Composites Research

The Korean Society for Composite Materials (한국복합재료학회)
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Nanoindentation on the Layered Ag/Cu for Investigating Slip of Misfit Dislocation

나노인덴테이션 해석을 통한 Ag/Cu층에서 발생하는 Misfit 전위의 slip 특성에 대한 연구

  • Trandinh, Long (Division of Mechanical and Automotive Engineering, Kongju National University) ;
  • Ryu, Yong-Moon (Korea Automotive Technology Institute) ;
  • Cheon, Seong-Sik (Division of Mechanical and Automotive Engineering, Kongju National University)
  • Published : 2011.06.30
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Abstract

The EAM simulation of nanoindentation was performed to investigate misfit dislocation slip in the Ag/Cu. The film layer, whose thickness in the range of 2-5nm, was indented by a spherical indenter with the N$\'{o}$se-Hoover thermostat condition. The simulation shows that the indentation position relative to misfit dislocation (MFD) has the effect on the dislocation, glide up or cross slip, for Ag film layer thickness less than 4 nm. Elastic energy variation during MFDs slip was revealed to be a key factor for the softening of Ag/Cu. The critical film layer thickness was evaluated for each case of Ag/Cu according to the spline extrapolation technique.

Ag/Cu층에서 발생하는 misfit 전위를 분석하기 위하여, EAM기법을 활용한 나노인덴테이션 해석을 수행하였다. N$\'{o}$se-Hoover 서모스텟 조건에 의거하여, 2-5nm 정도의 두께를 갖는 필름층에 구형 인덴터로 압입하였다. 해석결과는 misfit 전위에 대한 상대적인 압입위치가, 4nm이하의 필름에 대하여 영향을 미치는 것으로 나타났다. 전위에 의한 슬립 발생할 때 탄성에너지 변화는 Ag/Cu의 연화의 중요한 변수로 작용하며, 각각의 경우에 대하여 임계필름두께에 대해서도 고찰하였다.

Keywords

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