• Composites Research
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• v.24 no.3
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• pp.17-24
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• 2011

The EAM simulation of nanoindentation was performed to investigate misfit dislocation slip in the Ag/Cu. The film layer, whose thickness in the range of 2-5nm, was indented by a spherical indenter with the N$\'{o}$se-Hoover thermostat condition. The simulation shows that the indentation position relative to misfit dislocation (MFD) has the effect on the dislocation, glide up or cross slip, for Ag film layer thickness less than 4 nm. Elastic energy variation during MFDs slip was revealed to be a key factor for the softening of Ag/Cu. The critical film layer thickness was evaluated for each case of Ag/Cu according to the spline extrapolation technique.