Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Study on Chucking Force and Substrate Deformation Characteristics of Electrostatic Chuck for Deposition According to Substrate Sizes

증착용 정전척의 기판 크기에 따른 척킹력 및 기판 변형 특성 연구

  • Seong Bin Kim (Department Mechatronics Engineering, Graduate School of Korea University of Technology and Education) ;
  • Dong Kyun Min (School of Mechatronics Engineering, Korea University of Technology and Education)
  • 김성빈 (한국기술교육대학교대학원 메카트로닉스공학과) ;
  • 민동균 (한국기술교육대학교 메카트로닉스공학부)
  • Received : 2024.04.17
  • Accepted : 2024.06.21
  • Published : 2024.06.30
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Abstract

A Electrostatic chuck is a device that fixes the substrate, using the force between charges applied between two parallel plates to attract substrates such as wafers or OLED panels. Unlike mechanical suction methods, which rely on physical fixation, this method utilizes the force of electrostatics for fixation, making it important to verify the adhesion force. As the size of the substrate increases, deformations due to gravity or chucking force also increase, and the adhesion force decreases rapidly as the distance between the chuck and the substrate increases. The outlook for displays is shifting from small to large OLEDs, necessitating consideration of substrate deformations. In this paper, to confirm the deformation of the substrate through various patterns, a simplified 2D model using Ansys' electromagnetic field analysis program, Maxwell, and the static structural analysis program, Mechanical, was utilized to observe changes in adhesion force according to the variation in the air gap between the substrate and the chuck. Additionally, the chucking force was analyzed for the size of the substrate, and the deformation of the substrate was confirmed when gravity and chucking force act simultaneously.

Keywords

Acknowledgement

이 논문은 2023년도 한국기술교육대학교 연구제 지원에 의하여 연구되었음.

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