is used mainly in the welding of carbon steel and alloy steel because it can be welded in all positions and can obtain excellent quality at sites with variable working conditions. Recently, many studies in Korea have estimated the fatigue strength, residual stress, and deformation, and to develop a fillet welding process. On the other hand, there have been few studies of the mechanical properties based on the strength, macro and magnetic particle test results for fillet welding. This study shows the following results through fillet welding, macro testing and strength testing using SM490A (solid-structure rolled steel) for thick plates using SS400 (rolled steel) for the upper plate and FCAW. The hardness test, macro test and magnetic particle test were then conducted. The hardness tests showed that all result values were smaller than the KS B 0893 standard values of 350Hv. The macro-test showed that each type of welded part was in a normal organic state and that there were no internal errors, bubbles, or impurities on the front of the welded part. Therefore, there were no concerns about lamination. The magnetic particle examination showed no problems.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.7
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• pp.270-276
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• 2020

3D printing is an additive manufacturing technology that can produce complex shapes in a single process for a range of materials, such as polymers, ceramics, and metals. Recent 3D printing technology has developed to a level that enables the mass-production through an improvement of the printing speed and the continuous development of applicable materials. In this study, 3D printing technology using a laser was applied to manufacture a heat exchanger for an air compressor in a railway vehicle. First, the optimal design of the heat exchanger was carried out by focusing on weight reduction and compactness as a shape suitable for 3D printing. Based on the design derived, heat exchanger prototypes were made of AlSi10Mg alloy material by applying the SLM technique. Moreover, the manufactured prototypes were attached to an existing air compressor, and the heat exchange performance of the compressed air was tested. The test results of the 3D printed prototypes showed a heat exchange performance of approximately 80% and 85% at low and high-pressure, respectively, compared to the existing heat exchanger. From the 𝓔-NTU method results with an external cooling air condition similar to that of the existing heat exchanger, the calculated heat transfer amount of 3D printed parts showed similar performance compared to the existing heat exchanger. As a result, the 3D printed heat exchanger is lightweight with good performance.