• Journal of the Microelectronics and Packaging Society
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• 제23권4호
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• pp.125-133
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• 2016

With the aim of using a filler material in a conductive paste, fine Cu nanoparticles were synthesized through the high-speed chemical reaction between cuprous oxide ($Cu_2O$) powder and sulfuric acid in distilled water. Under external temperature of $7^{\circ}C$, sulfuric acid concentration of 48%, and $Cu_2O$ amount of 30 g, the $Cu_2O$ particles were eliminated and slightly aggregated Cu nanoparticles were synthesized. Futhermore, Cu nanoparticles of 224 nm, in which the aggregation between particles was obviousiy much suppressed, were synthesized with the choice of an additive. In the particle sample, occasionally there are coarse particles formed by the aggregation of fine nanoparticles and weak linkages between the nanoparticles. However, the coarse particles were destroyed and the linkages were broken after mixing with a resin formulation, indicating the behavior of untangling the aggregation between nanoparticles.

• Journal of Korean Society on Water Environment
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• 제21권1호
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• pp.66-72
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• 2005

Effect of the pH, molar ratio of Cu(II)/EDTA, concentration of Cu(II)-EDTA and ionic strength on the photocatalytic oxidation(PCO) of Cu(II)-EDTA in solar light was studied in this work. Experimental results in this work were compared with previous results obtained with UV-lamp. In the kinetics, Cu(II)-EDTA decomposition was favorable below neutral pH. The removal of Cu(II) and DOC was favorable as $TiO_2$ dosage increased. The initial rate for the decomplexation of Cu(II)-EDTA linearly increased as the concentration of Cu(II)-EDTA increased. The removal of Cu(II) and DOC was not much affected by variation of ionic strength with $NaClO_4$ as a background ion while much reduction was observed in the presence of background ions having higher formal charges. The removal trend of Cu(II) and DOC with variation of ionic strength and concentration of Cu(II)-EDTA in solar light was similar with that in UV light. Variation of the molar ratio of Cu(II)/EDTA showed a negligible effect on the removal of both Cu(II) and DOC. However, removal of both Cu(II) and DOC was two-times greater than that previous results obtained with UV light.

• Korean Journal of Materials Research
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• 제23권6호
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• pp.304-308
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• 2013

The effect of a sputter deposition sequence of Cu, Zn, and Sn metal layers on the properties of $Cu_2ZnSnS_4$ (CZTS) was systematically studied for solar cell applications. The set of Cu/Sn/Zn/Cu multi metal films was deposited on a Mo/$SiO_2$/Si wafer using dc sputtering. CZTS films were prepared through a sulfurization process of the Cu/Sn/Zn/Cu metal layers at $500^{\circ}C$ in a $H_2S$ gas environment. $H_2S$ (0.1%) gas of 200 standard cubic centimeters per minute was supplied in the cold-wall sulfurization reactor. The metal film prepared by one-cycle deposition of Cu(360 nm)/Sn(400 nm)/Zn(400 nm)/Cu(440 nm) had a relatively rough surface due to a well-developed columnar structure growth. A dense and smooth metal surface was achieved for two- or three-cycle deposition of Cu/Sn/Zn/Cu, in which each metal layer thickness was decreased to 200 nm. Moreover, the three-cycle deposition sample showed the best CZTS kesterite structures after 5 hr sulfurization treatment. The two- and three-cycle Cu/Sn/Zn/Cu samples showed high-efficient photoluminescence (PL) spectra after a 3 hr sulfurization treatment, wheres the one-cycle sample yielded poor PL efficiency. The PL spectra of the three-cycle sample showed a broad peak in the range of 700-1000 nm, peaked at 870 nm (1.425 eV). This result is in good agreement with the reported bandgap energy of CZTS.

• Progress in Superconductivity
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• 제7권2호
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• pp.145-151
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• 2006

Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.

• Journal of Powder Materials
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• 제24권5호
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• pp.406-413
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• 2017

A Nanosized $WO_3$ and CuO powder mixture is prepared using novel high-energy ball milling in a bead mill to obtain a W-Cu nanocomposite powder, and the effect of milling time on the structural characteristics of $WO_3-CuO$ powder mixtures is investigated. The results show that the ball-milled $WO_3-CuO$ powder mixture reaches at steady state after 10 h milling, characterized by the uniform and narrow particle size distribution with primary crystalline sizes below 50 nm, a specific surface area of $37m^2/g$, and powder mean particle size ($D_{50}$) of $0.57{\mu}m$. The $WO_3-CuO$ powder mixtures milled for 10 h are heat-treated at different temperatures in $H_2$ atmosphere to produce W-Cu powder. The XRD results shows that both the $WO_3$ and CuO phases can be reduced to W and Cu phases at temperatures over $700^{\circ}C$. The reduced W-Cu nanocomposite powder exhibits excellent sinterability, and the ultrafine W-Cu composite can be obtained by the Cu liquid phase sintering process.

• Applied Chemistry for Engineering
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• 제7권4호
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• pp.639-644
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• 1996

The $YBa_2Cu_{3-y}Ag_yO_{7-x}$ high-temperature superconductors were prepared by pyrophoric synthetic method from $Y_2O_3$, $BaCO_3$, CuO, and $AgNO_3$ powders. When we were partially substituted Ag for Cu in $YBa_3Cu_3O_{7-x}$, the superconducting properties of $YBa_2Cu_{3-y}Ag_yO_{7-x}$ were investigated with X-ray diffractometer, resisitivity measuring equipment, SEM, and Vickers Hardness. The Tc,zero of $YBa_2Cu_3O_{7-x}$ was 91K, the density was $5.2g/cm^3$, and the hardness was $590kg/mm^2$. When Ag was substituted below y=0.15, electrical property of $YBa_2Cu_{3-y}Ag_yO_{7-x}$ did not change but microstructure, density, and hardness were enhanced.

• Applied Chemistry for Engineering
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• 제31권5호
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• pp.475-480
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• 2020

Chelates synthesized with Cu(II) ion and lactic acid or chitosan were applied to the hydrolysis of organophosphate simulant, DFP (diisopropyl fluorophosphate). Under the homogeneous reaction condition, Cu(II)-lactic acid chelate hydrolyzed DFP with the half life time of 37.1 min. Cu(II)-LMWS chitosan chelate was synthesized with 1 kDa molecular weight of chitosan, which showed low solubility, and then crystallized. The half life time for hydrolyzing DFP using Cu(II)-LMWS chitosan was 32.9 h indicating that the reaction rate is enhanced as much as 16 times more than that of using 18 kDa chitosan-Cu(II) complex. Under the homogeneous reaction condition, the half life time of Cu(II)-LMWS chitosan was 8.75 h. Therefore, we found out that the solubility of Cu(II)-LMWS chitosan makes the difference in the reaction rate as much as 4 times.

• Journal of the Korean Magnetics Society
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• 제3권4호
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• pp.305-309
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• 1993

Thermal stability of Co/Cu artificial superlattice (AS) prepared by RF-magnetron sputtering and the effect of low temperature annealing on the magnetoresistance of the AS have been investigated in this work. Dependence of annealing behavior on the Cu spacer thickness, Fe underlayer thickness, and kind of the underlayer was examined and the relationship between the interfacial reaction and magnetoresistance was studied. It turned out that when Co/Cu AS was annealed at low temperature ($<450^{\circ}C$), the magnetoresistance could increase in the case of AS with thick spacer Cu ($20~25\AA$) layer, whereas it decreased in the case of AS with thin spacer Cu ($7\AA$) layer, which of the former is in contrast with previous reports and the latter in consistent with them. The increase of magnetoresistance is due to increase of interfacial atomic sharpness, which is supported by low angle X-ray diffraction analysis. The thermal stability of Co/Cu AS was better in the case of thick Fe underlayered AS. Interfacial reaction (separation of intermixed Co and Cu) could be observed at lower temperature for (200)-textured samples than for (111)-textured samples, which can be interpreted in terms of interdiffusion kinetics depending on the crystallographic orientation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.73-77
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• 2002

Characteristics of Cu/Si/Cu ohmic contacts to n-type 4H-SiC were investigated systematically. The ohmic contacts were formed by rf sputtering of multi layer Cu/Si/Cu sputtered sequentially. The annealings were peformed With 2-Step using RTP in vacuum ambient. The specific contact resistivity($\rho$c), sheet resistance(Rs), contact resistance(Rc), transfer length(L$_{T}$) were calculated from resistance(R$_{T}$) versus contact spacing(d) measurements obtained from TLM(transmission line method) structure. Best results were obtained for a sample annealed at vacuum as $\rho$c = 1.0x10$^{-6}$ $\Omega$$\textrm{cm}^2$, Rc = 2$\Omega$ and L$_{T}$ = 1${\mu}{\textrm}{m}$. The physical properties of contacts were examined using XRO and AES. The results showed that copper silicide was formed on SiC and Cu was migrated into SiC.o SiC.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.227-227
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• 2010

동력 전달을 위한 구동 부품에 대한 내마모성 개선을 통한 에너지 효율 및 부품의 수명 향상에 대한 사회적 관심이 급증하고 있다. 특히, 최근에는 자동차용 구동부품에 저마찰 내마모 특성이 우수한 Mo-N-Cu 나노복합체 박막에 대한 연구가 활발하게 진행되고 있다. 본 연구에서는 Mo-N-Cu 나노복합체 박막을 마그네트론 스퍼터링 증착법을 활용하였고, 이때 Mo 및 Cu 타겟을 적용하여 동시에 증착하였다. 진공 챔버의 진공도는 $5{\times}10^{-6}\;Torr$ 이하의 초기 진공도를 확보한 이후, 알곤 및 질소 가스를 주입하여 공정 압력이 5 mTorr 수준이 되도록 하였다. 이때 N2/(Ar+N2) = 0.5를 유지하였다. Mo-N-Cu 박막내에 Cu 함량 변화를 위해 Mo 캐소드는 D.C. 1 kW로 고정하고 Cu 캐소드에 R.F. 파워를 0, 40, 60, 80 W로 변화하였다. 박막의 두께는 증착시간을 변화하면서 $1\;{\mu}m$ 이상이 되도록 하였다. Cu 캐소드에 인가된 파워의 변화에 따라 Mo-N-Cu 박막내 Cu 함유량은 10 at.%까지 변화되는 것을 EDX 분석을 통해 확인하였다. 또한 증착된 Mo-N-Cu 박막의 표면 및 단면에 대한 FE-SEM 분석을 통하여 전형적인 주상구조를 지닌 MoN 박막에서 Cu 함량이 증가할수록 Mo-N-Cu 박막의 결정성을 방해하는 것을 확인하였다. 또한 XRD 분석을 통하여 박막의 결정 구조 분석을 하였고, Nano Indentor를 통하여 30 GPa 수준의 고경도를 지닌 박막이 형성됨을 확인하였다. 박막의 내마모 특성 평가를 위해 ball-on-disk 트라이보미터를 활용하여 마찰계수 평가를 수행하였고, Cu 함유량의 변화에 따라 마찰계수가 MoN 박막의 경우 0.8에서 Cu 함량이 5 at.%에서 0.15로 급격하게 낮아짐을 확인하였다.