Acknowledgement
본 연구는 2021년도 산업통상자원부 기계·장비산업기술개발사업 "냉각용량 2 kW급 반도체 식각 공정(Etching Process)용 초저온 냉각 시스템 개발"의 연구비 지원에 의한 연구임 (No. 20014817)
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