• Title/Summary/Keyword: $TCr_2O_4$

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Investigation of Electronic Structures of TCr2O4 (T = Fe, Co, Ni) Spinel Oxides by Employing Soft X ray Synchrotron Radiation Spectroscopy (연 X선 방사광 분광법을 이용한 TCr2O4(T = Fe, Co, Ni) 스피넬 산화물의 전자구조 연구)

  • Kim, Hyun Woo;Hwang, Jihoon;Kim, D.H.;Lee, Eunsook;Kang, J.S.
    • Journal of the Korean Magnetics Society
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    • v.23 no.5
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    • pp.149-153
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    • 2013
  • The electronic structures of $TCr_2O_4$ (T = Fe, Co, Ni) spinel oxides have been investigated by employing synchrotron radiation-based soft X ray absorption spectroscopy (XAS). The measured 2p XAS spectra of transition-metal ions reveal that Cr ions are trivalent ($Cr^{3+}$), and all the T (T = Fe, Co, Ni) ions are divalent ($Fe^{2+}$, $Co^{2+}$, $Ni^{2+}$). It is also found that most of T (T = Fe, Co, Ni) ions occupy the A sites under the tetrahedral symmetry, while Cr ions occupy mainly the B sites under the octahedral symmetry. These findings show that the structures of $TCr_2O_4$ (T = Fe, Co, Ni) are very close to the normal spinel structures. Based on these findings, it is expected that Jahn-Teller (JT) effects are important in $FeCr_2O_4$ and $NiCr_2O_4$. In contrast, $CoCr_2O_4$ maintains the cubic structure without having the JT distortion since both $Cr^{3+}$ and $Co^{2+}$ ions are non-JT ions. This work suggests that the antiferromagnetic interaction between $Cr^{3+}$ and $T^{2+}$ ions plays an important role in determining the magnetic properties of $TCr_2O_4$ (T = Fe, Co, Ni).

Optoelectronic properties of the Metal-dielectric complex thin films for applying high sensitivity IR image sensors (고감도 적외선 이미지 센서 적용을 위한 금속-유전체 복합 박막의 광전자 특성)

  • Kim, Ye-Na;Kwon, Soon-Woo;Park, Seung-Jun;Kim, Woo-Kyug;Lee, Han-Young;Yoon, Dae-Ho;Yang, Woo-Seok
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.21 no.2
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    • pp.60-64
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    • 2011
  • High sensitivity IR image sensors require materials characteristics with temperature coefficient of resistance (TCR) and IR range absorption. In this study, the metal-dielectric thermo sensitive films (MDTF) based on $(SiO_2)_x-(Ti)_y$ composition were deposited on substrates of germanium and glass by thermal evaporator. The $SiO_2$ : Ti mixture was made from the ratio of 9 : 1, 8 : 2, 7 : 3, 6 : 4, respectively. $(SiO_2)_x-(Ti)_y$ mixture powder was loaded on tungsten boat in evaporator and was 15.5 cm from the substrate. Resistance of $(SiO_2)_x-(Ti)_y$ in the range of 273~333K were measured as a function of temperature. Temperature coefficient of resistance (TCR) was calculated by the resistance variation. Under the various mixture ratios condition, it is possible to obtain $SiO_2$-Ti layers with resistance from units kilo-ohm to hundreds kilo-ohm. Finally, our results showed that Temperature coefficient of resistance (TCR) of these films varies from -1.4 to $-2.6%K^{-1}$.

A study on the manufacturing of super precision multilayer cermet thin film resistor (초정밀 다층 Cermet 박막저항체 제조에 관한 연구)

  • 허명수;최승우;천희곤;권식철;이건환;조동율
    • Journal of the Korean Vacuum Society
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    • v.6 no.1
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    • pp.77-84
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    • 1997
  • Super precision resistor was manufactured by controlling properly the thickness of $TaN_{0.1}$ (negative TCR) and Cr(positive TCR) deposited on cylindrical alumina substrate (diameter: 4 mm, length: 11 mm). Multilayer thin film resistor of $Ta_2O_5/TaN_{0.1}$/Cr/Alumina (substrate) was manufactured by depositing of $Ta_2N_5$ film on $TaN_{0.1}$ film to increase Rs to the level of 1;k{\Omega}/{\box}$ and to passivate the film. Super precision resistor with TCR of $20\pm5 ppm/^{\circ}C$ and Rs of $1\;k{\Omega}/{\box}$ was manufactured by depositing thin layers of about 10 nm $Ta_2O_5$, 100 nm $TaN_{0.1}$ and 50 nm Cr film under the properly controlled sputtering condition.

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The Effect of the Processing Conditions on the Electrical Resistivity of Tantalum Nitride Thin Film Coated by the Reactive Sputtering (Sputtering법으로 제조된 TaNx 박막의 제조조건에 따른 전기저항 변화)

  • Choe, Yong-Rak;Kim, Seon-Hwa
    • Korean Journal of Materials Research
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    • v.7 no.12
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    • pp.1052-1057
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    • 1997
  • 현재 전기, 전자, 우주, 자동차, 무기 등의 여러 분야에서 응용되고 있는 TaNx 다층박막저항체의 특성을 개선하기 위하여 magnetron sputtering법으로 TaNx박막을 제조한 후, 온도와 질소분압에 따른 전기저항 및 TCR특성 변화를 조사하였고, 미세조직이 이들 전기적 성질에 미치는 영향을알아보기 위해 상분석과 morphology를 관찰하였다. 그 결과, TaNx을 코팅한 박막의 전기저항은 $N_{2}$Ar이 0.4 이상에서, 금속전도특성에서 이온전도특성으로 변화하였으며,Cr이 TCR효과를 안정시키는 역할은 하여 TaNx/A $I_{2}$ $O_{3}$보다 TaNx/Cr/A $i_{2}$ $O_{3}$박막의 TCR특성이 더 안정하게 나타났다. 또한 TaNx/A $I_{2}$ $O_{3}$박막과 TaNx/Cr/A $i_{2}$ $O_{3}$박막의 경우 모두 $N_{2}$/Ar이 0-0.4정도에서 TCR효과에 좋은 특성을 나타내었다. X-선회절 실험 결과 $N_{2}$/Ar비가 1일 경우에 T $a_{2}$ $N_{.8}$이 생성되었고, 분압이 증가함에 따라 비정질이 생성되었다. morphology가 $N_{2}$/Ar이 증가함에 따라 입자의 모양이 불연속아일랜드 형태로 변화하였으며, 이것은 질소분압에 따른 전기저항 변화와 일치하였다.다.

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Fabrication and Characterization of Ni-Cr Alloy Thin Films for Application to Precision Thin Film Resistors

  • Lee, Boong-Joo;Shin, Paik-Kyun
    • Journal of Electrical Engineering and Technology
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    • v.2 no.4
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    • pp.525-531
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    • 2007
  • Ni(75 wt.%)-Cr(20 wt.%)-Al(3 wt.%)-Mn(4 wt.%)-Si(1 wt.%) alloy thin films were prepared using the DC magnetron sputtering process by varying the sputtering conditions such as power, pressure, substrate temperature, and post-deposition annealing temperature in order to fabricate a precision thin film resistor. For all the thin film resistors, sheet resistance, temperature coefficient of resistance (TCR), and crystallinity were analyzed and the effects of sputtering conditions on their properties were also investigated. The oxygen content and TCR of Ni-Cr-Al-Mn-Si resistors were decreased by increasing the sputtering pressure. Their sheet resistance, TCR, and crystallinity were enhanced by elevating the substrate temperature. In addition, the annealing of the resistor thin films in air at a temperature higher than $300^{\circ}C$ lead to a remarkable rise in their sheet resistance and TCR. This may be attributed to the improved formation of NiO layer on the surface of the resistor thin film at an elevated temperature.

적외선 센서용 VOx/ZnO/VOx 박막 증착 및 특성 연구

  • Han, Myeong-Su;Mun, Su-Bin;Han, Seok-Man;Sin, Jae-Cheol;Kim, Hyo-Jin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.236-236
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    • 2013
  • 비냉각 적외선 검출기는 산업용 군사용으로 최근 각광을 받고 있다. 이는 주야간 빛이 없는 곳에서도 사물의 열을 감지할 수 있어 인체감지 및 보안감시, 에너지 절감 등에 응용될 수 있는 핵심부품이다. 비냉각 적외선 검출기로는 재료의 저항의 변화를 감지하는 마이크로볼로미터형이 가장 많이 사용된다. 감지재료로는 비정질 실리콘(a-Si)과 산화바나듐(VOx)이 가장 많이 사용된다. VOx 박막은 일반적으로 RF sputtering 방법으로 증착이 되며, 저항이 낮고, 저항의 온도변화 계수(TCR)가 크며 신호 대 잡음 특성이 우수한 반면 산소(oxygen) phase가 다양하여 갓 증착된 상태의 박막은 재현성이 떨어지는 단점이 있다. 본 연구에서는 기존의 V 타겟을 사용한 VOx 박막을 증착하는 방법을 개선하여 ZnO 나노박막을 중간에 삽입하여 저항 특성을 조절할 뿐만 아니라 열처리에 의해 TCR 값을 향상시키고, VO2 phase 가 주로 나타나는 박막 증착 및 공정 방법을 소개한다. RF sputtering 장비를 이용하여 산소와 아르곤 가스의 혼합비를 4.5로 하였으며, VOx 증착 시 플라즈마 Power는 150 W 로 하여 상온에서 증착하였다. 갓 증착된 VOx 다층박막의 XRD 스펙트럼은 V2O5 피크가 주된 상을 이루고 있었으며, 산소열처리에 의해 VO2 상이 주로 나타남을 알 수 있었다. TCR 값은 갓 증착된 샘플에서 -0.13%/K의 값을 얻었으며, $300^{\circ}C$에서 50분간 열처리 후 -3.37%/K 으로 급격히 향상됨을 알 수 있었다. 저항은 열처리 후 약 100 kohm으로 낮아져 검출소자를 위한 조건에 적합한 특성을 얻을 수 있었다. 또한 산소열처리의 온도 및 시간에 따라 TCR 및 표면 거칠기 특성을 조사하였으며, 최적의 열처리 조건을 얻고자 하였다.

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Thick Film Resistance Paste for Improving Reliability and TCR Properties of Embedded Resistor Board (내장형 저항 기판의 신뢰성과 TCR 개선을 위한 후막 저항 페이스트에 관한 연구)

  • Lee, S.M.;Yoo, M.J.;Park, S.D.;Kang, N.K.;Nam, S.
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.27-31
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    • 2008
  • Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

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Effect of Dopants on Electrical Properties of $SnO_2$Thin Film Resistors ($SnO_2$박막저항의 전기적 특성에 미치는 첨가제의 영향)

  • 구본급;강병돈
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.8
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    • pp.658-666
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    • 2000
  • Sb and Sb-Fe doped SnO$_2$film resistors were prepared by spray pyrolysis technique. The effects of Sb and Sb-Fe addition on TCR and electrical properties of SnO$_2$film resistors were studied. Also the dependence of electrical properties on the substrate temperature and substrate-nozzle distance was investigated. The Sn-Sb system with 7.9 mol% SbCl$_3$(STO-406) and Sn-Sb-Fe systems with 7.3 mol% SbCl$_3$+7.3 mol% FeCl$_3$(STO-407) and with 3.4 mol% SbCl$_3$+7.7mol% FeCl$_3$(STO-408) were prepared. Both of the systems Sn-Sb and Sn-Sb-Fe represented nonlinearity of TCR with temperature. As the amount of Fe increased TCR was shifted to positive direction. Decreasing Sb or increasing Fe caused resistivity to increase. Also increasing Fe caused the crystallization degree of rutile structure in SnO$_2$film to decrease. The electrical resistivity decreased with increasing substrate temperature The resistivity decreased with increasing substrate-nozzle distance in the ranges from 15 to 25 cm and increased rapidly at the distance over 25cm.

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Effects of Physical Properties of Glass on the TCR of $RuO_2$ Thick Film Resistors for Hybrid Integrated Circuits (HIC) (HIC용 $RuO_2$ 후막저항체에서 유리의 물리적 성질이 TCR에 미치는 영향)

  • Lee, B.S.;Lee, J.
    • Journal of the Korean Ceramic Society
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    • v.30 no.11
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    • pp.974-978
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    • 1993
  • Glass viscosity effects on the electrical properties and microstructure of RuO2 based thick film resistors (TFR) using alumina modified lead borosilicate glasses were studied. AT 85$0^{\circ}C$, the glass viscosities were increased from 4.24Pa.s to 51.5Pa.s when the alumina was added from none to 14 weight percent to the standard glass of 63% PbO, 25% B2O3 and 12% SiO2. The resistivities of resistors were generally decreased and the microstructure development was retarded as the viscosity of the glass increased. This is contrary to the generally accepted thought that the low resistivity is due to fast microstructure development kinetics in TFR. Even though the glass viscosity retards the microstructure development kinetics, the overall network formations are favored for higher viscosity of glass, such that the sheet resistivities were decreased as the glass viscosity increased.

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Structural and electrical properties of the NiCr thin film resistors deposited at various temperatures on $SiO_2$/Si substrate

  • Phuong, Nguyen Mai;Cuong, Nguyen Duy;Kim, Dong-Jin;Kang, Byoung-Don;Kim, Chang-Soo;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.337-338
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    • 2006
  • The 200 nm thick-NiCr films grew on $SiO_2$/Si substrates at various deposition temperatures by a dc magnetron co-sputtering technique were characterized for the variation of film texture. The resistivity of the films decreases with increasing deposition temperature and temperature coefficient of electrical resistance (TCR) varies from negative value to a positive one with increasing deposition temperature. The NiCr films deposited at $300^{\circ}C$ exhibit 4 ppm/K being near zero TCR, resulting in TCR suitable for $\pi$-type attenuator applications.

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