• 한국전기전자재료학회논문지
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• 제15권8호
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• pp.736-741
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• 2002

Phase intergrowth some kinds of the $Bi_2Sr_2Ca_{n-1}Cu_nO_y$ phases is observed in the thin film fabrication at ultralow co-deposition with multi targets by means of ion beam sputtering. The molar fraction of the Bi2212 phase in the mixed crystal of the grown films is investigated as a function of the applied ozone pressure and the substrate temperature. The activation energy for the phase transformation from the Bi2201 to the Bi2212 is estimated in terms of the Avrami equation. This study reveals that the formation of a liquid phase contributes significantly to the construction of the Bi2212 phase in the thin films, differing from the bulk synthesis.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.189-192
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• 2000

High-temperature superconductor of Bi-2212 system was fabricated by CFP(centrifugal forming process). To make a uniform specimen slurry was prepared in the ratio of 7:3(powder:binder) and ball milled for 24 hours. Milled slurry was charged into a rotating mold with 450 rpm and dried at room temperature. Then the specimen was performed binder burn-out at 35$0^{\circ}C$ and heated for partial melting to 86$0^{\circ}C$. XRD analysis of most specimens were shown 2212 phase and observed a local plate shaped microstructure with a well aligned c-axis direction from SEM images. T$_{c}$(Critical temperature) of Bi-2212 was 64K.K.

• 한국초전도ㆍ저온공학회논문지
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• 제10권1호
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• pp.24-27
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• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2007년도 춘계종합학술대회
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• pp.524-527
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• 2007

이온 빔 스퍼터법을 이용하여 저속성장으로 동시 증착에 의해 $Bi_2Sr_2Ca_{n-1}Cu_nO_x$(n=0, 1, 2) 박막을 제작하였다. Bi 2212 상은 기판온도 $750\sim795^{\circ}C$의 범위에서 나타났으며, $750^{\circ}C$보다 저온 측에서는 Bi 2201의 단일강이 존재하였나. 그러나, 조성과 관계되는 $PO_3$에 대해서 크게 변하지 않았다. 그리고 임계온도(Tc)가 $45\sim90K$ 가지는 c축 배향한 고품질의 Bi 2212 박막을 얻었다. 소수의 박막에서는 소량의 CuO가 불순물로 관찰되었으며, 얻어진 모든 박막에서 $CaCuO_2$의 불순물 상은 관찰되지 않았다.

• 한국정보통신학회논문지
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• 제11권6호
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• pp.1115-1121
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• 2007

이온 빔 스퍼터법을 이용하여 저속성장으로 동시 증착에 의해 $Bi_2Sr_2Ca{_{n-1}}Cu_nO_x$(n=0,1,2) 박막을 제작하였다. Bi 2212 상은 기판온도 $750{\sim}795^{\circ}C$의 범위에서 나타났으며, $750^{\circ}C$보다 저온 측에서는 Bi 2201의 단일상이 존재하였다. 그러나, 조성과 관계되는 $PO_3$은 압력 변화에 대해서는 관찰되지 않았다. 그리고 $45{\sim}90K$의 임계온도(Tc)를 갖는 c축 배향한 고품질의 Bi 2212 박막을 얻었다. 소수의 박막에서는 소량의 CuO가 불순물로 관찰되었으며, 얻어진 모든 박막에서 $CaCuO_2$ 의 불순물 상은 관찰되지 않았다.

• 한국표면공학회지
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• 제39권2호
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• pp.57-63
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• 2006

In this study, In-base solder was applied to the interface between $Bi_2Sr_2Ca_1Cu_2O_x(Bi_{2212})$ superconductor and Cu-Ni shunt metal at the temperature lower than $150^{\circ}C$. Most of the cases, $Bi_{2212}$ superconductor was precoated with Ag by electroplating in order to improve the contact properties of the solder layer. When the superconductor was directly soldered on to the superconductor, the solder was easily separated without external force. The shear strength of the contact between superconductor and shunt metal increased from 69.2 kgf to 74.4 kgf and 80.1 kgf, as the current density of the Ag electroplating was changed from 63 mA to 96 mA and 126 mA, respectively. The contact strength also increased to 49.9 kgf and 69.2 kgf when thickness of the electroplated Ag layer increased to $5{\mu}m$ and $10{\mu}m$, reapectively.

• E2M - 전기 전자와 첨단 소재
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• 제10권5호
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• pp.425-433
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• 1997

BSCCO thin films have been fabricated by co-deposition at an ultralow growth rate using ion beam sputtering(IBS) method. The growth rates of the films was set in the region from 0.17 to 0.27 nm/min. MgO(100) was used as a substrate. In order to appreciate stable existing region of Bi 2212 phase with temperature and ozone pressure, the substrate temperature was varied between 655 and 82$0^{\circ}C$ and the highly condensed ozone gas pressure(PO$_3$) in vacuum chamber was varied between 2.0$\times$10$^{-6}$ and 2.3$\times$10$^{-5}$ Torr. Bi 2212 phase appeared in the temperature range of 750 and 795$^{\circ}C$ and single phase of Bi 2201 existed in the lower region than 785$^{\circ}C$. Whereas, PO$_3$dependance on structural formation was scarcely observed regardless of the pressure variation. And high quality of c-axis oriented Bi 2212 thin film with T$_{c}$(onset) of about 90 K and T$_{c}$(zero) of about 45 K is obtained. Only a small amount of CuO in some films was observed as impurity, and no impurity phase such as CaCuO$_2$was observed in all of the obtained films.lms.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.1071-1074
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• 2002

This paper presents Bi thin films have been fabricated by atomic layer-by-layer deposition and co-deposition at an IBS method. The growth rates of the films was set in the region from 0.17 to 0.27 nm/min. MgO(100) was used as a substrate. In order to appreciate stable existing region of Bi 2212 phase with temperature and ozone pressure, the substrate temperature was varied between 655 and $820^{\circ}C$ and the highly condensed ozone gas pressure$(PO_3)$ in vacuum chamber was varied between $2.0{\times}10^{-6}$ and $2.3{\times}10^{-5}Torr$. Bi 2212 phase appeared in the temperature range of 750 and $795^{\circ}C$: and single phase of Bi 2201 existed in the lower region than $785^{\circ}C$. Whereas, $PO_3$ dependance on structural formation was scarcely observed regardless of the pressure variation. And high quality of c-axis oriented Bi 2212 thin film with $T_c$(onset) of about 90 K and $T_c$(zero) of about 45 K is obtained. Only a small amount of CuO in some films was observed as impurity, and no impurity phase such as $CaCuO_2$ was observed in all of the obtained films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 제6회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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• pp.39-42
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• 2004

The $Bi_2Sr_2Ca_nCu_{n+1}O_x$ superconducting thin film fabricated by using the sputtering method was compared with the $Bi_2Sr_2Ca_nCu_{n+1}O_x$ superconducting thin film fabricated by using the evaporation method. In doing the ultra-low deposition because each element can exist on the substrate surface, both the sputtering method and the evaporation method could easily fabricate single phase of the Bi2212 phase. Also, it is cofirmed that by optimizing the deposition condition, each single phase of the Bi2201 phase and the Bi2212 phase can be fabricated, the sticking coefficient of Bi element is clearly related to the changing of substrate temperature and the formation of the Bi2212 phase.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2006년도 High Temperature Superconductivity Vol.XVI
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• pp.92-92
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• 2006