Resources Recycling (자원리싸이클링)

The Korean Institute of Resources Recycling (한국자원리싸이클링학회)
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Manufacture of Dismantling Apparatus for Waste CPU Chip and Performance Evaluation

폐 CPU 칩의 해체장치 제작 및 성능 평가

  • Joe, Aram (Department of Earth Resources and Environmental Engineering, Hanyang University) ;
  • Park, Seungsoo (Department of Earth Resources and Environmental Engineering, Hanyang University) ;
  • Kim, Boram (Department of Earth Resources and Environmental Engineering, Hanyang University) ;
  • Park, Jaikoo (Department of Earth Resources and Environmental Engineering, Hanyang University)
  • 조아람 (한양대학교 자원환경공학과) ;
  • 박승수 (한양대학교 자원환경공학과) ;
  • 김보람 (한양대학교 자원환경공학과) ;
  • 박재구 (한양대학교 자원환경공학과)
  • Received : 2016.07.22
  • Accepted : 2016.10.27
  • Published : 2016.12.31
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Abstract

In this study, Au distribution in F-PGA chip and W-BGA chip were examined to recover Au effectively from CPU chips. The result showed that 80.8% and 89.8% of Au exist in terminal of F-PGA chip and bare die of W-BGA chip, respectively. Based on the fact that Au exists in specific parts of the chips, an CPU chip dismantling apparatus was developed. The experimental variables were roller rotating speed, heat temperature of IR heater and heating time. Terminals of F-PGA chips were completely recovered under the temperature of $300^{\circ}C$ and the residence time of 90 s. Bare dies of W-BGA chips were completely recovered as well under the temperature of $300^{\circ}C$, the roller rotating rate of 90 rpm and the residence time of 90 s.

본 연구에서는 F-PGA 타입의 CPU 칩과 W-BGA 타입의 CPU 칩을 대상으로 금(Au)의 함량 및 분포 상태를 확인하였다. 그 결과 F-PGA 칩의 경우, 금의 80.8%가 칩 터미널(terminal)부분에, W-BGA 칩의 경우에는 베어다이(bare die)에 금이 89.8% 편재되어 있는 것을 확인하였다. 이와 같이 대부분의 금이 칩의 특정 부분에 존재하는 사실로부터 CPU 칩의 해체장치를 고안하게 되었다. CPU 칩 해체실험의 조작변수는 롤러 회전속도, IR 히터의 가열 온도, 가열 시간으로 하였다. F-PGA 칩의 경우에는 가열 온도 $300^{\circ}C$, 가열 시간 90초 조건, 그리고 W-BGA 칩의 경우에는 롤러속도 90 rpm, 가열온도 $300^{\circ}C$, 가열 시간 180초 조건에서 칩 터미널과 베어다이를 각각 완전하게 분리/회수할 수 있었다.

Keywords

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