Fig. 1. Anode slime & anode copper.
Fig. 2. Diagram of experimental process.
Fig. 3. Leaching efficiency (%) as a function of the HNO3 concentration.
Fig. 4. Leaching efficiency (%) as a function of the reaction time.
Fig. 5. Photos of the Ag powders manufacturing. (a) AgCl precipitate, (b) Ag powder.
Fig. 6. Leaching efficiency (%) as a function of the aqua regia concentration.
Fig. 7. Adsorption efficiency of Au as a function of pH.
Fig. 8. Results of maximum absorption capacity experiments of ion exchange resin.
Fig. 9. Au desorption efficiency as a function of the ratio (Au loaded resin: desorption solution).
Fig. 10. Au recovery efficiency as a function of the amount of reducing agent.
Table 1. Average chemical composition of the prepared anode copper and slime
Table 2. Results of the Ag reduction experiments
Table 3. Chemical composition of produced Ag metal
Table 4. Desorption efficiency according to the types of desorption solutions
Table 5. Chemical composition of produced Au metal
References
- Buenkens, A. and Yang, J., 2014 : Recycling of WEEE plastics : a review, J. Mate Cycles Waste Manag, 16, pp.415-434. https://doi.org/10.1007/s10163-014-0241-2
- Han, Y. R. and Choi, Y. I., 2015 : A study on improvement of valuable metals leaching and distribution characteristics on waste PCBs (printed circuit boards) by using pulverization process, J. Environ. Sci. Int., 24(2), pp.245-251. https://doi.org/10.5322/JESI.2015.24.2.245
- Cui, J. and Zhang, L., 2008 : Metallurgical recovery of metals from electronic waste: A review, Journal of hazardous materials, 158(2), pp.228-256. https://doi.org/10.1016/j.jhazmat.2008.02.001
- Oh, J. H. and Kang, N. K., 2013 : Economical Review of the E-waste Recycling, J. Korean Inst. Resour. Recycl., 22(4), pp.12-21. https://doi.org/10.7844/KIRR.2013.22.4.12
- Jeong, J., et al., 2012 : Recycling Process for Metal Recovery from Waste Printed Circuit Boards, Applied Chemistry, 16(1), pp.77-80.
- Li, J., et al., 2010 : Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock, Journal of the Air & Waste Management Association, 60(2), pp.229-236. https://doi.org/10.3155/1047-3289.60.2.229
- Cui, J. and Forssberg, E., 2003 : Mechanical recycling of waste electric and electronic equipment: a review, Journal of hazardous materials, 99(3), pp.243-263. https://doi.org/10.1016/S0304-3894(03)00061-X
- Chiang, H. L., et al., 2007 : Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures, Journal of Hazardous Materials, 149(1), pp.151-159. https://doi.org/10.1016/j.jhazmat.2007.03.064
- Park, S., et al., 2015 : Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes, International Journal of Mineral Processing, 144, pp.11-15. https://doi.org/10.1016/j.minpro.2015.09.013
- Kwon, S., et al., 2016 : Separation of tantalum from electronic components on laptop printed circuit board assembly, Journal of the Korean Institute of Resources Recycling, 25(1), pp.24-30. https://doi.org/10.7844/kirr.2016.25.1.24
-
Yun, K. S., et al., 2005 : Preparation of Ag Powder from
$AgNO_3$ by Wet Chemical Reduction Method 1. The Establishment of Optimum Reaction System for the Preparation of Spherical Ag Powder, Journal of the Korean Powder Metallurgy Institute, 12(1), pp.56-63. https://doi.org/10.4150/KPMI.2005.12.1.056