Experimental Investigation of 2kW Class Non-flammable Mixed Refrigerant Joule-Thomson Refrigerator with Cooling Temperature of -100 ℃ for Cryogenic Etching

초저온 식각을 위한 냉각용량 2kW 급 -100 ℃ 비가연성 혼합냉매 줄톰슨 냉각기의 실험적 고찰

  • Jongmin Eun (Department of Mechanical Engineering, Konkuk University) ;
  • Cheonkyu Lee (Industrial Energy R&D department, Research Institute of Sustainable Development Technology, Korea Institute of Industrial Technology (KITECH))
  • 은종민 (건국대학교 기계공학부) ;
  • 이천규 (한국생산기술연구원 지속가능기술연구소 산업에너지연구부문)
  • Received : 2024.04.12
  • Accepted : 2024.06.21
  • Published : 2024.06.30

Abstract

This paper presents the design and experimental analysis of a cryogenic refrigeration system for -100 ℃, primarily intended for semiconductor etching process. The refrigeration system utilizes non-flammable mixed refrigerant Joule-Thomson refrigeration cycle, incorporating a precooling stage to enhance overall performance. The selected refrigerants for the system include R1234yf for the precooling stage, and Ar, R14, R23 and R218 for the main cooling stage of the Joule-Thomson refrigeration cycle. Design results according to the system constraints and experimental results are discussed, including lowest evaporation temperature, compressor isentropic efficiency and overall pressure tendencies. The achieved refrigerant fraction from optimal design is Ar: R14: R23: R218 = 0.15: 0.4: 0.15: 0.3, indicating COP of 0.1118 at the isentropic compressor efficiency of 50%. The experimental result shows the developed system reaches steady state in approximately 3 hours.

Keywords

Acknowledgement

본 연구는 2021년도 산업통상자원부 기계·장비산업기술개발사업 "냉각용량 2 kW급 반도체 식각 공정(Etching Process)용 초저온 냉각 시스템 개발"의 연구비 지원에 의한 연구임 (No. 20014817)

References

  1. Nojiri, K., Dry Etching Technology for Semiconductors. 2015.
  2. Lee, M., The Changes and Implications of Semiconductor Technology Paradigms. 2023.
  3. Mita, Y., et al. Aspect Ratio Dependent Scalloping Attenuation in Drie and an Application to Low-Loss Fiber-Optical Switches. in 19th IEEE International Conference on Micro Electro Mechanical Systems. 2006.
  4. Fu, J., et al., Improving sidewall roughness by combined RIE-Bosch process. Materials Science in Semiconductor Processing, 2018. 83: p. 186-191. https://doi.org/10.1016/j.mssp.2018.04.033
  5. Chang, B., et al., DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process. Microelectronic Engineering, 2018. 191: p. 77-83. https://doi.org/10.1016/j.mee.2018.01.034
  6. Mellhaoui, X., et al., SiOxFy passivation layer in silicon cryoetching. Journal of Applied Physics, 2005. 98(10): p. 104901.
  7. Antoun, G., et al., The role of physisorption in the cryogenic etching process of silicon. Japanese Journal of Applied Physics, 2019. 58(SE): p. SEEB03.
  8. Parasuraman, J., et al., Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio. Microelectronic Engineering, 2014. 113: p. 35-39. https://doi.org/10.1016/j.mee.2013.06.010
  9. Leroy, F., et al., Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas. Journal of Physics D: Applied Physics, 2015. 48(43): p. 435202.
  10. Chanson, R., et al., Low-k integration: Gas screening for cryogenic etching and plasma damage mitigation. Frontiers of Chemical Science and Engineering, 2019. 13: p. 511-516. https://doi.org/10.1007/s11705-019-1820-5
  11. Dussart, R., et al., Plasma cryogenic etching of silicon: from the early days to today's advanced technologies. Journal of Physics D: Applied Physics, 2014. 47(12): p. 123001.
  12. E.W. Lemmon, B., I.H., Huber, M.L., McLinden. 2018: National Institute of Standards and Technology, Standard Reference Data Program, Gaithersburg, .
  13. Lee, C., J.M. Kim, and J.-G. Lee, Design of Non-flammable Mixed Refrigerant Joule-Thomson Refrigerator for Semiconductor Etching Process. Journal of the Semiconductor & Display Technology, 2022. 21(2): p. 144-149.
  14. Lee, C., et al., Visualization of the solid-liquid equilibria for non-flammable mixed refrigerants. Cryogenics, 2016. 75: p. 26-34. https://doi.org/10.1016/j.cryogenics.2016.01.003
  15. T., P., B. J., and J. S. Design of non-flammable mixed-refrigerants Joule-Thomson refrigerator below -100℃. in 14th IEA Heat Pump Conference 2023. 2023.
  16. Venkatarathnam, G. and K.D. Timmerhaus, Cryogenic mixed refrigerant processes. Vol. 100. 2008: Springer.
  17. Lee, C. and J.-G. Lee, Measurement of Condensation and Boiling Heat Transfer Coefficients of Non-flammable Mixed Refrigerant for Design of Cryogenic Cooling System for Semiconductor Etching Process. Journal of the Semiconductor & Display Technology, 2023. 22(3).