Acknowledgement
본 논문은 2021년도 정부(방위사업청)의 재원으로 국방기술진흥연구소의 지원을 받아 수행된 연구임(KRIT-CT-21-029).
References
- J.H. Park and J.H. Lee, "Fan Unit Design Technology for Electronic Equipment Cooling," Journal of the KSME, vol. 36, no. 4, pp. 324-337, 1996.
- H.J. Yang, Y.R. Lee, S.M. Cho, K.D. Yu and J.P. Kim, "The Design Method of TR Module Based GaN for Satellite," Journal of The Korean Society for Aeronautical and Space Sciences, vol. 50, no. 1, pp 31-38, 2022. https://doi.org/10.5139/JKSAS.2022.50.1.31
- ECSS-Q-ST-30-11, Derating - EEE components, ESA Requirements and Standards Division
- T.W. Kang, Y.J. Song, M.J. Lee, Y.H. Ham, Y.W. Seong, T.C. Cho, K.M. Back, S.H. Park, H.W. Suh, Y.S. Nam and J.H. Kim, "A Study of the Development of Defense Space Standardization and Qualification System," Journal of The Korean Society for Aeronautical and Space Sciences, vol. 2023, no. 4, pp 776-777, 2023.
- J. H. Park, H.S. Kim, H.S. Ko, B.C. Jin and H.K. Seo, "Experimental Verification of Heat Sink for FPGAThermal Control," Journal of The Korean Society for Aeronautical and Space Sciences, vol. 42, no. 9, pp. 789-794, 2014. https://doi.org/10.5139/JKSAS.2014.42.9.789
- B.G. Chae, Y.K. Lee, S.J. Kang, S. Y, Jang and H.U. Oh "Evaluation of Thermal Stability of Electro-Optical Camera Controller Box for Compact Advanced Satellite," Journal of Advanced Engineering and Technology, vol. 10, no. 2, pp. 185-190, 2017. https://doi.org/10.35272/JAET.2017.10.2.185
- MIL-STD-883, Test method standard for microcircuits (Revision H), United States Department of Defense, USA
- P. S. Speicher, "VLSI Package Reliability," Microelectronics International, vol. 8, no. 3, pp. 11-17, Sept 1991. https://doi.org/10.1108/eb044454