• Resources Recycling
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• v.25 no.6
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• pp.3-12
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• 2016

In this study, Au distribution in F-PGA chip and W-BGA chip were examined to recover Au effectively from CPU chips. The result showed that 80.8% and 89.8% of Au exist in terminal of F-PGA chip and bare die of W-BGA chip, respectively. Based on the fact that Au exists in specific parts of the chips, an CPU chip dismantling apparatus was developed. The experimental variables were roller rotating speed, heat temperature of IR heater and heating time. Terminals of F-PGA chips were completely recovered under the temperature of $300^{\circ}C$ and the residence time of 90 s. Bare dies of W-BGA chips were completely recovered as well under the temperature of $300^{\circ}C$, the roller rotating rate of 90 rpm and the residence time of 90 s.

• Electronics and Telecommunications Trends
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• v.35 no.2
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• pp.89-103
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Electronics and Telecommunications Trends
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• v.35 no.2
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• pp.120-136
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Electronics and Telecommunications Trends
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• v.35 no.2
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• pp.104-119
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• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Resources Recycling
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• v.25 no.1
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• pp.3-9
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• 2016

The leaching behavior of gold from waste CPU chip using Iodide/Iodine solution was studied. The direct leaching of gold with Iodide/Iodine solution for CPU chip under the size of 150 mesh showed leaching ratio of 20%. It was assumed that the copper film was produced on the gold particle during grinding process and the copper film prevents lodine/Iodide solution from contacting with leachable gold. Meanwhile, the extraction of gold was improved to 90% by pretreatment process with $HNO_3$ solution. In order to explain the result, EDS and ICP analysis for the leaching residue were conducted. It was found that the copper coated on the surface of the gold particle was removed about 80% by $HNO_3$, resulting in the increment of gold leaching rate.

• Journal of KIISE:Computer Systems and Theory
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• v.36 no.2
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• pp.102-110
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• 2009

The memory wall is the growing disparity of speed between CPU and memory outside the CPU chip. An economical solution is a memory hierarchy organized into several levels, such as processor registers, cache, main memory, disk storage. We introduce a novel memory hierarchy optimization technique in Linux based embedded systems using on-chip SRAM for the first time. The optimization technique allocates On-Chip SRAM to the code/data that selected by programmers by using virtual memory systems. Experiments performed with nine applications indicate that the runtime improvements can be achieved by up to 35%, with an average of 14%, and the energy consumption can be reduced by up to 40%, with an average of 15%.

• IEIE Transactions on Smart Processing and Computing
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• v.4 no.2
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• pp.65-70
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• 2015

In this paper, we describe the world's first real-time ray-tracing chip architecture. Ray-tracing technology generates high-quality 3D graphics images better than current rasterization technology by providing four essential light effects: shadow, reflection, refraction and transmission. The real-time ray-tracing chip named RayChip includes a real-time ray-tracing graphics processing unit and an accelerating tree-building unit. An ARM Ltd. central processing unit (CPU) and other peripherals are also included to support all processes of 3D graphics applications. Using the accelerating tree-building unit named RayTree to minimize the CPU load, the chip uses a low-end CPU and decreases both silicon area and power consumption. The evaluation results with RayChip show appropriate performance to support real-time ray tracing in high-definition (HD) resolution, while the rendered images are scaled to full HD resolution. The chip also integrates the Linux operating system and the familiar OpenGL for Embedded Systems application programming interface for easy application development.

• KIPS Transactions on Computer and Communication Systems
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• v.11 no.5
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• pp.133-138
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• 2022

Recently, as GPU performance has improved in HPC and artificial intelligence, its use is becoming more common, but GPU programming is still a big obstacle in terms of productivity. In particular, due to the difficulty of managing host memory and GPU memory separately, research is being actively conducted in terms of convenience and performance, and various CPU-GPU memory transfer programming methods are suggested. Meanwhile, recently many SoC (System on a Chip) products such as Apple M1 and NVIDIA Tegra that bundle CPU, GPU, and integrated memory into one large silicon package are emerging. In this study, data between CPU and GPU devices are used in such an integrated memory device and performance-related research is conducted during transmission. It shows different characteristics from the existing environment in which the host memory and GPU memory in the CPU are separated. Here, we want to compare performance by CPU-GPU data transmission method in NVIDIA SoC chips, which are integrated memory devices, and NVIDIA SMX-based V100 GPU devices. For the experimental workload for performance comparison, a two-dimensional matrix transposition example frequently used in HPC applications was used. We analyzed the following performance factors: the difference in GPU kernel performance according to the CPU-GPU memory transfer method for each GPU device, the transfer performance difference between page-locked memory and pageable memory, overall performance comparison, and performance comparison by workload size. Through this experiment, it was confirmed that the NVIDIA Xavier can maximize the benefits of integrated memory in the SoC chip by supporting I/O cache consistency.

• Journal of the Korean Institute of Telematics and Electronics
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• v.14 no.4
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• pp.1-8
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• 1977

Microprocessor which is opened to the user, not fixed in CPU chip, has been appeared. In this Paper, Microprogram and Mapping Array designed to make functions of NOVA-01 emulate to $\mu$COM-16.

• Proceedings of the IEEK Conference
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• 2001.06a
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• pp.253-256
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• 2001

This paper describes a high speed MAC(Media Access Control) function chip for IEEE 802.11 MAC layer protocol. The MAC chip has control registers and interrupt scheme for interface with CPU and deals with transmission/reception of data as a unit of frame. The developed MAC chip is composed of protocol control block, transmission block, and reception block which supports the BCF function in IEEE 802.11 specification. The test suite which is adopted in order to verify operation of the MAC chip includes various functions, such as RTS-CTS frame exchange procedure, correct IFS(Inter Frame Space)timing, access procedure, random backoff procedure, retransmission procedure, fragmented frame transmission/reception procedure, duplicate reception frame detection, NAV(Network Allocation Vector), reception error processing, broadcast frame transmission/reception procedure, beacon frame transmission/reception procedure, and transmission/reception FIEO operation. By using this technique, it is possible to reduce the load of CPU and firmware size in high speed wireless LAN system.