A linear ultrasonic motor was designed by a combination of the first longitudinal and fourth bending mode, and the motor consisted of a straight aluminum alloys bar bonded with a piezoelectric ceramic element as a driving element. That is,$L_1-B_4$ linear ultrasonic motor can be constructed by a multi-mode vibrator of longitudinal and bending modes. Linear ultrasonic motors are based on an elliptical motion on the surface elastic body, such as bar or plates. In general, the natural resonance frequency of the stator is used as a driving frequency of the motor which provides a large elliptical motion. The corresponding eigenmode of one resonance frequency can be excited twice at the same time with a Phase shift of 90 degrees in space and time. And the rotation can be reversed by changing the phase between the two signals from sin$\omega$t to cos$\omega$t. Moreover, the tangential force pushes the slider(rotor) and, therefore, determines the thrust and speed of the motor. The experimental results of fabrication motors, bimorph-tyPe motor showed more excellent than unimorph-type. The maximum speed of TBL-200, TBL-300, TBL-400, TBL -220, TBL-310 and TBL-420 motors were 0.12, 0.37, 0.39, 0.14, 0.55 and $0.60ms6{-1}$, respectively. And the efficiency were reported 1.15, 7.9, 6.6, 2.36, 10.1 and 16.5%, respectively. That time, output thrust of the motor was a strong(1~2N) and the weight of stator was a lightness(5~7g).

ZnSe, ZnSe:Ho/sup 3+/, Mg/sub x/Zn/sub 1-x/Se and Mg/sub x/Zn/sub 1-x/Se:Ho/sup 3+/ crystals were grown by the chemical transport reaction method. The crystal structures and optical energy band gaps of the single crystals were investigated. Their photoluminescence(PL) spectra were measured at 10 [K]. Sharp emission peaks in the blue-green wavelength range and broad emission peaks in the yellow-red wavelength range were observed. The single crystals doped with 1.0 [mol%] of holmium did not show the sharp emission peaks because of defects which were thought to be originated to the holmium dopant.

In the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control, within-wafer-non-uniformity, and the possible defects such as pad oxide damage and nitride residue. The defect like nitride residue and silicon (or pad oxide) damage after STI-CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI fill and STI-CMP were discussed. Consequently, we could conclude that law trench depth and high CMP thickness can cause nitride residue, and high trench depth and over-polishing can cause silicon damage.

In this paper, a novel ultraviolet sensor is presented based on a photoluminescent porous silicon. Porous silicon layer was formed by chemical etching of surface of pn junction in a $HF(48%)-HNO_3(60%)-H_20$ solution. Incident ultraviolet(UV) light is converted to visible light by photoluminescent porous silicon layer, and then this visible light generates electron-hole pairs in the pn junction, which produces a photocurrent flow through the device. In order to maximize detection efficiency, the peak sensitivity wavelength of the pn junction diode was matched with the peak wavelength of Photoluminescence from porous silicon layer. The porous silicon ultraviolet sensor showed a large output current as UV intensity increases and but very low sensitivity to visible light. The detection sensitivity of porous silicon sensor was calculated as 2.91mA/mW. These results are expected to open up a possibility that the present porous silicon sensor can be used for detecting UV light in a visible background, compared to silicon UV detectors which have an undesirable response to visible light.

We proposed a new sensitivity verification method for the UHF partial discharge(PD) detection system. Initially, we measure the UHF power induced by 5 pC PD which takes place near UHF sensor. Subsequently, we inject the swept UHF signal from a network analyzer into the GIS and measure the attenuation of the signal along the 71S Both the UHF power by 5 pC PD and the attenuation make it possible to verify the sensitivity and spatial coverage of the PD detection system. This method doesn\`t require the calibration of injected pulse type UHF signal into the GIS and makes us precisely measure the attenuation in frequency domain.

In this paper, breakdown voltages in $SF_6-N_2$ mixtures were experimentally investigated to understand characteristics of dielectric strength and physical phenomena in nonuniform field disturbed by a needle shape protrusion. The test voltages are the lightning impulse$(\pm1.2/44 \mus)$ and the damped oscillatory impulse$(\pm400 ns / 0.83 MHz)$ voltages which can be occurred by the operation of disconnecting switches in gas-insulated switchgears(GIS). The effects of the polarity and wave shape of the test voltages, and the gas pressure on the V-t characteristics were in detail examined. The V-t characteristic curves were measured in different two ways : (1) one is the method by taking the maximum voltage recorded at or prior to breakdown against the time to breakdown, that is, the Procedures recommended in IEC 60060-1, (2) the other is the method by taking the voltage at the instant of chopping against the time to breakdown. As a result, the V-t characteristics of $SF_6-N_2$ mixtures in nonuniform electric field were significantly affected by the polarity and wave shape of the applied voltages. The positive breakdown voltages resulted in lower breakdown voltages in the time ranges considered, and the V-t curves for the negative oscillatory impulse voltage were extended over the longer time range. For the lightning impulse voltages, the V-t curves obtained by IEC Pub. 60060-1 were nearly same with the V-t curves obtained by the voltage at the instant of chopping against the time to breakdown. It is clear that the actual breakdown voltages were much lower than the maximum voltages appearing at or prior to breakdown because of the displacement current produced as a result of the dV/dt during the oscillatory transient voltage app1ication. The scattering of the negative actual breakdown voltages was much larger than that of the positive.

We have developed a sub-micron gap fabrication technology using chemical-mechanical polishing (CMP) without /the sub-micron lithography equipments (0.18∼0.25 7m). And it has been applied to a lateral field emission device (FED), in which narrow gap distance is very important for reducing turn-on voltage. As a result, the turn-on voltage (at which the current level is 1 nA) of the fabricated device with the gap distance of 256 nm is as low as 4.0 V, which is the lowest turn-on voltage among lateral FEDs ever reported.

ln this paper, a micromachined micromechanical switch is presented. The presented switch is operated in the vertical direction to the substrate by an electrostatic force between two parallel plates. The moving plate is pulled down to connect the bumps of the bias node$(V_{DD}/ or GND)$ to the bumps of the output node when a oltage difference exists between the moving plate and the input plate. The switch was designed to operate at a low switching voltage$(\risingdotseq5V)$ by including a large-area, narrow-gap, parallel plate capacitor A theoretical analysis of the designed switch was performed in order to determine its geometry fitting the desired pull-in voltage and release voltage. The designed switch was fabricated by surface micromachining combined with Ni electroplating. From the experimental results of the fabricated switch, its pull-in voltage came Out to be less than 5V and the measured maximum allowable current was 150mA. The measured average ON-state resistance was about 8$\Omega$, and the OFF-state resistance was too high to be measured with digital multimeter.