Thermal Dissipation Properties of the Single-chip LED Package Attached with Directly Heat Dissipated Heat Sinks (직접 열방출형 방열판 설계 및 방열 소재 교체에 따른 단일칩 LED 패키지의 방열 특성)
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- Proceedings of the Korean Society of Precision Engineering Conference
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- 2011.06a
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- pp.1163-1164
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- 2011